TWI799555B - 絕緣電路基板用接合體的製造方法及絕緣電路基板用接合體 - Google Patents

絕緣電路基板用接合體的製造方法及絕緣電路基板用接合體 Download PDF

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Publication number
TWI799555B
TWI799555B TW108110463A TW108110463A TWI799555B TW I799555 B TWI799555 B TW I799555B TW 108110463 A TW108110463 A TW 108110463A TW 108110463 A TW108110463 A TW 108110463A TW I799555 B TWI799555 B TW I799555B
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TW
Taiwan
Prior art keywords
circuit board
junction
insulated circuit
producing
insulated
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TW108110463A
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English (en)
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TW201941374A (zh
Inventor
湯本遼平
大開智哉
北原丈嗣
長友義幸
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日商三菱綜合材料股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/562—Protection against mechanical damage
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4857—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/142—Metallic substrates having insulating layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0341—Intermediate metal, e.g. before reinforcing of conductors by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0379—Stacked conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW108110463A 2018-03-26 2019-03-26 絕緣電路基板用接合體的製造方法及絕緣電路基板用接合體 TWI799555B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018058136 2018-03-26
JP2018-058136 2018-03-26

Publications (2)

Publication Number Publication Date
TW201941374A TW201941374A (zh) 2019-10-16
TWI799555B true TWI799555B (zh) 2023-04-21

Family

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TW108110463A TWI799555B (zh) 2018-03-26 2019-03-26 絕緣電路基板用接合體的製造方法及絕緣電路基板用接合體

Country Status (7)

Country Link
US (2) US11289400B2 (zh)
EP (1) EP3780087A4 (zh)
JP (1) JP7060084B2 (zh)
KR (1) KR20200138262A (zh)
CN (1) CN111819682A (zh)
TW (1) TWI799555B (zh)
WO (1) WO2019188885A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2020129863A1 (ja) * 2018-12-21 2021-11-25 日本発條株式会社 接合方法および接合体
MX2021013417A (es) 2019-05-04 2021-12-10 Inhibrx Inc Polipeptidos de union a la proteina del miembro a de la familia 12 del dominio de lectina tipo c (clec12a) y sus usos.
JPWO2021193528A1 (zh) * 2020-03-24 2021-09-30
JP2023147241A (ja) * 2022-03-29 2023-10-12 株式会社プロテリアル セラミックス基板

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015170825A (ja) * 2014-03-10 2015-09-28 三菱マテリアル株式会社 放熱板付パワーモジュール用基板の製造方法
JP2015211125A (ja) * 2014-04-25 2015-11-24 三菱マテリアル株式会社 パワーモジュール用基板及びヒートシンク付パワーモジュール用基板並びにヒートシンク付パワーモジュール
TW201626513A (zh) * 2014-07-04 2016-07-16 Mitsubishi Materials Corp 功率模組用基板單元及功率模組

