JP6989675B1 - 熱伝導性シート及び熱伝導性シートの製造方法 - Google Patents

熱伝導性シート及び熱伝導性シートの製造方法 Download PDF

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Publication number
JP6989675B1
JP6989675B1 JP2020176566A JP2020176566A JP6989675B1 JP 6989675 B1 JP6989675 B1 JP 6989675B1 JP 2020176566 A JP2020176566 A JP 2020176566A JP 2020176566 A JP2020176566 A JP 2020176566A JP 6989675 B1 JP6989675 B1 JP 6989675B1
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Japan
Prior art keywords
heat conductive
conductive sheet
conductive filler
heat
filler
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English (en)
Japanese (ja)
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JP2022067780A (ja
Inventor
勇磨 佐藤
慶輔 荒巻
佑介 久保
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Dexerials Corp
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Dexerials Corp
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=79239800&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JP6989675(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Dexerials Corp filed Critical Dexerials Corp
Priority to JP2020176566A priority Critical patent/JP6989675B1/ja
Priority to PCT/JP2021/030065 priority patent/WO2022085284A1/ja
Priority to TW110139009A priority patent/TWI918740B/zh
Priority to JP2021195853A priority patent/JP7681496B2/ja
Application granted granted Critical
Publication of JP6989675B1 publication Critical patent/JP6989675B1/ja
Publication of JP2022067780A publication Critical patent/JP2022067780A/ja
Priority to JP2025040729A priority patent/JP7814582B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
    • C08K13/04—Ingredients characterised by their shape and organic or inorganic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
JP2020176566A 2020-10-21 2020-10-21 熱伝導性シート及び熱伝導性シートの製造方法 Active JP6989675B1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2020176566A JP6989675B1 (ja) 2020-10-21 2020-10-21 熱伝導性シート及び熱伝導性シートの製造方法
PCT/JP2021/030065 WO2022085284A1 (ja) 2020-10-21 2021-08-17 熱伝導性シート及び熱伝導性シートの製造方法
TW110139009A TWI918740B (zh) 2020-10-21 2021-10-21 熱傳導性片材及熱傳導性片材之製造方法
JP2021195853A JP7681496B2 (ja) 2020-10-21 2021-12-02 熱伝導性シート及び熱伝導性シートの製造方法
JP2025040729A JP7814582B2 (ja) 2020-10-21 2025-03-13 熱伝導性シート及び熱伝導性シートの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020176566A JP6989675B1 (ja) 2020-10-21 2020-10-21 熱伝導性シート及び熱伝導性シートの製造方法

Related Child Applications (1)

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JP2021195853A Division JP7681496B2 (ja) 2020-10-21 2021-12-02 熱伝導性シート及び熱伝導性シートの製造方法

Publications (2)

Publication Number Publication Date
JP6989675B1 true JP6989675B1 (ja) 2022-01-05
JP2022067780A JP2022067780A (ja) 2022-05-09

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ID=79239800

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JP2020176566A Active JP6989675B1 (ja) 2020-10-21 2020-10-21 熱伝導性シート及び熱伝導性シートの製造方法
JP2021195853A Active JP7681496B2 (ja) 2020-10-21 2021-12-02 熱伝導性シート及び熱伝導性シートの製造方法
JP2025040729A Active JP7814582B2 (ja) 2020-10-21 2025-03-13 熱伝導性シート及び熱伝導性シートの製造方法

Family Applications After (2)

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JP2021195853A Active JP7681496B2 (ja) 2020-10-21 2021-12-02 熱伝導性シート及び熱伝導性シートの製造方法
JP2025040729A Active JP7814582B2 (ja) 2020-10-21 2025-03-13 熱伝導性シート及び熱伝導性シートの製造方法

Country Status (2)

Country Link
JP (3) JP6989675B1 (https=)
WO (1) WO2022085284A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024045039A (ja) * 2022-09-20 2024-04-02 住友ベークライト株式会社 樹脂シート
WO2024257369A1 (ja) * 2023-06-15 2024-12-19 住友ベークライト株式会社 樹脂シート

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4514344B2 (ja) * 2001-02-07 2010-07-28 電気化学工業株式会社 熱伝導性樹脂成形体及びその用途
JP2009094110A (ja) * 2007-10-03 2009-04-30 Denki Kagaku Kogyo Kk 放熱部材、及びそのシート、およびその製造方法
JP5330910B2 (ja) * 2009-07-03 2013-10-30 電気化学工業株式会社 樹脂組成物及びその用途
JP2012023335A (ja) * 2010-06-17 2012-02-02 Sony Chemical & Information Device Corp 熱伝導性シート及びその製造方法
JP2013131564A (ja) * 2011-12-20 2013-07-04 Dexerials Corp 熱伝導性シート、この熱伝導性シートを用いた半導体装置及び半導体装置の製造方法
JP5779693B2 (ja) 2013-06-27 2015-09-16 デクセリアルズ株式会社 熱伝導性シート、及びその製造方法、並びに半導体装置
JP5798210B2 (ja) * 2013-07-10 2015-10-21 デクセリアルズ株式会社 熱伝導性シート
EP3121210A4 (en) 2014-03-20 2017-12-06 Hitachi Chemical Co., Ltd. Resin composition, resin sheet, resin sheet cured product, resin sheet laminate, resin sheet laminate cured product and method for producing same, semiconductor device, and led device.
US10964620B2 (en) * 2016-04-11 2021-03-30 Sekisui Polymatech Co., Ltd. Thermally conductive sheet
JP6746540B2 (ja) 2017-07-24 2020-08-26 積水化学工業株式会社 熱伝導シート
US11987687B2 (en) 2018-09-26 2024-05-21 Sekisui Polymatech Co., Ltd. Heat conductive sheet
CN113015622A (zh) * 2018-11-20 2021-06-22 积水保力马科技株式会社 导热性片及其制造方法
JP7110977B2 (ja) 2018-12-28 2022-08-02 東洋インキＳｃホールディングス株式会社 熱伝導性絶縁シート及び複合部材

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Publication number Publication date
TW202222556A (zh) 2022-06-16
JP7681496B2 (ja) 2025-05-22
JP2022068136A (ja) 2022-05-09
JP2025085723A (ja) 2025-06-05
JP7814582B2 (ja) 2026-02-16
JP2022067780A (ja) 2022-05-09
WO2022085284A1 (ja) 2022-04-28

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