JP6999401B2 - レーザー加工装置 - Google Patents

レーザー加工装置 Download PDF

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Publication number
JP6999401B2
JP6999401B2 JP2017243095A JP2017243095A JP6999401B2 JP 6999401 B2 JP6999401 B2 JP 6999401B2 JP 2017243095 A JP2017243095 A JP 2017243095A JP 2017243095 A JP2017243095 A JP 2017243095A JP 6999401 B2 JP6999401 B2 JP 6999401B2
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JP
Japan
Prior art keywords
unit
substrate
substrate holding
laser
moving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017243095A
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English (en)
Japanese (ja)
Other versions
JP2019107681A (ja
Inventor
義広 川口
弘明 森
隼斗 田之上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2017243095A priority Critical patent/JP6999401B2/ja
Priority to CN201811530301.XA priority patent/CN109954982B/zh
Publication of JP2019107681A publication Critical patent/JP2019107681A/ja
Application granted granted Critical
Publication of JP6999401B2 publication Critical patent/JP6999401B2/ja
Active legal-status Critical Current
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
JP2017243095A 2017-12-19 2017-12-19 レーザー加工装置 Active JP6999401B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2017243095A JP6999401B2 (ja) 2017-12-19 2017-12-19 レーザー加工装置
CN201811530301.XA CN109954982B (zh) 2017-12-19 2018-12-14 激光加工装置和激光加工方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017243095A JP6999401B2 (ja) 2017-12-19 2017-12-19 レーザー加工装置

Publications (2)

Publication Number Publication Date
JP2019107681A JP2019107681A (ja) 2019-07-04
JP6999401B2 true JP6999401B2 (ja) 2022-01-18

Family

ID=67023309

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017243095A Active JP6999401B2 (ja) 2017-12-19 2017-12-19 レーザー加工装置

Country Status (2)

Country Link
JP (1) JP6999401B2 (zh)
CN (1) CN109954982B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111590198B (zh) * 2020-06-01 2021-05-07 华中科技大学 利用高频/超高频微振动实现激光光斑动态调节的激光头
JP2022105940A (ja) * 2021-01-05 2022-07-15 株式会社ジャパンディスプレイ レーザ加工装置、及びレーザ加工方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009066602A (ja) 2007-09-10 2009-04-02 Jfe Steel Kk 連続鋳造鋳片の欠陥検出方法及び連続鋳造鋳片の処理方法
JP2013018053A (ja) 2011-07-13 2013-01-31 Chun-Hao Li レーザ加工機
JP2017064744A (ja) 2015-09-29 2017-04-06 株式会社ディスコ レーザー加工装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5290992A (en) * 1992-10-07 1994-03-01 International Business Machines Corporation Apparatus for maximizing light beam utilization
JPH08150485A (ja) * 1994-11-28 1996-06-11 Komatsu Ltd レーザマーキング装置
JPH11142786A (ja) * 1997-11-13 1999-05-28 Nippon Laser:Kk レーザー光路分配装置
JP4684687B2 (ja) * 2005-03-11 2011-05-18 株式会社ディスコ ウエーハのレーザー加工方法および加工装置
WO2009066602A1 (ja) * 2007-11-19 2009-05-28 Tokyo Seimitsu Co., Ltd. ダイシング方法
EP2875896B1 (en) * 2013-11-22 2016-10-05 SALVAGNINI ITALIA S.p.A. Laser cutting head for tool machine with a cooling unit fixed to the head
CN105195902B (zh) * 2015-10-15 2017-06-06 浙江欧威科技有限公司 Pcb干膜线路数字化割膜机

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009066602A (ja) 2007-09-10 2009-04-02 Jfe Steel Kk 連続鋳造鋳片の欠陥検出方法及び連続鋳造鋳片の処理方法
JP2013018053A (ja) 2011-07-13 2013-01-31 Chun-Hao Li レーザ加工機
JP2017064744A (ja) 2015-09-29 2017-04-06 株式会社ディスコ レーザー加工装置

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Publication number Publication date
CN109954982B (zh) 2022-08-26
JP2019107681A (ja) 2019-07-04
CN109954982A (zh) 2019-07-02

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