MY195558A - Method Of Manufacturing Circuit Boards - Google Patents

Method Of Manufacturing Circuit Boards

Info

Publication number
MY195558A
MY195558A MYPI2018001944A MYPI2018001944A MY195558A MY 195558 A MY195558 A MY 195558A MY PI2018001944 A MYPI2018001944 A MY PI2018001944A MY PI2018001944 A MYPI2018001944 A MY PI2018001944A MY 195558 A MY195558 A MY 195558A
Authority
MY
Malaysia
Prior art keywords
circuit boards
manufacturing circuit
circuits
manufacturing
laminates
Prior art date
Application number
MYPI2018001944A
Other languages
English (en)
Inventor
Michael Gay
Original Assignee
Isola Usa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Isola Usa Corp filed Critical Isola Usa Corp
Publication of MY195558A publication Critical patent/MY195558A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0242—Structural details of individual signal conductors, e.g. related to the skin effect
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0373—Conductors having a fine structure, e.g. providing a plurality of contact points with a structured tool
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)
MYPI2018001944A 2016-05-18 2017-05-18 Method Of Manufacturing Circuit Boards MY195558A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201662337979P 2016-05-18 2016-05-18
PCT/US2017/033342 WO2017201294A2 (en) 2016-05-18 2017-05-18 Method of manufacturing circuit boards

Publications (1)

Publication Number Publication Date
MY195558A true MY195558A (en) 2023-02-01

Family

ID=60326555

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2018001944A MY195558A (en) 2016-05-18 2017-05-18 Method Of Manufacturing Circuit Boards

Country Status (9)

Country Link
US (1) US20180279481A1 (enExample)
EP (1) EP3459327A2 (enExample)
JP (2) JP7034946B2 (enExample)
KR (3) KR20210099192A (enExample)
CN (2) CN109479377A (enExample)
CA (1) CA3024136A1 (enExample)
MY (1) MY195558A (enExample)
SG (1) SG11201810064PA (enExample)
WO (1) WO2017201294A2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12336092B2 (en) 2016-03-09 2025-06-17 Lg Innotek Co., Ltd. Circuit board, lens driving device, and camera module including the same
CN111901985A (zh) * 2020-05-25 2020-11-06 重庆星轨科技有限公司 一种基于微波电路板的复合层压方法
KR20240001628A (ko) * 2022-06-27 2024-01-03 엘지이노텍 주식회사 회로 기판 및 이를 포함하는 반도체 패키지

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6042711A (en) * 1991-06-28 2000-03-28 Gould Electronics, Inc. Metal foil with improved peel strength and method for making said foil
ATE193176T1 (de) * 1993-03-05 2000-06-15 Polyclad Laminates Inc Trommelseite-behandelte metallfolie und laminat zur verwendung in leiterplatten und verfahren zur herstellung
US5622782A (en) 1993-04-27 1997-04-22 Gould Inc. Foil with adhesion promoting layer derived from silane mixture
TW326423B (en) * 1993-08-06 1998-02-11 Gould Inc Metallic foil with adhesion promoting layer
JPH07115268A (ja) * 1993-10-20 1995-05-02 Matsushita Electric Ind Co Ltd プリント配線板及びその製造方法
TW324737B (en) 1994-03-30 1998-01-11 Gould Wlectronics Inc Epoxy adhesive composition and copper foil and laminate using the same
TW289900B (enExample) * 1994-04-22 1996-11-01 Gould Electronics Inc
US5614324A (en) * 1995-07-24 1997-03-25 Gould Electronics Inc. Multi-layer structures containing a silane adhesion promoting layer
US6299721B1 (en) * 1998-12-14 2001-10-09 Gould Electronics Incl Coatings for improved resin dust resistance
JP3291482B2 (ja) * 1999-08-31 2002-06-10 三井金属鉱業株式会社 整面電解銅箔、その製造方法および用途
JP3291486B2 (ja) * 1999-09-06 2002-06-10 三井金属鉱業株式会社 整面電解銅箔、その製造方法およびその用途
US20050067378A1 (en) * 2003-09-30 2005-03-31 Harry Fuerhaupter Method for micro-roughening treatment of copper and mixed-metal circuitry
US7383629B2 (en) * 2004-11-19 2008-06-10 Endicott Interconnect Technologies, Inc. Method of making circuitized substrates utilizing smooth-sided conductive layers as part thereof
US6964884B1 (en) * 2004-11-19 2005-11-15 Endicott Interconnect Technologies, Inc. Circuitized substrates utilizing three smooth-sided conductive layers as part thereof, method of making same, and electrical assemblies and information handling systems utilizing same
JP5463117B2 (ja) * 2009-10-20 2014-04-09 株式会社日立製作所 低損失配線板，多層配線板、それに用いる銅箔及び積層板
KR101958394B1 (ko) 2011-11-08 2019-03-14 에스케이하이닉스 주식회사 반도체 장치
JP2016141015A (ja) * 2015-01-30 2016-08-08 パナソニックＩｐマネジメント株式会社 両面金属張積層板及びその製造方法

Also Published As

Publication number Publication date
WO2017201294A3 (en) 2017-12-28
JP7034946B2 (ja) 2022-03-14
KR20190008923A (ko) 2019-01-25
CN117119695A (zh) 2023-11-24
US20180279481A1 (en) 2018-09-27
CA3024136A1 (en) 2017-11-23
SG11201810064PA (en) 2018-12-28
WO2017201294A2 (en) 2017-11-23
JP2022008960A (ja) 2022-01-14
CN109479377A (zh) 2019-03-15
JP2019518330A (ja) 2019-06-27
KR20240134235A (ko) 2024-09-06
EP3459327A2 (en) 2019-03-27
KR20210099192A (ko) 2021-08-11
JP7608310B2 (ja) 2025-01-06

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