JP7001398B2 - 表示装置の製造方法及び多面取り基板 - Google Patents

表示装置の製造方法及び多面取り基板 Download PDF

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Publication number
JP7001398B2
JP7001398B2 JP2017171933A JP2017171933A JP7001398B2 JP 7001398 B2 JP7001398 B2 JP 7001398B2 JP 2017171933 A JP2017171933 A JP 2017171933A JP 2017171933 A JP2017171933 A JP 2017171933A JP 7001398 B2 JP7001398 B2 JP 7001398B2
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Japan
Prior art keywords
pad
inspection
product
pads
light emitting
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JP2017171933A
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English (en)
Japanese (ja)
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JP2019045823A5 (https=
JP2019045823A (ja
Inventor
哲生 森田
裕之 木村
誠 渋沢
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Japan Display Inc
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Japan Display Inc
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Publication date
Application filed by Japan Display Inc filed Critical Japan Display Inc
Priority to JP2017171933A priority Critical patent/JP7001398B2/ja
Priority to PCT/JP2018/021988 priority patent/WO2019049448A1/ja
Priority to CN201880051690.XA priority patent/CN111033600B/zh
Publication of JP2019045823A publication Critical patent/JP2019045823A/ja
Priority to US16/781,009 priority patent/US11322571B2/en
Publication of JP2019045823A5 publication Critical patent/JP2019045823A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/70—Testing, e.g. accelerated lifetime tests
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/006—Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/06—Electrode terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/27—Structural arrangements therefor
    • H10P74/273—Interconnections for measuring or testing, e.g. probe pads
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional [2D] radiating surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/851—Division of substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/861—Repairing

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP2017171933A 2017-09-07 2017-09-07 表示装置の製造方法及び多面取り基板 Active JP7001398B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2017171933A JP7001398B2 (ja) 2017-09-07 2017-09-07 表示装置の製造方法及び多面取り基板
PCT/JP2018/021988 WO2019049448A1 (ja) 2017-09-07 2018-06-08 表示装置の製造方法及び多面取り基板
CN201880051690.XA CN111033600B (zh) 2017-09-07 2018-06-08 显示装置的制造方法及拼版基板
US16/781,009 US11322571B2 (en) 2017-09-07 2020-02-04 Display apparatus including negative electrode pads and positive electrode pads that are included in first inspection pads but not in second inspection pads

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017171933A JP7001398B2 (ja) 2017-09-07 2017-09-07 表示装置の製造方法及び多面取り基板

Publications (3)

Publication Number Publication Date
JP2019045823A JP2019045823A (ja) 2019-03-22
JP2019045823A5 JP2019045823A5 (https=) 2020-10-15
JP7001398B2 true JP7001398B2 (ja) 2022-01-19

Family

ID=65634759

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017171933A Active JP7001398B2 (ja) 2017-09-07 2017-09-07 表示装置の製造方法及び多面取り基板

Country Status (4)

Country Link
US (1) US11322571B2 (https=)
JP (1) JP7001398B2 (https=)
CN (1) CN111033600B (https=)
WO (1) WO2019049448A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111933066A (zh) * 2020-08-28 2020-11-13 京东方科技集团股份有限公司 Oled显示基板、显示模组、显示面板
JP7684851B2 (ja) * 2021-06-29 2025-05-28 株式会社ジャパンディスプレイ 表示装置
CN115692424B (zh) * 2021-07-30 2025-06-20 北京京东方光电科技有限公司 显示面板以及显示面板母板
CN113809134B (zh) * 2021-08-26 2024-06-28 湖北长江新型显示产业创新中心有限公司 一种显示面板及显示装置
CN114023914A (zh) * 2021-12-07 2022-02-08 南京迪钛飞光电科技有限公司 一种有机发光器件测试装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008304880A (ja) 2007-06-05 2008-12-18 Samsung Sdi Co Ltd 有機電界発光表示装置及び有機電界発光表示装置のマザー基板
US20100112887A1 (en) 2008-10-31 2010-05-06 Kwang-Min Kim Method of making organic light emitting display device
JP2011134489A (ja) 2009-12-22 2011-07-07 Hitachi High-Technologies Corp 有機ｅｌディスプレイ基板の点灯検査設備及び点灯検査方法、有機ｅｌディスプレイ基板の欠陥検査修正装置及び欠陥検査修正方法並びに有機ｅｌディスプレイ製造システム及び製造方法。
JP2015056335A (ja) 2013-09-13 2015-03-23 セイコーエプソン株式会社 電気光学装置、電子機器及び電気光学装置の製造方法
US20150170982A1 (en) 2013-12-13 2015-06-18 Lg Display Co., Ltd. Display Device and Display Panel
JP2016065990A (ja) 2014-09-25 2016-04-28 株式会社ジャパンディスプレイ 表示装置の製造方法および表示装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7503821B2 (en) * 2004-07-23 2009-03-17 Lg Display Co., Ltd. Mother glass and method of fabricating organic electro luminescence display device using the same
KR100637065B1 (ko) * 2004-12-29 2006-10-23 엘지전자 주식회사 유기전계발광표시소자용 모기판 및 이를 이용한유기전계발광표시소자의 제조방법
KR100840091B1 (ko) * 2007-08-17 2008-06-20 삼성에스디아이 주식회사 유기전계발광 표시장치 및 그의 모기판
JP2010139962A (ja) * 2008-12-15 2010-06-24 Toshiba Mobile Display Co Ltd アレイ基板、平面表示装置、マザー基板及びアレイ基板の製造方法
JP2015169760A (ja) * 2014-03-06 2015-09-28 株式会社ジャパンディスプレイ 表示装置の製造方法、表示装置および表示装置形成基板
JP6329795B2 (ja) 2014-03-27 2018-05-23 株式会社ジャパンディスプレイ Ｅｌ表示装置及びｅｌ表示装置の製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008304880A (ja) 2007-06-05 2008-12-18 Samsung Sdi Co Ltd 有機電界発光表示装置及び有機電界発光表示装置のマザー基板
US20100112887A1 (en) 2008-10-31 2010-05-06 Kwang-Min Kim Method of making organic light emitting display device
JP2011134489A (ja) 2009-12-22 2011-07-07 Hitachi High-Technologies Corp 有機ｅｌディスプレイ基板の点灯検査設備及び点灯検査方法、有機ｅｌディスプレイ基板の欠陥検査修正装置及び欠陥検査修正方法並びに有機ｅｌディスプレイ製造システム及び製造方法。
JP2015056335A (ja) 2013-09-13 2015-03-23 セイコーエプソン株式会社 電気光学装置、電子機器及び電気光学装置の製造方法
US20150170982A1 (en) 2013-12-13 2015-06-18 Lg Display Co., Ltd. Display Device and Display Panel
JP2016065990A (ja) 2014-09-25 2016-04-28 株式会社ジャパンディスプレイ 表示装置の製造方法および表示装置

Also Published As

Publication number Publication date
US11322571B2 (en) 2022-05-03
CN111033600A (zh) 2020-04-17
US20200176546A1 (en) 2020-06-04
CN111033600B (zh) 2021-11-30
WO2019049448A1 (ja) 2019-03-14
JP2019045823A (ja) 2019-03-22

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