JP7018377B2 - 成形型、樹脂成形装置、樹脂成形品の製造方法 - Google Patents

成形型、樹脂成形装置、樹脂成形品の製造方法 Download PDF

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Publication number
JP7018377B2
JP7018377B2 JP2018220061A JP2018220061A JP7018377B2 JP 7018377 B2 JP7018377 B2 JP 7018377B2 JP 2018220061 A JP2018220061 A JP 2018220061A JP 2018220061 A JP2018220061 A JP 2018220061A JP 7018377 B2 JP7018377 B2 JP 7018377B2
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JP
Japan
Prior art keywords
mold
release film
molding
resin
molding die
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018220061A
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English (en)
Japanese (ja)
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JP2020082509A (ja
JP2020082509A5 (enExample
Inventor
丈明 高
宏祐 荒木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Towa Corp
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Priority to JP2018220061A priority Critical patent/JP7018377B2/ja
Priority to TW108132449A priority patent/TW202019657A/zh
Priority to CN201910939827.1A priority patent/CN111216301B/zh
Priority to KR1020190126478A priority patent/KR102259427B1/ko
Publication of JP2020082509A publication Critical patent/JP2020082509A/ja
Publication of JP2020082509A5 publication Critical patent/JP2020082509A5/ja
Application granted granted Critical
Publication of JP7018377B2 publication Critical patent/JP7018377B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/56—Compression moulding under special conditions, e.g. vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C2043/3272—Component parts, details or accessories; Auxiliary operations driving means
    • B29C2043/3283—Component parts, details or accessories; Auxiliary operations driving means for moving moulds or mould parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2017/00—Carriers for sound or information
    • B29L2017/006—Memory cards, chip cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T10/00—Road transport of goods or passengers
    • Y02T10/10—Internal combustion engine [ICE] based vehicles
    • Y02T10/40—Engine management systems

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2018220061A 2018-11-26 2018-11-26 成形型、樹脂成形装置、樹脂成形品の製造方法 Active JP7018377B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2018220061A JP7018377B2 (ja) 2018-11-26 2018-11-26 成形型、樹脂成形装置、樹脂成形品の製造方法
TW108132449A TW202019657A (zh) 2018-11-26 2019-09-09 成型模、樹脂成型裝置、樹脂成型品的製造方法
CN201910939827.1A CN111216301B (zh) 2018-11-26 2019-09-29 成型模、树脂成型装置、树脂成型品的制造方法
KR1020190126478A KR102259427B1 (ko) 2018-11-26 2019-10-11 성형 다이, 수지 성형 장치 및 수지 성형품의 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018220061A JP7018377B2 (ja) 2018-11-26 2018-11-26 成形型、樹脂成形装置、樹脂成形品の製造方法

Publications (3)

Publication Number Publication Date
JP2020082509A JP2020082509A (ja) 2020-06-04
JP2020082509A5 JP2020082509A5 (enExample) 2021-01-14
JP7018377B2 true JP7018377B2 (ja) 2022-02-10

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JP2018220061A Active JP7018377B2 (ja) 2018-11-26 2018-11-26 成形型、樹脂成形装置、樹脂成形品の製造方法

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Country Link
JP (1) JP7018377B2 (enExample)
KR (1) KR102259427B1 (enExample)
CN (1) CN111216301B (enExample)
TW (1) TW202019657A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7530769B2 (ja) 2020-08-25 2024-08-08 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品の製造方法
JP2024014193A (ja) * 2022-07-22 2024-02-01 アピックヤマダ株式会社 樹脂封止装置
JP2025181470A (ja) * 2024-05-31 2025-12-11 Ｔｏｗａ株式会社 上型、樹脂成形装置、及び樹脂成形品の製造方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004098364A (ja) 2002-09-06 2004-04-02 Towa Corp 電子部品の樹脂封止成形方法及び装置
JP2008183752A (ja) 2007-01-29 2008-08-14 Sumitomo Heavy Ind Ltd 圧縮成形金型による樹脂封止方法
JP2012040843A (ja) 2010-08-23 2012-03-01 Sumitomo Heavy Ind Ltd 圧縮成形用金型及び圧縮成形方法
US20130337614A1 (en) 2012-06-14 2013-12-19 Infineon Technologies Ag Methods for manufacturing a chip package, a method for manufacturing a wafer level package, and a compression apparatus
JP2015174353A (ja) 2014-03-17 2015-10-05 アピックヤマダ株式会社 樹脂モールド方法および樹脂モールド金型
CN108162283A (zh) 2016-12-07 2018-06-15 东和株式会社 压缩成形装置的树脂材料供给装置及方法、以及压缩成形装置及树脂成形品制造方法
JP2018167459A (ja) 2017-03-29 2018-11-01 Ｔｏｗａ株式会社 成形型、樹脂成形装置、樹脂成形方法、及び樹脂成形品の製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6132669A (en) * 1997-08-14 2000-10-17 The Elizabeth And Sandor Valyi Foundation, Inc. Process for preparing a molded article
JP2000299334A (ja) 1999-04-14 2000-10-24 Apic Yamada Corp 樹脂封止装置
JP5004410B2 (ja) * 2004-04-26 2012-08-22 Ｔｏｗａ株式会社 光素子の樹脂封止成形方法および樹脂封止成形装置
JP5906528B2 (ja) * 2011-07-29 2016-04-20 アピックヤマダ株式会社 モールド金型及びこれを用いた樹脂モールド装置
TWI565105B (zh) * 2012-07-09 2017-01-01 山田尖端科技股份有限公司 樹脂模塑裝置以及樹脂模塑方法
JP6482263B2 (ja) 2014-12-11 2019-03-13 Ｔｏｗａ株式会社 離型フィルムセット装置及び方法、並びに該装置を備えた樹脂封止用圧縮成形装置
JP6456254B2 (ja) * 2015-06-16 2019-01-23 アピックヤマダ株式会社 フィルム搬送装置及びフィルム搬送方法並びに樹脂モールド装置
JP6827283B2 (ja) * 2016-08-03 2021-02-10 Ｔｏｗａ株式会社 成形型、樹脂成形装置及び樹脂成形品の製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004098364A (ja) 2002-09-06 2004-04-02 Towa Corp 電子部品の樹脂封止成形方法及び装置
JP2008183752A (ja) 2007-01-29 2008-08-14 Sumitomo Heavy Ind Ltd 圧縮成形金型による樹脂封止方法
JP2012040843A (ja) 2010-08-23 2012-03-01 Sumitomo Heavy Ind Ltd 圧縮成形用金型及び圧縮成形方法
US20130337614A1 (en) 2012-06-14 2013-12-19 Infineon Technologies Ag Methods for manufacturing a chip package, a method for manufacturing a wafer level package, and a compression apparatus
JP2015174353A (ja) 2014-03-17 2015-10-05 アピックヤマダ株式会社 樹脂モールド方法および樹脂モールド金型
CN108162283A (zh) 2016-12-07 2018-06-15 东和株式会社 压缩成形装置的树脂材料供给装置及方法、以及压缩成形装置及树脂成形品制造方法
JP2018167459A (ja) 2017-03-29 2018-11-01 Ｔｏｗａ株式会社 成形型、樹脂成形装置、樹脂成形方法、及び樹脂成形品の製造方法

Also Published As

Publication number Publication date
CN111216301A (zh) 2020-06-02
KR20200062023A (ko) 2020-06-03
KR102259427B1 (ko) 2021-05-31
TW202019657A (zh) 2020-06-01
JP2020082509A (ja) 2020-06-04
CN111216301B (zh) 2022-04-01

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