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4488733B2 (ja) * 2003-12-24 2010-06-23 三洋電機株式会社 回路基板の製造方法および混成集積回路装置の製造方法。
JP4978221B2 (ja) 2007-02-05 2012-07-18 三菱マテリアル株式会社 回路基板の製造装置及び製造方法、その製造方法に用いられるクッションシート
JP5637719B2 (ja) 2010-03-31 2014-12-10 Ｄｏｗａメタルテック株式会社 金属セラミックス接合回路基板の製造方法
JP5593936B2 (ja) 2010-08-04 2014-09-24 三菱マテリアル株式会社 パワーモジュール用基板の製造装置および製造方法
JP5403129B2 (ja) * 2012-03-30 2014-01-29 三菱マテリアル株式会社 パワーモジュール用基板、ヒートシンク付パワーモジュール用基板、パワーモジュール、及びパワーモジュール用基板の製造方法
US9299630B2 (en) * 2012-07-30 2016-03-29 General Electric Company Diffusion barrier for surface mount modules
KR102146589B1 (ko) * 2012-10-16 2020-08-20 미쓰비시 마테리알 가부시키가이샤 히트싱크가 부착된 파워 모듈용 기판, 히트싱크가 부착된 파워 모듈, 및 히트싱크가 부착된 파워 모듈용 기판의 제조 방법
JP6307832B2 (ja) * 2013-01-22 2018-04-11 三菱マテリアル株式会社 パワーモジュール用基板、ヒートシンク付パワーモジュール用基板、ヒートシンク付パワーモジュール
CN105189109B (zh) * 2013-03-14 2017-04-05 三菱综合材料株式会社 接合体、功率模块用基板及自带散热器的功率模块用基板
JP5672324B2 (ja) * 2013-03-18 2015-02-18 三菱マテリアル株式会社 接合体の製造方法及びパワーモジュール用基板の製造方法
CN105580131B (zh) * 2013-10-10 2021-03-12 三菱综合材料株式会社 自带散热器的功率模块用基板及其制造方法
JP6201828B2 (ja) 2014-03-10 2017-09-27 三菱マテリアル株式会社 放熱板付パワーモジュール用基板の製造方法
KR102300970B1 (ko) * 2014-07-02 2021-09-09 미쓰비시 마테리알 가부시키가이샤 접합체의 제조 방법, 다층 접합체의 제조 방법, 파워 모듈용 기판의 제조 방법, 히트 싱크가 부착된 파워 모듈용 기판의 제조 방법 및 적층체의 제조 장치
CN106463477B (zh) * 2014-07-04 2019-03-12 三菱综合材料株式会社 功率模块用基板单元及功率模块
JP6396703B2 (ja) 2014-07-08 2018-09-26 トヨタ自動車株式会社 半導体素子用放熱部品の製造方法
JP6432466B2 (ja) * 2014-08-26 2018-12-05 三菱マテリアル株式会社 接合体、ヒートシンク付パワーモジュール用基板、ヒートシンク、接合体の製造方法、ヒートシンク付パワーモジュール用基板の製造方法、及び、ヒートシンクの製造方法
JP6432465B2 (ja) * 2014-08-26 2018-12-05 三菱マテリアル株式会社 接合体、ヒートシンク付パワーモジュール用基板、ヒートシンク、接合体の製造方法、ヒートシンク付パワーモジュール用基板の製造方法、及び、ヒートシンクの製造方法
JP6455056B2 (ja) 2014-10-01 2019-01-23 三菱マテリアル株式会社 ヒートシンク付パワーモジュール用基板の製造方法及び加圧装置
JP6361532B2 (ja) 2015-03-10 2018-07-25 三菱マテリアル株式会社 放熱板付パワーモジュール用基板の製造方法
JP6575386B2 (ja) * 2015-03-11 2019-09-18 三菱マテリアル株式会社 接合体の製造方法、ヒートシンク付パワーモジュール用基板の製造方法、及び、ヒートシンクの製造方法
JP6696214B2 (ja) * 2015-04-16 2020-05-20 三菱マテリアル株式会社 接合体、ヒートシンク付パワーモジュール用基板、ヒートシンク、及び、接合体の製造方法、ヒートシンク付パワーモジュール用基板の製造方法、ヒートシンクの製造方法
US10497585B2 (en) * 2015-04-16 2019-12-03 Mitsubishi Materials Corporation Bonded body, substrate for power module with heat sink, heat sink, method for producing bonded body, method for producing substrate for power module with heat sink, and method for producing heat sink
JP6696215B2 (ja) * 2015-04-16 2020-05-20 三菱マテリアル株式会社 接合体、ヒートシンク付パワーモジュール用基板、ヒートシンク、及び、接合体の製造方法、ヒートシンク付パワーモジュール用基板の製造方法、ヒートシンクの製造方法
JP6837797B2 (ja) 2016-10-03 2021-03-03 達 喜岡 プラスチック歯車に使用される繊維マットの裁断装置とこの裁断装置に使用される打ち抜き刃物及びその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015170825A (ja) * 2014-03-10 2015-09-28 三菱マテリアル株式会社 放熱板付パワーモジュール用基板の製造方法
JP2015211125A (ja) * 2014-04-25 2015-11-24 三菱マテリアル株式会社 パワーモジュール用基板及びヒートシンク付パワーモジュール用基板並びにヒートシンク付パワーモジュール
TW201613037A (en) * 2014-04-25 2016-04-01 Mitsubishi Materials Corp Substrate for power modules, substrate with heat sink for power modules and power module with heat sink
TW201626513A (zh) * 2014-07-04 2016-07-16 Mitsubishi Materials Corp 功率模組用基板單元及功率模組

Also Published As

Publication number Publication date
KR20200138262A (ko) 2020-12-09
EP3780087A1 (en) 2021-02-17
TW201941374A (zh) 2019-10-16
JP7060084B2 (ja) 2022-04-26
US20220173010A1 (en) 2022-06-02
JPWO2019188885A1 (ja) 2021-01-14
US11289400B2 (en) 2022-03-29
US20210028086A1 (en) 2021-01-28
US11908768B2 (en) 2024-02-20
CN111819682A (zh) 2020-10-23
WO2019188885A1 (ja) 2019-10-03
EP3780087A4 (en) 2022-01-12

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