JP6965638B2 - 電子部品 - Google Patents
電子部品 Download PDFInfo
- Publication number
- JP6965638B2 JP6965638B2 JP2017166941A JP2017166941A JP6965638B2 JP 6965638 B2 JP6965638 B2 JP 6965638B2 JP 2017166941 A JP2017166941 A JP 2017166941A JP 2017166941 A JP2017166941 A JP 2017166941A JP 6965638 B2 JP6965638 B2 JP 6965638B2
- Authority
- JP
- Japan
- Prior art keywords
- conductor portion
- length
- longitudinal direction
- convex portion
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004020 conductor Substances 0.000 claims description 130
- 238000007747 plating Methods 0.000 claims description 22
- 239000002184 metal Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 238000000034 method Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 49
- 239000003990 capacitor Substances 0.000 description 35
- 238000009736 wetting Methods 0.000 description 15
- 238000005259 measurement Methods 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/248—Terminals the terminals embracing or surrounding the capacitive element, e.g. caps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Description
Claims (7)
- 直方体形状を呈していると共に、幅方向の長さに比して高さ方向の長さが大きく、かつ、前記高さ方向の長さに比して長手方向の長さが大きい素体と、
前記素体の前記幅方向での両端に配置され、前記長手方向に延びている一対の端子電極と、を備え、
前記素体は、前記高さ方向で互いに対向する一対の主面と、前記長手方向で互いに対向する一対の端面と、前記幅方向で互いに対向する一対の側面と、を有し、
前記端子電極は、前記側面上に配置されている導体部を有し、
前記導体部は、前記側面に形成されていると共に前記側面と接している焼結金属層と、前記焼結金属層に形成されていると共に前記焼結金属層と接しているめっき層とを有し、かつ、前記素体の外側に向けて突出する凸部を有し、
前記凸部は、前記長手方向の長さが前記高さ方向の長さに比して大きい、電子部品。 - 前記幅方向から見て、前記凸部は、前記導体部の中央に形成されている、請求項1に記載の電子部品。
- 前記導体部は、前記長手方向で前記端面側に位置している一対の端部領域と、各前記端部領域に前記長手方向で挟まれていると共に前記凸部が形成されている中央領域と、を含み、
前記主面に平行でかつ前記高さ方向で前記凸部よりも前記主面寄りに位置する平面で前記導体部を切断した切断面において、前記導体部の前記中央領域での厚みは、前記導体部の前記端部領域での厚みに比して厚い、請求項1又は2に記載の電子部品。 - 前記導体部の前記長手方向の長さに対する前記凸部の前記長手方向の長さの比率は、1/10〜7/10である、請求項1〜3の何れか一項に記載の電子部品。
- 前記導体部の前記高さ方向の長さに対する前記凸部の前記高さ方向の長さの比率は、1/10〜7/10である、請求項1〜4の何れか一項に記載の電子部品。
- 前記凸部では、前記導体部の厚みの増加率が変化しており、
前記導体部における前記凸部の周囲に隣接する領域では、前記導体部の厚みの増加率が略一定であり、
前記凸部の外縁は、前記導体部の厚みの変化率が変化する変化点となっている位置である、請求項1〜5の何れか一項に記載の電子部品。 - 前記凸部の外縁は、長軸が前記長手方向に延びている楕円形状である、請求項6に記載の電子部品。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017166941A JP6965638B2 (ja) | 2017-08-31 | 2017-08-31 | 電子部品 |
US16/115,890 US10811191B2 (en) | 2017-08-31 | 2018-08-29 | Electronic component |
CN201811004325.1A CN109427476B (zh) | 2017-08-31 | 2018-08-30 | 电子部件 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017166941A JP6965638B2 (ja) | 2017-08-31 | 2017-08-31 | 電子部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019046914A JP2019046914A (ja) | 2019-03-22 |
JP6965638B2 true JP6965638B2 (ja) | 2021-11-10 |
Family
ID=65437989
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017166941A Active JP6965638B2 (ja) | 2017-08-31 | 2017-08-31 | 電子部品 |
Country Status (3)
Country | Link |
---|---|
US (1) | US10811191B2 (ja) |
JP (1) | JP6965638B2 (ja) |
CN (1) | CN109427476B (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019091813A (ja) * | 2017-11-15 | 2019-06-13 | 太陽誘電株式会社 | 電子部品および電子部品実装回路基板 |
