JP7025545B2 - 電子素子搭載用基板、電子装置および電子モジュール - Google Patents

電子素子搭載用基板、電子装置および電子モジュール Download PDF

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JP7025545B2
JP7025545B2 JP2020527574A JP2020527574A JP7025545B2 JP 7025545 B2 JP7025545 B2 JP 7025545B2 JP 2020527574 A JP2020527574 A JP 2020527574A JP 2020527574 A JP2020527574 A JP 2020527574A JP 7025545 B2 JP7025545 B2 JP 7025545B2
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substrate
electronic element
mounting
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JPWO2020004459A1 (enExample
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登 北住
陽介 森山
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Kyocera Corp
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Kyocera Corp
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    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
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    • H01L23/367—Cooling facilitated by shape of device
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    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
  • Semiconductor Lasers (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2020527574A 2018-06-26 2019-06-26 電子素子搭載用基板、電子装置および電子モジュール Active JP7025545B2 (ja)

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JP2011159662A (ja) 2010-01-29 2011-08-18 Toyota Central R&D Labs Inc 半導体装置
JP2012164956A (ja) 2011-01-18 2012-08-30 Napura:Kk 電子部品支持装置及び電子デバイス
WO2019189612A1 (ja) 2018-03-28 2019-10-03 京セラ株式会社 電子素子搭載用基板、電子装置および電子モジュール

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