CN109479377A - 电路板的制造方法 - Google Patents

电路板的制造方法 Download PDF

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Publication number
CN109479377A
CN109479377A CN201780030925.2A CN201780030925A CN109479377A CN 109479377 A CN109479377 A CN 109479377A CN 201780030925 A CN201780030925 A CN 201780030925A CN 109479377 A CN109479377 A CN 109479377A
Authority
CN
China
Prior art keywords
flat
copper foil
copper
flat surfaces
circuit pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201780030925.2A
Other languages
English (en)
Chinese (zh)
Inventor
M·盖伊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Isola USA Corp
Original Assignee
Isola USA Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Isola USA Corp filed Critical Isola USA Corp
Priority to CN202310554145.5A priority Critical patent/CN117119695A/zh
Publication of CN109479377A publication Critical patent/CN109479377A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0242—Structural details of individual signal conductors, e.g. related to the skin effect
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0373—Conductors having a fine structure, e.g. providing a plurality of contact points with a structured tool
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)
CN201780030925.2A 2016-05-18 2017-05-18 电路板的制造方法 Pending CN109479377A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310554145.5A CN117119695A (zh) 2016-05-18 2017-05-18 电路板的制造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662337979P 2016-05-18 2016-05-18
US62/337,979 2016-05-18
PCT/US2017/033342 WO2017201294A2 (en) 2016-05-18 2017-05-18 Method of manufacturing circuit boards

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN202310554145.5A Division CN117119695A (zh) 2016-05-18 2017-05-18 电路板的制造方法

Publications (1)

Publication Number Publication Date
CN109479377A true CN109479377A (zh) 2019-03-15

Family

ID=60326555

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201780030925.2A Pending CN109479377A (zh) 2016-05-18 2017-05-18 电路板的制造方法
CN202310554145.5A Pending CN117119695A (zh) 2016-05-18 2017-05-18 电路板的制造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN202310554145.5A Pending CN117119695A (zh) 2016-05-18 2017-05-18 电路板的制造方法

Country Status (9)

Country Link
US (1) US20180279481A1 (enExample)
EP (1) EP3459327A2 (enExample)
JP (2) JP7034946B2 (enExample)
KR (3) KR20240134235A (enExample)
CN (2) CN109479377A (enExample)
CA (1) CA3024136A1 (enExample)
MY (1) MY195558A (enExample)
SG (1) SG11201810064PA (enExample)
WO (1) WO2017201294A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111901985A (zh) * 2020-05-25 2020-11-06 重庆星轨科技有限公司 一种基于微波电路板的复合层压方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12336092B2 (en) 2016-03-09 2025-06-17 Lg Innotek Co., Ltd. Circuit board, lens driving device, and camera module including the same
KR20240001628A (ko) * 2022-06-27 2024-01-03 엘지이노텍 주식회사 회로 기판 및 이를 포함하는 반도체 패키지

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1106977A (zh) * 1993-08-06 1995-08-16 古尔德电子有限公司 具有促进粘着层的金属箔
CN1289225A (zh) * 1999-08-31 2001-03-28 三井金属鉱业株式会社 经表面加工的电沉积铜箔及其制造方法和用途
US20050067378A1 (en) * 2003-09-30 2005-03-31 Harry Fuerhaupter Method for micro-roughening treatment of copper and mixed-metal circuitry
CN1805125A (zh) * 2004-11-19 2006-07-19 安迪克连接科技公司 电路化衬底与制造其之方法、电组合件以及信息处理系统
US20110088933A1 (en) * 2009-10-20 2011-04-21 Satoru Amou Low dielectric loss wiring board, multilayer wiring board, copper foil and laminate

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6042711A (en) * 1991-06-28 2000-03-28 Gould Electronics, Inc. Metal foil with improved peel strength and method for making said foil
WO1994021097A2 (en) * 1993-03-05 1994-09-15 Polyclad Laminates, Inc. Drum-side treated metal foil and laminate for use in printed circuit boards and methods of manufacture
US5622782A (en) 1993-04-27 1997-04-22 Gould Inc. Foil with adhesion promoting layer derived from silane mixture
JPH07115268A (ja) * 1993-10-20 1995-05-02 Matsushita Electric Ind Co Ltd プリント配線板及びその製造方法
TW324737B (en) 1994-03-30 1998-01-11 Gould Wlectronics Inc Epoxy adhesive composition and copper foil and laminate using the same
TW289900B (enExample) * 1994-04-22 1996-11-01 Gould Electronics Inc
US5614324A (en) * 1995-07-24 1997-03-25 Gould Electronics Inc. Multi-layer structures containing a silane adhesion promoting layer
US6299721B1 (en) * 1998-12-14 2001-10-09 Gould Electronics Incl Coatings for improved resin dust resistance
JP3291486B2 (ja) * 1999-09-06 2002-06-10 三井金属鉱業株式会社 整面電解銅箔、その製造方法およびその用途
US6964884B1 (en) * 2004-11-19 2005-11-15 Endicott Interconnect Technologies, Inc. Circuitized substrates utilizing three smooth-sided conductive layers as part thereof, method of making same, and electrical assemblies and information handling systems utilizing same
KR101958394B1 (ko) 2011-11-08 2019-03-14 에스케이하이닉스 주식회사 반도체 장치
JP2016141015A (ja) * 2015-01-30 2016-08-08 パナソニックＩｐマネジメント株式会社 両面金属張積層板及びその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1106977A (zh) * 1993-08-06 1995-08-16 古尔德电子有限公司 具有促进粘着层的金属箔
CN1289225A (zh) * 1999-08-31 2001-03-28 三井金属鉱业株式会社 经表面加工的电沉积铜箔及其制造方法和用途
US20050067378A1 (en) * 2003-09-30 2005-03-31 Harry Fuerhaupter Method for micro-roughening treatment of copper and mixed-metal circuitry
CN1805125A (zh) * 2004-11-19 2006-07-19 安迪克连接科技公司 电路化衬底与制造其之方法、电组合件以及信息处理系统
US20110088933A1 (en) * 2009-10-20 2011-04-21 Satoru Amou Low dielectric loss wiring board, multilayer wiring board, copper foil and laminate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111901985A (zh) * 2020-05-25 2020-11-06 重庆星轨科技有限公司 一种基于微波电路板的复合层压方法

Also Published As

Publication number Publication date
JP7034946B2 (ja) 2022-03-14
KR20190008923A (ko) 2019-01-25
CA3024136A1 (en) 2017-11-23
MY195558A (en) 2023-02-01
CN117119695A (zh) 2023-11-24
JP7608310B2 (ja) 2025-01-06
KR20240134235A (ko) 2024-09-06
KR20210099192A (ko) 2021-08-11
EP3459327A2 (en) 2019-03-27
WO2017201294A2 (en) 2017-11-23
JP2019518330A (ja) 2019-06-27
WO2017201294A3 (en) 2017-12-28
US20180279481A1 (en) 2018-09-27
SG11201810064PA (en) 2018-12-28
JP2022008960A (ja) 2022-01-14

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Legal Events

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PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20190315