JP6965144B2 - 洗浄液及びこれを製造する方法 - Google Patents

洗浄液及びこれを製造する方法 Download PDF

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Publication number
JP6965144B2
JP6965144B2 JP2017239823A JP2017239823A JP6965144B2 JP 6965144 B2 JP6965144 B2 JP 6965144B2 JP 2017239823 A JP2017239823 A JP 2017239823A JP 2017239823 A JP2017239823 A JP 2017239823A JP 6965144 B2 JP6965144 B2 JP 6965144B2
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JP
Japan
Prior art keywords
group
cleaning
cleaning solution
mass
hydroxyamine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017239823A
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English (en)
Japanese (ja)
Other versions
JP2018109154A (ja
Inventor
拓海 並木
高之 原口
宇耕 ▲呉▼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Ohka Kogyo Co Ltd
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Priority to TW106145631A priority Critical patent/TWI784995B/zh
Priority to KR1020170181303A priority patent/KR102412179B1/ko
Priority to US15/855,362 priority patent/US10597616B2/en
Publication of JP2018109154A publication Critical patent/JP2018109154A/ja
Application granted granted Critical
Publication of JP6965144B2 publication Critical patent/JP6965144B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/26—Organic compounds containing nitrogen
    • C11D3/30—Amines; Substituted amines ; Quaternized amines
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D11/00—Special methods for preparing compositions containing mixtures of detergents
    • C11D11/0094—Process for making liquid detergent compositions, e.g. slurries, pastes or gels
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
    • C23F11/14—Nitrogen-containing compounds
    • C23F11/141—Amines; Quaternary ammonium compounds
    • C23F11/142—Hydroxy amines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Wood Science & Technology (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Detergent Compositions (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
JP2017239823A 2016-12-29 2017-12-14 洗浄液及びこれを製造する方法 Active JP6965144B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW106145631A TWI784995B (zh) 2016-12-29 2017-12-26 洗淨液及製造其之方法
KR1020170181303A KR102412179B1 (ko) 2016-12-29 2017-12-27 세정액 및 이것을 제조하는 방법
US15/855,362 US10597616B2 (en) 2016-12-29 2017-12-27 Cleaning liquid and method for manufacturing the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016257442 2016-12-29
JP2016257442 2016-12-29

Publications (2)

Publication Number Publication Date
JP2018109154A JP2018109154A (ja) 2018-07-12
JP6965144B2 true JP6965144B2 (ja) 2021-11-10

Family

ID=62845084

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017239823A Active JP6965144B2 (ja) 2016-12-29 2017-12-14 洗浄液及びこれを製造する方法

Country Status (3)

Country Link
JP (1) JP6965144B2 (zh)
KR (1) KR102412179B1 (zh)
TW (1) TWI784995B (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021230026A1 (ja) * 2020-05-11 2021-11-18 株式会社ダイセル 洗浄剤組成物及び化学的機械的研磨用組成物
TWI749964B (zh) * 2020-12-24 2021-12-11 達興材料股份有限公司 鹼性清洗組合物、清洗方法和半導體製造方法
WO2022168687A1 (ja) * 2021-02-03 2022-08-11 富士フイルム株式会社 半導体基板用洗浄液

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5058405B2 (ja) * 2000-02-04 2012-10-24 東友ファインケム株式会社 電子部品洗浄液
JP4125899B2 (ja) * 2002-02-18 2008-07-30 中外写真薬品株式会社 Ｎ置換ヒドロキシルアミン誘導体の安定化剤及びｎ置換ヒドロキシルアミン誘導体の保存方法
SG178611A1 (en) * 2009-09-02 2012-03-29 Wako Pure Chem Ind Ltd Processing agent composition for semiconductor surface and method for processing semiconductor surface using same
CN103467230B (zh) * 2013-07-24 2015-11-18 金浦新材料股份有限公司 一种水溶性苯乙烯阻聚剂
JP6486652B2 (ja) * 2014-10-31 2019-03-20 東京応化工業株式会社 リソグラフィー用洗浄液、及び基板の洗浄方法
CN107208005A (zh) * 2015-01-13 2017-09-26 嘉柏微电子材料股份公司 用于在化学机械抛光后清洁半导体晶片的清洁组合物及方法

Also Published As

Publication number Publication date
KR102412179B1 (ko) 2022-06-22
TW201833317A (zh) 2018-09-16
TWI784995B (zh) 2022-12-01
KR20180078158A (ko) 2018-07-09
JP2018109154A (ja) 2018-07-12

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