WO2009066602A1 - ダイシング方法 - Google Patents

ダイシング方法 Download PDF

Info

Publication number
WO2009066602A1
WO2009066602A1 PCT/JP2008/070662 JP2008070662W WO2009066602A1 WO 2009066602 A1 WO2009066602 A1 WO 2009066602A1 JP 2008070662 W JP2008070662 W JP 2008070662W WO 2009066602 A1 WO2009066602 A1 WO 2009066602A1
Authority
WO
WIPO (PCT)
Prior art keywords
imaging
worktable
control means
work
dicing method
Prior art date
Application number
PCT/JP2008/070662
Other languages
English (en)
French (fr)
Inventor
Takeo Tsushima
Original Assignee
Tokyo Seimitsu Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co., Ltd. filed Critical Tokyo Seimitsu Co., Ltd.
Priority to KR1020107011133A priority Critical patent/KR101464804B1/ko
Priority to US12/743,511 priority patent/US8116893B2/en
Priority to JP2009542531A priority patent/JP5182653B2/ja
Publication of WO2009066602A1 publication Critical patent/WO2009066602A1/ja

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064—Devices for the automatic drive or the program control of the machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/029—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a plurality of cutting blades

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Dicing (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)

Abstract

　本発明の一の態様に係るダイシング装置は、第２のワークテーブル上に載置されるワークを第１の撮像手段及び第２の撮像手段で撮像中、第１のワークテーブル上に載置されたワークにおいても前記第１の撮像手段及び前記第２の撮像手段で撮像する必要が有ることを制御手段により検知した場合、前記第１のワークテーブルと前記第２のワークテーブルとで行われている動作の優先度を前記制御手段により判断し、前記第１のワークテーブルにおける動作の優先度が高いと判断できる際、前記第２のワークテーブル上に載置されるワークの撮像を中断し、前記第１の撮像手段及び前記第２の撮像手段を移動させて前記第１のワークテーブル上のワークの撮像を行うことを特徴としている。
PCT/JP2008/070662 2007-11-19 2008-11-13 ダイシング方法 WO2009066602A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020107011133A KR101464804B1 (ko) 2007-11-19 2008-11-13 다이싱 방법
US12/743,511 US8116893B2 (en) 2007-11-19 2008-11-13 Dicing method
JP2009542531A JP5182653B2 (ja) 2007-11-19 2008-11-13 ダイシング方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007299246 2007-11-19
JP2007-299246 2007-11-19

Publications (1)

Publication Number Publication Date
WO2009066602A1 true WO2009066602A1 (ja) 2009-05-28

Family

ID=40667426

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/070662 WO2009066602A1 (ja) 2007-11-19 2008-11-13 ダイシング方法

Country Status (5)

Country Link
US (1) US8116893B2 (ja)
JP (1) JP5182653B2 (ja)
KR (1) KR101464804B1 (ja)
TW (1) TWI457218B (ja)
WO (1) WO2009066602A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011066233A (ja) * 2009-09-17 2011-03-31 Disco Abrasive Syst Ltd 切削装置
JP2018117094A (ja) * 2017-01-20 2018-07-26 株式会社ディスコ 加工装置
JP2020029377A (ja) * 2018-08-21 2020-02-27 Ａｇｃ株式会社 カバーガラスの切断方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9508570B2 (en) * 2013-10-21 2016-11-29 Asm Technology Singapore Pte Ltd Singulation apparatus and method
JP6560110B2 (ja) * 2015-11-30 2019-08-14 株式会社ディスコ 切削装置
JP7001493B2 (ja) * 2018-02-26 2022-01-19 株式会社ディスコ 撮像画像形成ユニット
JP7184620B2 (ja) * 2018-12-11 2022-12-06 株式会社ディスコ 切削装置
CN109910188A (zh) * 2019-03-06 2019-06-21 东华大学 一种划片机龙门切削双刀具机构

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004288792A (ja) * 2003-03-20 2004-10-14 Lintec Corp アライメント装置及びアライメント方法
JP2005085972A (ja) * 2003-09-09 2005-03-31 Disco Abrasive Syst Ltd 切削装置におけるアライメント方法
JP2007105861A (ja) * 2005-10-17 2007-04-26 Disco Abrasive Syst Ltd 切削ブレードの交換装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5920480A (en) * 1997-01-10 1999-07-06 Nakamura; Kaoru Method and apparatus for detecting pallet full load state in sheet metal machining line and method and apparatus for controlling sheet metal machining line and work identifying apparatus
JP4696321B2 (ja) 2001-03-21 2011-06-08 株式会社東京精密 ダイシング装置
JP2004134672A (ja) * 2002-10-11 2004-04-30 Sony Corp 超薄型半導体装置の製造方法および製造装置、並びに超薄型の裏面照射型固体撮像装置の製造方法および製造装置
JP4303041B2 (ja) * 2003-06-18 2009-07-29 株式会社ディスコ 半導体ウエーハの加工装置
JP2005085975A (ja) * 2003-09-09 2005-03-31 Matsushita Electric Ind Co Ltd 半導体装置
JP4571851B2 (ja) 2004-11-30 2010-10-27 株式会社ディスコ 切削装置
JP4731241B2 (ja) * 2005-08-02 2011-07-20 株式会社ディスコ ウエーハの分割方法
US7539552B2 (en) * 2006-10-09 2009-05-26 Advanced Micro Devices, Inc. Method and apparatus for implementing a universal coordinate system for metrology data

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004288792A (ja) * 2003-03-20 2004-10-14 Lintec Corp アライメント装置及びアライメント方法
JP2005085972A (ja) * 2003-09-09 2005-03-31 Disco Abrasive Syst Ltd 切削装置におけるアライメント方法
JP2007105861A (ja) * 2005-10-17 2007-04-26 Disco Abrasive Syst Ltd 切削ブレードの交換装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011066233A (ja) * 2009-09-17 2011-03-31 Disco Abrasive Syst Ltd 切削装置
CN102019648A (zh) * 2009-09-17 2011-04-20 株式会社迪思科 切削装置
JP2018117094A (ja) * 2017-01-20 2018-07-26 株式会社ディスコ 加工装置
JP2020029377A (ja) * 2018-08-21 2020-02-27 Ａｇｃ株式会社 カバーガラスの切断方法
JP7087817B2 (ja) 2018-08-21 2022-06-21 Ａｇｃ株式会社 カバーガラスの切断方法

Also Published As

Publication number Publication date
US20110054657A1 (en) 2011-03-03
KR20100118099A (ko) 2010-11-04
KR101464804B1 (ko) 2014-11-24
JPWO2009066602A1 (ja) 2011-04-07
JP5182653B2 (ja) 2013-04-17
TWI457218B (zh) 2014-10-21
TW200932462A (en) 2009-08-01
US8116893B2 (en) 2012-02-14

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