JP6982992B2 - 導通接点針 - Google Patents

導通接点針 Download PDF

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Publication number
JP6982992B2
JP6982992B2 JP2017127431A JP2017127431A JP6982992B2 JP 6982992 B2 JP6982992 B2 JP 6982992B2 JP 2017127431 A JP2017127431 A JP 2017127431A JP 2017127431 A JP2017127431 A JP 2017127431A JP 6982992 B2 JP6982992 B2 JP 6982992B2
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JP
Japan
Prior art keywords
film
convex portions
substrate
insulating film
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017127431A
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English (en)
Japanese (ja)
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JP2018041954A (ja
Inventor
通広 川口
公信 明野
憲一 片岡
智樹 梅津
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nuflare Technology Inc
Original Assignee
Nuflare Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nuflare Technology Inc filed Critical Nuflare Technology Inc
Priority to TW106128198A priority Critical patent/TWI684070B/zh
Priority to US15/687,886 priority patent/US10373793B2/en
Priority to KR1020170109372A priority patent/KR102019549B1/ko
Publication of JP2018041954A publication Critical patent/JP2018041954A/ja
Application granted granted Critical
Publication of JP6982992B2 publication Critical patent/JP6982992B2/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/20—Masks or mask blanks for imaging by charged particle beam [CPB] radiation, e.g. by electron beam; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/76—Patterning of masks by imaging
    • G03F1/78—Patterning of masks by imaging by charged particle beam [CPB], e.g. electron beam patterning of masks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70991—Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Plasma & Fusion (AREA)
  • Electron Beam Exposure (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
JP2017127431A 2016-09-05 2017-06-29 導通接点針 Active JP6982992B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW106128198A TWI684070B (zh) 2016-09-05 2017-08-21 導通接點針以及帶電粒子束裝置
US15/687,886 US10373793B2 (en) 2016-09-05 2017-08-28 Conductive contact point pin and charged particle beam apparatus
KR1020170109372A KR102019549B1 (ko) 2016-09-05 2017-08-29 도통 접점 침 및 하전 입자 빔 장치

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016173138 2016-09-05
JP2016173138 2016-09-05

Publications (2)

Publication Number Publication Date
JP2018041954A JP2018041954A (ja) 2018-03-15
JP6982992B2 true JP6982992B2 (ja) 2021-12-17

Family

ID=61624011

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017127431A Active JP6982992B2 (ja) 2016-09-05 2017-06-29 導通接点針

Country Status (3)

Country Link
JP (1) JP6982992B2 (ko)
KR (1) KR102019549B1 (ko)
TW (1) TWI684070B (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7034867B2 (ja) * 2018-08-31 2022-03-14 株式会社ニューフレアテクノロジー 異常判定方法および描画装置
JP7037513B2 (ja) * 2019-02-14 2022-03-16 株式会社ニューフレアテクノロジー 描画装置および描画方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06289592A (ja) * 1993-04-06 1994-10-18 Toppan Printing Co Ltd フォトマスクの製造方法
JPH1151970A (ja) * 1997-07-31 1999-02-26 Nec Corp プローブカード
JP3428397B2 (ja) * 1997-10-14 2003-07-22 松下電器産業株式会社 有機エレクトロルミネセンス素子及びその製造方法
US7247895B2 (en) * 2001-07-26 2007-07-24 The Board Of Trustees Of The University Of Illinois Electrostatic nanolithography probe actuation device and method
US8988091B2 (en) * 2004-05-21 2015-03-24 Microprobe, Inc. Multiple contact probes
JP2007218675A (ja) * 2006-02-15 2007-08-30 Fujitsu Ltd プローブ及びプローブの製造方法
JP2008058809A (ja) * 2006-09-01 2008-03-13 Nuflare Technology Inc 基板カバー、荷電粒子ビーム描画装置及び荷電粒子ビーム描画方法
JP2009198238A (ja) * 2008-02-20 2009-09-03 Totoku Electric Co Ltd プローブ針及びその製造方法
JP2010038803A (ja) * 2008-08-07 2010-02-18 Japan Electronic Materials Corp コンタクトプローブ及びコンタクトプローブの製造方法
JP2010074059A (ja) * 2008-09-22 2010-04-02 Nuflare Technology Inc アースピン、アースプレート、荷電粒子ビーム描画装置および荷電粒子ビーム描画方法

Also Published As

Publication number Publication date
JP2018041954A (ja) 2018-03-15
TWI684070B (zh) 2020-02-01
KR102019549B1 (ko) 2019-09-06
KR20180027346A (ko) 2018-03-14
TW201820044A (zh) 2018-06-01

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