CN111216301B - 成型模、树脂成型装置、树脂成型品的制造方法 - Google Patents

成型模、树脂成型装置、树脂成型品的制造方法 Download PDF

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Publication number
CN111216301B
CN111216301B CN201910939827.1A CN201910939827A CN111216301B CN 111216301 B CN111216301 B CN 111216301B CN 201910939827 A CN201910939827 A CN 201910939827A CN 111216301 B CN111216301 B CN 111216301B
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China
Prior art keywords
mold
die
release film
resin
molding
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CN201910939827.1A
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English (en)
Chinese (zh)
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CN111216301A (zh
Inventor
高丈明
荒木宏祐
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Towa Corp
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Towa Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/56—Compression moulding under special conditions, e.g. vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C2043/3272—Component parts, details or accessories; Auxiliary operations driving means
    • B29C2043/3283—Component parts, details or accessories; Auxiliary operations driving means for moving moulds or mould parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2017/00—Carriers for sound or information
    • B29L2017/006—Memory cards, chip cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T10/00—Road transport of goods or passengers
    • Y02T10/10—Internal combustion engine [ICE] based vehicles
    • Y02T10/40—Engine management systems

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
CN201910939827.1A 2018-11-26 2019-09-29 成型模、树脂成型装置、树脂成型品的制造方法 Active CN111216301B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-220061 2018-11-26
JP2018220061A JP7018377B2 (ja) 2018-11-26 2018-11-26 成形型、樹脂成形装置、樹脂成形品の製造方法

Publications (2)

Publication Number Publication Date
CN111216301A CN111216301A (zh) 2020-06-02
CN111216301B true CN111216301B (zh) 2022-04-01

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Country Link
JP (1) JP7018377B2 (enExample)
KR (1) KR102259427B1 (enExample)
CN (1) CN111216301B (enExample)
TW (1) TW202019657A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7530769B2 (ja) * 2020-08-25 2024-08-08 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品の製造方法
JP2024014193A (ja) * 2022-07-22 2024-02-01 アピックヤマダ株式会社 樹脂封止装置
JP2025181470A (ja) * 2024-05-31 2025-12-11 Ｔｏｗａ株式会社 上型、樹脂成形装置、及び樹脂成形品の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102896714A (zh) * 2011-07-29 2013-01-30 山田尖端科技株式会社 模制用模组和具有该模制用模组的树脂模制装置
CN103545224A (zh) * 2012-07-09 2014-01-29 山田尖端科技株式会社 树脂模塑装置和树脂模塑方法
CN107685412A (zh) * 2016-08-03 2018-02-13 东和株式会社 成型模、树脂成型装置及树脂成型品的制造方法
CN108688050A (zh) * 2017-03-29 2018-10-23 东和株式会社 成型模、树脂成型装置、树脂成型方法及树脂成型品的制造方法

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US6132669A (en) * 1997-08-14 2000-10-17 The Elizabeth And Sandor Valyi Foundation, Inc. Process for preparing a molded article
JP2000299334A (ja) 1999-04-14 2000-10-24 Apic Yamada Corp 樹脂封止装置
JP4268389B2 (ja) 2002-09-06 2009-05-27 Ｔｏｗａ株式会社 電子部品の樹脂封止成形方法及び装置
JP5004410B2 (ja) * 2004-04-26 2012-08-22 Ｔｏｗａ株式会社 光素子の樹脂封止成形方法および樹脂封止成形装置
JP5121238B2 (ja) 2007-01-29 2013-01-16 住友重機械工業株式会社 樹脂封止方法
JP5409549B2 (ja) 2010-08-23 2014-02-05 住友重機械工業株式会社 圧縮成形用金型及び圧縮成形方法
US20130337614A1 (en) 2012-06-14 2013-12-19 Infineon Technologies Ag Methods for manufacturing a chip package, a method for manufacturing a wafer level package, and a compression apparatus
JP6346474B2 (ja) 2014-03-17 2018-06-20 アピックヤマダ株式会社 樹脂モールド方法および樹脂モールド金型
JP6482263B2 (ja) 2014-12-11 2019-03-13 Ｔｏｗａ株式会社 離型フィルムセット装置及び方法、並びに該装置を備えた樹脂封止用圧縮成形装置
JP6456254B2 (ja) * 2015-06-16 2019-01-23 アピックヤマダ株式会社 フィルム搬送装置及びフィルム搬送方法並びに樹脂モールド装置
JP6349376B2 (ja) 2016-12-07 2018-06-27 Ｔｏｗａ株式会社 圧縮成形装置の樹脂材料供給装置及び方法、並びに圧縮成形装置及び樹脂成形品製造方法

Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
CN102896714A (zh) * 2011-07-29 2013-01-30 山田尖端科技株式会社 模制用模组和具有该模制用模组的树脂模制装置
CN103545224A (zh) * 2012-07-09 2014-01-29 山田尖端科技株式会社 树脂模塑装置和树脂模塑方法
CN107685412A (zh) * 2016-08-03 2018-02-13 东和株式会社 成型模、树脂成型装置及树脂成型品的制造方法
CN108688050A (zh) * 2017-03-29 2018-10-23 东和株式会社 成型模、树脂成型装置、树脂成型方法及树脂成型品的制造方法

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Publication number Publication date
JP2020082509A (ja) 2020-06-04
KR20200062023A (ko) 2020-06-03
TW202019657A (zh) 2020-06-01
JP7018377B2 (ja) 2022-02-10
CN111216301A (zh) 2020-06-02
KR102259427B1 (ko) 2021-05-31

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