JP7034946B2 - 回路基板の製造方法 - Google Patents

回路基板の製造方法 Download PDF

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Publication number
JP7034946B2
JP7034946B2 JP2018560474A JP2018560474A JP7034946B2 JP 7034946 B2 JP7034946 B2 JP 7034946B2 JP 2018560474 A JP2018560474 A JP 2018560474A JP 2018560474 A JP2018560474 A JP 2018560474A JP 7034946 B2 JP7034946 B2 JP 7034946B2
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Japan
Prior art keywords
copper foil
sheet
plane
foil sheet
planar
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JP2018560474A
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English (en)
Japanese (ja)
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JP2019518330A5 (enExample
JP2019518330A (ja
Inventor
マイケル・ゲイ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Isola USA Corp
Original Assignee
Isola USA Corp
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Publication of JP2019518330A publication Critical patent/JP2019518330A/ja
Publication of JP2019518330A5 publication Critical patent/JP2019518330A5/ja
Priority to JP2021165553A priority Critical patent/JP7608310B2/ja
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Publication of JP7034946B2 publication Critical patent/JP7034946B2/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0242—Structural details of individual signal conductors, e.g. related to the skin effect
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0373—Conductors having a fine structure, e.g. providing a plurality of contact points with a structured tool
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)
JP2018560474A 2016-05-18 2017-05-18 回路基板の製造方法 Active JP7034946B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2021165553A JP7608310B2 (ja) 2016-05-18 2021-10-07 回路基板の製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662337979P 2016-05-18 2016-05-18
US62/337,979 2016-05-18
PCT/US2017/033342 WO2017201294A2 (en) 2016-05-18 2017-05-18 Method of manufacturing circuit boards

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2021165553A Division JP7608310B2 (ja) 2016-05-18 2021-10-07 回路基板の製造方法

Publications (3)

Publication Number Publication Date
JP2019518330A JP2019518330A (ja) 2019-06-27
JP2019518330A5 JP2019518330A5 (enExample) 2019-12-19
JP7034946B2 true JP7034946B2 (ja) 2022-03-14

Family

ID=60326555

Family Applications (2)

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JP2018560474A Active JP7034946B2 (ja) 2016-05-18 2017-05-18 回路基板の製造方法
JP2021165553A Active JP7608310B2 (ja) 2016-05-18 2021-10-07 回路基板の製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2021165553A Active JP7608310B2 (ja) 2016-05-18 2021-10-07 回路基板の製造方法

Country Status (9)

Country Link
US (1) US20180279481A1 (enExample)
EP (1) EP3459327A2 (enExample)
JP (2) JP7034946B2 (enExample)
KR (3) KR20210099192A (enExample)
CN (2) CN109479377A (enExample)
CA (1) CA3024136A1 (enExample)
MY (1) MY195558A (enExample)
SG (1) SG11201810064PA (enExample)
WO (1) WO2017201294A2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12336092B2 (en) 2016-03-09 2025-06-17 Lg Innotek Co., Ltd. Circuit board, lens driving device, and camera module including the same
CN111901985A (zh) * 2020-05-25 2020-11-06 重庆星轨科技有限公司 一种基于微波电路板的复合层压方法
KR20240001628A (ko) * 2022-06-27 2024-01-03 엘지이노텍 주식회사 회로 기판 및 이를 포함하는 반도체 패키지

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006148078A (ja) 2004-11-19 2006-06-08 Endicott Interconnect Technologies Inc 平滑な側面を有する導電層を一部として使用する回路基板、その製造方法、ならびにこの回路基板を使用する電気組立体および情報処理システム
JP2007507616A (ja) 2003-09-30 2007-03-29 アトテック・ドイチュラント・ゲーエムベーハー 銅および混合金属回路の微細粗面化処理のための改良された方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6042711A (en) * 1991-06-28 2000-03-28 Gould Electronics, Inc. Metal foil with improved peel strength and method for making said foil
ATE193176T1 (de) * 1993-03-05 2000-06-15 Polyclad Laminates Inc Trommelseite-behandelte metallfolie und laminat zur verwendung in leiterplatten und verfahren zur herstellung
US5622782A (en) 1993-04-27 1997-04-22 Gould Inc. Foil with adhesion promoting layer derived from silane mixture
TW326423B (en) * 1993-08-06 1998-02-11 Gould Inc Metallic foil with adhesion promoting layer
JPH07115268A (ja) * 1993-10-20 1995-05-02 Matsushita Electric Ind Co Ltd プリント配線板及びその製造方法
TW324737B (en) 1994-03-30 1998-01-11 Gould Wlectronics Inc Epoxy adhesive composition and copper foil and laminate using the same
TW289900B (enExample) * 1994-04-22 1996-11-01 Gould Electronics Inc
US5614324A (en) * 1995-07-24 1997-03-25 Gould Electronics Inc. Multi-layer structures containing a silane adhesion promoting layer
US6299721B1 (en) * 1998-12-14 2001-10-09 Gould Electronics Incl Coatings for improved resin dust resistance
JP3291482B2 (ja) * 1999-08-31 2002-06-10 三井金属鉱業株式会社 整面電解銅箔、その製造方法および用途
JP3291486B2 (ja) * 1999-09-06 2002-06-10 三井金属鉱業株式会社 整面電解銅箔、その製造方法およびその用途
US6964884B1 (en) * 2004-11-19 2005-11-15 Endicott Interconnect Technologies, Inc. Circuitized substrates utilizing three smooth-sided conductive layers as part thereof, method of making same, and electrical assemblies and information handling systems utilizing same
JP5463117B2 (ja) * 2009-10-20 2014-04-09 株式会社日立製作所 低損失配線板，多層配線板、それに用いる銅箔及び積層板
KR101958394B1 (ko) 2011-11-08 2019-03-14 에스케이하이닉스 주식회사 반도체 장치
JP2016141015A (ja) * 2015-01-30 2016-08-08 パナソニックＩｐマネジメント株式会社 両面金属張積層板及びその製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007507616A (ja) 2003-09-30 2007-03-29 アトテック・ドイチュラント・ゲーエムベーハー 銅および混合金属回路の微細粗面化処理のための改良された方法
JP2006148078A (ja) 2004-11-19 2006-06-08 Endicott Interconnect Technologies Inc 平滑な側面を有する導電層を一部として使用する回路基板、その製造方法、ならびにこの回路基板を使用する電気組立体および情報処理システム

Also Published As

Publication number Publication date
WO2017201294A3 (en) 2017-12-28
KR20190008923A (ko) 2019-01-25
CN117119695A (zh) 2023-11-24
US20180279481A1 (en) 2018-09-27
CA3024136A1 (en) 2017-11-23
SG11201810064PA (en) 2018-12-28
WO2017201294A2 (en) 2017-11-23
JP2022008960A (ja) 2022-01-14
CN109479377A (zh) 2019-03-15
JP2019518330A (ja) 2019-06-27
KR20240134235A (ko) 2024-09-06
EP3459327A2 (en) 2019-03-27
MY195558A (en) 2023-02-01
KR20210099192A (ko) 2021-08-11
JP7608310B2 (ja) 2025-01-06

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