JP6977140B2 - マスク及びその製作方法 - Google Patents

マスク及びその製作方法 Download PDF

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Publication number
JP6977140B2
JP6977140B2 JP2020501465A JP2020501465A JP6977140B2 JP 6977140 B2 JP6977140 B2 JP 6977140B2 JP 2020501465 A JP2020501465 A JP 2020501465A JP 2020501465 A JP2020501465 A JP 2020501465A JP 6977140 B2 JP6977140 B2 JP 6977140B2
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JP2020526670A5 (https=
JP2020526670A (ja
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ウェイリ リ
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Kunshan Govisionox Optoelectronics Co Ltd
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Kunshan Govisionox Optoelectronics Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
JP2020501465A 2018-03-30 2018-08-21 マスク及びその製作方法 Active JP6977140B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201810277643.9 2018-03-30
CN201810277643.9A CN108456846A (zh) 2018-03-30 2018-03-30 掩膜板及其制备方法
PCT/CN2018/101549 WO2019184205A1 (zh) 2018-03-30 2018-08-21 掩膜板及其制备方法

Publications (3)

Publication Number Publication Date
JP2020526670A JP2020526670A (ja) 2020-08-31
JP2020526670A5 JP2020526670A5 (https=) 2020-10-08
JP6977140B2 true JP6977140B2 (ja) 2021-12-08

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ID=63237826

Family Applications (1)

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JP2020501465A Active JP6977140B2 (ja) 2018-03-30 2018-08-21 マスク及びその製作方法

Country Status (7)

Country Link
US (1) US20190345599A1 (https=)
EP (1) EP3640365A4 (https=)
JP (1) JP6977140B2 (https=)
KR (1) KR20200028483A (https=)
CN (2) CN116024523A (https=)
TW (1) TWI726240B (https=)
WO (1) WO2019184205A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109487206B (zh) * 2018-12-11 2020-08-11 武汉华星光电半导体显示技术有限公司 掩膜版及采用该掩膜版的掩膜装置
CN110760790A (zh) * 2019-02-28 2020-02-07 云谷（固安）科技有限公司 掩膜板及掩膜组件
CN110760791A (zh) * 2019-02-28 2020-02-07 云谷（固安）科技有限公司 掩膜板及掩膜组件
CN109913805B (zh) * 2019-03-27 2021-01-26 京东方科技集团股份有限公司 一种掩膜版
JP7749925B2 (ja) * 2020-03-13 2025-10-07 大日本印刷株式会社 有機デバイスの製造装置の蒸着室の評価方法
KR102836687B1 (ko) * 2020-05-11 2025-07-22 삼성디스플레이 주식회사 마스크 검사 장치 및 이를 이용한 마스크 검사 방법
CN116657099A (zh) * 2023-05-31 2023-08-29 京东方科技集团股份有限公司 遮挡用金属掩膜板、张网组件、掩膜板以及显示面板

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4608874B2 (ja) * 2003-12-02 2011-01-12 ソニー株式会社 蒸着マスクおよびその製造方法
JP4915312B2 (ja) * 2007-08-08 2012-04-11 ソニー株式会社 蒸着用マスクの製造方法
CN202530150U (zh) * 2012-01-16 2012-11-14 昆山允升吉光电科技有限公司 蒸镀掩模板
CN103014618A (zh) * 2012-12-25 2013-04-03 唐军 蒸镀用掩模板及其制造方法
CN105144421B (zh) * 2013-04-22 2018-10-26 应用材料公司 主动对准的精细金属掩模
KR102106331B1 (ko) * 2013-07-08 2020-05-06 삼성디스플레이 주식회사 마스크 조립체 및 이의 제조 방법
KR102106336B1 (ko) * 2013-07-08 2020-06-03 삼성디스플레이 주식회사 증착용 마스크
CN104593721B (zh) * 2013-10-30 2017-08-08 昆山国显光电有限公司 一种蒸镀用精密金属掩膜板的张网方法及其获得的掩膜板
KR102237428B1 (ko) * 2014-02-14 2021-04-08 삼성디스플레이 주식회사 마스크 프레임 조립체 및 그 제조방법
US10022748B2 (en) * 2014-09-12 2018-07-17 Toshiba Memory Corporation Stencil mask, stencil mask manufacturing method, and imprinting method
CN104630705A (zh) * 2015-03-13 2015-05-20 合肥鑫晟光电科技有限公司 一种掩膜板及其制备方法
KR102541449B1 (ko) * 2015-12-22 2023-06-09 삼성디스플레이 주식회사 박막 증착용 마스크 어셈블리
JP6465075B2 (ja) * 2016-05-26 2019-02-06 大日本印刷株式会社 蒸着マスク、フレーム付き蒸着マスク、有機半導体素子の製造方法、及びに有機ｅｌディスプレイの製造方法
KR102366019B1 (ko) * 2016-06-28 2022-02-23 다이니폰 인사츠 가부시키가이샤 증착 마스크, 유기 반도체 소자의 제조 방법 및 유기 el 디스플레이의 제조 방법
CN205844737U (zh) * 2016-07-29 2016-12-28 昆山国显光电有限公司 掩膜板
US20180040855A1 (en) * 2016-08-04 2018-02-08 Hon Hai Precision Industry Co., Ltd. Deposition mask for making oled display panel
CN206512267U (zh) * 2016-10-28 2017-09-22 京东方科技集团股份有限公司 一种掩模片及掩模板
CN106502044B (zh) * 2017-01-10 2020-01-24 昆山国显光电有限公司 掩膜板及其制造方法
JP6304412B2 (ja) * 2017-02-06 2018-04-04 大日本印刷株式会社 金属フレーム付き蒸着マスクの製造方法、有機半導体素子の製造方法、パターンの形成方法
CN107435131B (zh) * 2017-09-29 2019-08-02 上海天马微电子有限公司 掩膜装置、蒸镀设备以及掩膜装置制备方法

Also Published As

Publication number Publication date
CN116024523A (zh) 2023-04-28
CN108456846A (zh) 2018-08-28
TWI726240B (zh) 2021-05-01
US20190345599A1 (en) 2019-11-14
KR20200028483A (ko) 2020-03-16
WO2019184205A1 (zh) 2019-10-03
EP3640365A4 (en) 2020-08-19
JP2020526670A (ja) 2020-08-31
TW201843864A (zh) 2018-12-16
EP3640365A1 (en) 2020-04-22

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