JP7039162B2 - 光照射装置及び画像形成装置 - Google Patents

光照射装置及び画像形成装置 Download PDF

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Publication number
JP7039162B2
JP7039162B2 JP2016136820A JP2016136820A JP7039162B2 JP 7039162 B2 JP7039162 B2 JP 7039162B2 JP 2016136820 A JP2016136820 A JP 2016136820A JP 2016136820 A JP2016136820 A JP 2016136820A JP 7039162 B2 JP7039162 B2 JP 7039162B2
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JP
Japan
Prior art keywords
circuit board
support portion
conductive pattern
light
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016136820A
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English (en)
Japanese (ja)
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JP2018010893A (ja
JP2018010893A5 (https=
Inventor
純 平林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2016136820A priority Critical patent/JP7039162B2/ja
Priority to US15/631,234 priority patent/US10502369B2/en
Publication of JP2018010893A publication Critical patent/JP2018010893A/ja
Publication of JP2018010893A5 publication Critical patent/JP2018010893A5/ja
Application granted granted Critical
Publication of JP7039162B2 publication Critical patent/JP7039162B2/ja
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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0064—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Discharging, Photosensitive Material Shape In Electrophotography (AREA)
  • Structure Of Printed Boards (AREA)
  • Led Device Packages (AREA)
  • Facsimile Heads (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
JP2016136820A 2016-07-11 2016-07-11 光照射装置及び画像形成装置 Active JP7039162B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2016136820A JP7039162B2 (ja) 2016-07-11 2016-07-11 光照射装置及び画像形成装置
US15/631,234 US10502369B2 (en) 2016-07-11 2017-06-23 Circuit board and image forming apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016136820A JP7039162B2 (ja) 2016-07-11 2016-07-11 光照射装置及び画像形成装置

Publications (3)

Publication Number Publication Date
JP2018010893A JP2018010893A (ja) 2018-01-18
JP2018010893A5 JP2018010893A5 (https=) 2019-08-22
JP7039162B2 true JP7039162B2 (ja) 2022-03-22

Family

ID=60892728

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016136820A Active JP7039162B2 (ja) 2016-07-11 2016-07-11 光照射装置及び画像形成装置

Country Status (2)

Country Link
US (1) US10502369B2 (https=)
JP (1) JP7039162B2 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6906906B2 (ja) 2016-06-30 2021-07-21 キヤノン株式会社 回路基板及び画像形成装置
JP6866231B2 (ja) 2017-05-18 2021-04-28 キヤノン株式会社 電源装置及び画像形成装置
JP6953176B2 (ja) 2017-05-18 2021-10-27 キヤノン株式会社 電源装置及び画像形成装置
JP7066538B2 (ja) 2018-06-07 2022-05-13 キヤノン株式会社 電源装置及び画像形成装置
JP7353809B2 (ja) 2019-06-14 2023-10-02 キヤノン株式会社 電源装置及び画像形成装置
CN119730011A (zh) * 2023-09-26 2025-03-28 佳能株式会社 印刷电路板、光学传感器、以及图像形成装置

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005209535A (ja) 2004-01-23 2005-08-04 Koito Mfg Co Ltd 灯具
JP2005215020A (ja) 2004-01-27 2005-08-11 Oki Data Corp 画像形成装置
JP2006310653A (ja) 2005-04-28 2006-11-09 Toyoda Gosei Co Ltd Ｌｅｄランプ、および基板搭載部品の実装方法
JP2007188955A (ja) 2006-01-11 2007-07-26 New Paradigm Technology Inc 発光素子組込み発光フィルム
JP2007235011A (ja) 2006-03-03 2007-09-13 Funai Electric Co Ltd 配線基板
US20080135869A1 (en) 2006-12-06 2008-06-12 Chipmos Technologies Inc. Light emitting chip package and light source module
JP3146901U (ja) 2008-09-25 2008-12-04 賢智電子股▲分▼有限公司 発光ダイオード用フレキシブル薄型回路基板及びこれを応用して形成した発光ダイオードライトバー
JP2009049239A (ja) 2007-08-21 2009-03-05 Citizen Electronics Co Ltd Ｌｅｄ発光装置
JP2009230984A (ja) 2008-03-21 2009-10-08 Koizumi Lighting Technology Corp レンズ、レンズ装着基材、および照明装置
JP2014017356A (ja) 2012-07-09 2014-01-30 Nichia Chem Ind Ltd 発光装置
JP2015026778A (ja) 2013-07-29 2015-02-05 株式会社サンネクト 面発光体ユニット及びユニット連結具
JP2015038971A (ja) 2013-07-16 2015-02-26 パナソニックＩｐマネジメント株式会社 基板、発光装置、照明用光源、および照明装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10133026A (ja) * 1996-10-31 1998-05-22 Canon Inc 導光体を有する照明装置
JPWO2008029776A1 (ja) * 2006-09-04 2010-01-21 東レ株式会社 光透過性電磁波シールド部材およびその製造方法
US8093803B2 (en) * 2009-03-17 2012-01-10 Seiko Epson Corporation Electro-optical device, electronic device, and method for manufacturing electro-optical device
JP5754961B2 (ja) 2011-02-03 2015-07-29 キヤノン株式会社 画像形成装置
JP6045249B2 (ja) 2012-08-10 2016-12-14 キヤノン株式会社 電源装置及び画像形成装置
JP6161374B2 (ja) 2013-04-05 2017-07-12 キヤノン株式会社 電源装置及び画像形成装置
US9904232B2 (en) 2015-02-18 2018-02-27 Canon Kabushiki Kaisha Power supply apparatus and image forming apparatus

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005209535A (ja) 2004-01-23 2005-08-04 Koito Mfg Co Ltd 灯具
JP2005215020A (ja) 2004-01-27 2005-08-11 Oki Data Corp 画像形成装置
JP2006310653A (ja) 2005-04-28 2006-11-09 Toyoda Gosei Co Ltd Ｌｅｄランプ、および基板搭載部品の実装方法
JP2007188955A (ja) 2006-01-11 2007-07-26 New Paradigm Technology Inc 発光素子組込み発光フィルム
JP2007235011A (ja) 2006-03-03 2007-09-13 Funai Electric Co Ltd 配線基板
US20080135869A1 (en) 2006-12-06 2008-06-12 Chipmos Technologies Inc. Light emitting chip package and light source module
JP2009049239A (ja) 2007-08-21 2009-03-05 Citizen Electronics Co Ltd Ｌｅｄ発光装置
JP2009230984A (ja) 2008-03-21 2009-10-08 Koizumi Lighting Technology Corp レンズ、レンズ装着基材、および照明装置
JP3146901U (ja) 2008-09-25 2008-12-04 賢智電子股▲分▼有限公司 発光ダイオード用フレキシブル薄型回路基板及びこれを応用して形成した発光ダイオードライトバー
JP2014017356A (ja) 2012-07-09 2014-01-30 Nichia Chem Ind Ltd 発光装置
JP2015038971A (ja) 2013-07-16 2015-02-26 パナソニックＩｐマネジメント株式会社 基板、発光装置、照明用光源、および照明装置
JP2015026778A (ja) 2013-07-29 2015-02-05 株式会社サンネクト 面発光体ユニット及びユニット連結具

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US10502369B2 (en) 2019-12-10
JP2018010893A (ja) 2018-01-18
US20180010739A1 (en) 2018-01-11

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