JP2019176109A (ja) * | 2018-03-29 | 2019-10-10 | 太陽誘電株式会社 | 受動部品及び電子機器 |
JP2022016002A (ja) * | 2020-07-10 | 2022-01-21 | 株式会社村田製作所 | 電子部品 |
KR20230087953A (ko) * | 2021-12-10 | 2023-06-19 | 삼성전기주식회사 | 적층 세라믹 커패시터 |
WO2023248590A1 (ja) * | 2022-06-21 | 2023-12-28 | 株式会社村田製作所 | 積層セラミックコンデンサ及び積層セラミックコンデンサの実装構造 |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09148174A (ja) * | 1995-11-24 | 1997-06-06 | Rohm Co Ltd | 積層セラミックコンデンサの構造 |
JP3307234B2 (ja) * | 1996-07-04 | 2002-07-24 | 株式会社村田製作所 | セラミック電子部品 |
JP3608308B2 (ja) * | 1996-09-25 | 2005-01-12 | 松下電器産業株式会社 | チップインダクタの製造方法 |
JP2002025850A (ja) * | 2000-07-03 | 2002-01-25 | Nec Corp | チップ部品並びにチップ立ち防止方法 |
JP2006278162A (ja) * | 2005-03-29 | 2006-10-12 | Kyocera Corp | 導体ペースト及びそれを用いた電子部品 |
JP4299292B2 (ja) * | 2005-11-08 | 2009-07-22 | Tdk株式会社 | 電子部品 |
JP4400583B2 (ja) * | 2006-03-01 | 2010-01-20 | Tdk株式会社 | 積層コンデンサ及びその製造方法 |
JP2009188121A (ja) * | 2008-02-05 | 2009-08-20 | Tdk Corp | 電子部品の製造方法 |
JP4946941B2 (ja) * | 2008-03-27 | 2012-06-06 | Tdk株式会社 | 表面実装型電子部品アレイ及びその製造方法 |
JP5267583B2 (ja) * | 2011-01-21 | 2013-08-21 | 株式会社村田製作所 | 積層セラミック電子部品 |
JP5637170B2 (ja) * | 2012-04-19 | 2014-12-10 | 株式会社村田製作所 | 積層型セラミック電子部品およびその実装構造体 |
JP2013232543A (ja) * | 2012-04-27 | 2013-11-14 | Avx Tantalum Asia Co Ltd | チップ形固体電解コンデンサ |
JP5929524B2 (ja) * | 2012-05-31 | 2016-06-08 | Tdk株式会社 | 積層コンデンサ |
KR101489815B1 (ko) * | 2013-07-11 | 2015-02-04 | 삼성전기주식회사 | 적층 세라믹 커패시터 |
JP6694235B2 (ja) * | 2015-01-29 | 2020-05-13 | Tdk株式会社 | 電子部品 |
US10074482B2 (en) * | 2015-07-27 | 2018-09-11 | Taiyo Yuden Co., Ltd. | Multi-layer ceramic electronic component having side face external electrode and method of producing the same |
JP6520610B2 (ja) * | 2015-09-25 | 2019-05-29 | Tdk株式会社 | 電子部品 |
JP6931519B2 (ja) * | 2015-10-06 | 2021-09-08 | Tdk株式会社 | 電子部品 |
JP6405328B2 (ja) * | 2016-02-26 | 2018-10-17 | 太陽誘電株式会社 | 積層セラミックコンデンサ |
JP6720660B2 (ja) * | 2016-04-12 | 2020-07-08 | 株式会社村田製作所 | 積層セラミックコンデンサ |
JP6910773B2 (ja) * | 2016-09-16 | 2021-07-28 | Tdk株式会社 | 電子部品 |
JP6634990B2 (ja) * | 2016-09-21 | 2020-01-22 | 株式会社村田製作所 | セラミック電子部品およびその実装構造 |
US10734159B2 (en) * | 2016-12-22 | 2020-08-04 | Murata Manufacturing Co., Ltd. | Multilayer ceramic capacitor and method for manufacturing multilayer ceramic capacitor |
JP2018110185A (ja) * | 2017-01-04 | 2018-07-12 | 株式会社村田製作所 | 積層セラミックコンデンサの製造方法、セラミック積層体及び積層セラミックコンデンサ |
JP7052259B2 (ja) * | 2017-08-31 | 2022-04-12 | Tdk株式会社 | 電子部品 |
JP2019091813A (ja) * | 2017-11-15 | 2019-06-13 | 太陽誘電株式会社 | 電子部品および電子部品実装回路基板 |
-
2017
- 2017-08-31 JP JP2017166941A patent/JP6965638B2/ja active Active
-
2018
- 2018-08-29 US US16/115,890 patent/US10811191B2/en active Active
- 2018-08-30 CN CN201811004325.1A patent/CN109427476B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
US10811191B2 (en) | 2020-10-20 |
CN109427476A (zh) | 2019-03-05 |
JP2019046914A (ja) | 2019-03-22 |
CN109427476B (zh) | 2020-08-04 |
US20190066925A1 (en) | 2019-02-28 |
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