JP2019518330A5 - - Google Patents
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- Publication number
- JP2019518330A5 JP2019518330A5 JP2018560474A JP2018560474A JP2019518330A5 JP 2019518330 A5 JP2019518330 A5 JP 2019518330A5 JP 2018560474 A JP2018560474 A JP 2018560474A JP 2018560474 A JP2018560474 A JP 2018560474A JP 2019518330 A5 JP2019518330 A5 JP 2019518330A5
- Authority
- JP
- Japan
- Prior art keywords
- sheet
- plane
- planar
- copper foil
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 131
- 239000011889 copper foil Substances 0.000 claims description 81
- 238000000034 method Methods 0.000 claims description 51
- 229910052802 copper Inorganic materials 0.000 claims description 50
- 239000010949 copper Substances 0.000 claims description 50
- 239000003989 dielectric material Substances 0.000 claims description 23
- 230000002708 enhancing effect Effects 0.000 claims description 23
- 230000003014 reinforcing effect Effects 0.000 claims description 16
- 230000005540 biological transmission Effects 0.000 claims description 14
- 230000003746 surface roughness Effects 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 description 13
- 238000005728 strengthening Methods 0.000 description 5
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021165553A JP7608310B2 (ja) | 2016-05-18 | 2021-10-07 | 回路基板の製造方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662337979P | 2016-05-18 | 2016-05-18 | |
| US62/337,979 | 2016-05-18 | ||
| PCT/US2017/033342 WO2017201294A2 (en) | 2016-05-18 | 2017-05-18 | Method of manufacturing circuit boards |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021165553A Division JP7608310B2 (ja) | 2016-05-18 | 2021-10-07 | 回路基板の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019518330A JP2019518330A (ja) | 2019-06-27 |
| JP2019518330A5 true JP2019518330A5 (enExample) | 2019-12-19 |
| JP7034946B2 JP7034946B2 (ja) | 2022-03-14 |
Family
ID=60326555
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018560474A Active JP7034946B2 (ja) | 2016-05-18 | 2017-05-18 | 回路基板の製造方法 |
| JP2021165553A Active JP7608310B2 (ja) | 2016-05-18 | 2021-10-07 | 回路基板の製造方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021165553A Active JP7608310B2 (ja) | 2016-05-18 | 2021-10-07 | 回路基板の製造方法 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US20180279481A1 (enExample) |
| EP (1) | EP3459327A2 (enExample) |
| JP (2) | JP7034946B2 (enExample) |
| KR (3) | KR20210099192A (enExample) |
| CN (2) | CN109479377A (enExample) |
| CA (1) | CA3024136A1 (enExample) |
| MY (1) | MY195558A (enExample) |
| SG (1) | SG11201810064PA (enExample) |
| WO (1) | WO2017201294A2 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12336092B2 (en) | 2016-03-09 | 2025-06-17 | Lg Innotek Co., Ltd. | Circuit board, lens driving device, and camera module including the same |
| CN111901985A (zh) * | 2020-05-25 | 2020-11-06 | 重庆星轨科技有限公司 | 一种基于微波电路板的复合层压方法 |
| KR20240001628A (ko) * | 2022-06-27 | 2024-01-03 | 엘지이노텍 주식회사 | 회로 기판 및 이를 포함하는 반도체 패키지 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6042711A (en) * | 1991-06-28 | 2000-03-28 | Gould Electronics, Inc. | Metal foil with improved peel strength and method for making said foil |
| ATE193176T1 (de) * | 1993-03-05 | 2000-06-15 | Polyclad Laminates Inc | Trommelseite-behandelte metallfolie und laminat zur verwendung in leiterplatten und verfahren zur herstellung |
| US5622782A (en) | 1993-04-27 | 1997-04-22 | Gould Inc. | Foil with adhesion promoting layer derived from silane mixture |
| TW326423B (en) * | 1993-08-06 | 1998-02-11 | Gould Inc | Metallic foil with adhesion promoting layer |
| JPH07115268A (ja) * | 1993-10-20 | 1995-05-02 | Matsushita Electric Ind Co Ltd | プリント配線板及びその製造方法 |
| TW324737B (en) | 1994-03-30 | 1998-01-11 | Gould Wlectronics Inc | Epoxy adhesive composition and copper foil and laminate using the same |
| TW289900B (enExample) * | 1994-04-22 | 1996-11-01 | Gould Electronics Inc | |
| US5614324A (en) * | 1995-07-24 | 1997-03-25 | Gould Electronics Inc. | Multi-layer structures containing a silane adhesion promoting layer |
| US6299721B1 (en) * | 1998-12-14 | 2001-10-09 | Gould Electronics Incl | Coatings for improved resin dust resistance |
| JP3291482B2 (ja) * | 1999-08-31 | 2002-06-10 | 三井金属鉱業株式会社 | 整面電解銅箔、その製造方法および用途 |
| JP3291486B2 (ja) * | 1999-09-06 | 2002-06-10 | 三井金属鉱業株式会社 | 整面電解銅箔、その製造方法およびその用途 |
| US20050067378A1 (en) * | 2003-09-30 | 2005-03-31 | Harry Fuerhaupter | Method for micro-roughening treatment of copper and mixed-metal circuitry |
| US7383629B2 (en) * | 2004-11-19 | 2008-06-10 | Endicott Interconnect Technologies, Inc. | Method of making circuitized substrates utilizing smooth-sided conductive layers as part thereof |
| US6964884B1 (en) * | 2004-11-19 | 2005-11-15 | Endicott Interconnect Technologies, Inc. | Circuitized substrates utilizing three smooth-sided conductive layers as part thereof, method of making same, and electrical assemblies and information handling systems utilizing same |
| JP5463117B2 (ja) * | 2009-10-20 | 2014-04-09 | 株式会社日立製作所 | 低損失配線板，多層配線板、それに用いる銅箔及び積層板 |
| KR101958394B1 (ko) | 2011-11-08 | 2019-03-14 | 에스케이하이닉스 주식회사 | 반도체 장치 |
| JP2016141015A (ja) * | 2015-01-30 | 2016-08-08 | パナソニックＩｐマネジメント株式会社 | 両面金属張積層板及びその製造方法 |
-
2017
- 2017-05-18 KR KR1020217024496A patent/KR20210099192A/ko not_active Ceased
- 2017-05-18 EP EP17726807.5A patent/EP3459327A2/en not_active Ceased
- 2017-05-18 JP JP2018560474A patent/JP7034946B2/ja active Active
- 2017-05-18 CN CN201780030925.2A patent/CN109479377A/zh active Pending
- 2017-05-18 KR KR1020187036624A patent/KR20190008923A/ko not_active Ceased
- 2017-05-18 WO PCT/US2017/033342 patent/WO2017201294A2/en not_active Ceased
- 2017-05-18 SG SG11201810064PA patent/SG11201810064PA/en unknown
- 2017-05-18 CN CN202310554145.5A patent/CN117119695A/zh active Pending
- 2017-05-18 CA CA3024136A patent/CA3024136A1/en active Pending
- 2017-05-18 KR KR1020247028636A patent/KR20240134235A/ko active Pending
- 2017-05-18 US US15/761,366 patent/US20180279481A1/en not_active Abandoned
- 2017-05-18 MY MYPI2018001944A patent/MY195558A/en unknown
-
2021
- 2021-10-07 JP JP2021165553A patent/JP7608310B2/ja active Active
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