JP6954954B2 - 高反射率基板構造及びその製造方法 - Google Patents
高反射率基板構造及びその製造方法 Download PDFInfo
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- JP6954954B2 JP6954954B2 JP2019099085A JP2019099085A JP6954954B2 JP 6954954 B2 JP6954954 B2 JP 6954954B2 JP 2019099085 A JP2019099085 A JP 2019099085A JP 2019099085 A JP2019099085 A JP 2019099085A JP 6954954 B2 JP6954954 B2 JP 6954954B2
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- 239000000758 substrate Substances 0.000 title claims description 141
- 238000004519 manufacturing process Methods 0.000 title claims description 48
- 239000010410 layer Substances 0.000 claims description 421
- 229910052751 metal Inorganic materials 0.000 claims description 107
- 239000002184 metal Substances 0.000 claims description 107
- 239000000463 material Substances 0.000 claims description 41
- 239000011241 protective layer Substances 0.000 claims description 40
- 238000000034 method Methods 0.000 claims description 34
- 239000012790 adhesive layer Substances 0.000 claims description 29
- 239000004642 Polyimide Substances 0.000 claims description 26
- 229920001721 polyimide Polymers 0.000 claims description 26
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 18
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 14
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 14
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 14
- 229910052709 silver Inorganic materials 0.000 claims description 14
- 239000004332 silver Substances 0.000 claims description 14
- 229920006259 thermoplastic polyimide Polymers 0.000 claims description 12
- 238000005507 spraying Methods 0.000 claims description 11
- 238000006243 chemical reaction Methods 0.000 claims description 10
- 238000009713 electroplating Methods 0.000 claims description 10
- 229920012287 polyphenylene sulfone Polymers 0.000 claims description 10
- 239000000126 substance Substances 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 238000007772 electroless plating Methods 0.000 claims description 9
- 229910052759 nickel Inorganic materials 0.000 claims description 9
- 238000004544 sputter deposition Methods 0.000 claims description 9
- 238000006467 substitution reaction Methods 0.000 claims description 9
- 238000007740 vapor deposition Methods 0.000 claims description 9
- 229920000642 polymer Polymers 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 7
- 229910052737 gold Inorganic materials 0.000 claims description 7
- 239000010931 gold Substances 0.000 claims description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 6
- 238000002834 transmittance Methods 0.000 claims description 6
- 238000007639 printing Methods 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 238000007650 screen-printing Methods 0.000 claims description 5
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- 239000011651 chromium Substances 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 229910052750 molybdenum Inorganic materials 0.000 claims description 3
- 239000011733 molybdenum Substances 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 2
- 238000009826 distribution Methods 0.000 claims description 2
- 229910052707 ruthenium Inorganic materials 0.000 claims description 2
- 239000010408 film Substances 0.000 description 14
- 239000010409 thin film Substances 0.000 description 10
- 239000011888 foil Substances 0.000 description 8
- 230000003287 optical effect Effects 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 239000000975 dye Substances 0.000 description 6
- 239000000945 filler Substances 0.000 description 6
- 239000007788 liquid Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000000605 extraction Methods 0.000 description 4
- 239000003086 colorant Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- -1 lamination Chemical compound 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 238000009823 thermal lamination Methods 0.000 description 1
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- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/52—Reflectors
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- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
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- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
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- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2008—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the reflectors, diffusers, light or heat filtering means or anti-reflective means used
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- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
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- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
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- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
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- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
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- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
- H05K3/4605—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated made from inorganic insulating material
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- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
- Optical Elements Other Than Lenses (AREA)
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Description
112:基材
114、116:金属箔層
118’:ビア
118:導電性ビア
110:フレキシブル銅張積層板
120’:導電層
120、120a、120b:パターン化回路層
120a:第1のパターン化回路層
120b:第2のパターン化回路層
130、130a、130b:第1の絶縁層、第2の絶縁層、絶縁層
130b:絶縁接着層
140:金属反射層
142:ニッケル層
150:接着層
150’:透明接着層
160:保護層
170’、170:インク層
180:接合層
S1:第1の表面
S2:第2の表面
Claims (21)
- 第1の表面と、前記第1の表面と反対の第2の表面とを有する基材と、
前記第1の表面に配設された第1のパターン化回路層と、
前記第2の表面に配設された第2のパターン化回路層と、
前記第1のパターン化回路層と、前記第1の表面の前記第1のパターン化回路層によって露出された部分とを覆う第1の絶縁層と、
前記第1の絶縁層を覆う金属反射層と、
前記第1の絶縁層と前記金属反射層の間に配設されたインク層とを備え、
前記金属反射層の反射率が実質的に85%以上であり、
前記基材を貫通して延び、前記第1のパターン化回路層及び前記第2のパターン化回路層に電気的に接続する導電性ビアをさらに備える、高反射率基板構造。 - 前記金属反射層の材料が、アルミニウム層、銀層、金層、銅層、ルテニウム層、クロム層、モリブデン層、プラチナ層、ニッケル層、鉄層、又はこれらの任意の組み合わせを含む、請求項1に記載の高反射率基板構造。
- 前記第1の絶縁層が、インク層、ポリイミド層、熱可塑性ポリイミド層、樹脂層、感光性カバーレイ(PIC)、ドライフィルムソルダーレジスト(DFSR)層、又は絶縁接着層を含む、請求項1又は2に記載の高反射率基板構造。
- 前記金属反射層を覆う保護層をさらに備える、請求項1から3のいずれかに記載の高反射率基板構造。
- 前記保護層が透明ポリマーを含み、前記透明ポリマーの耐熱温度が実質的に200℃以上であり、光透過率が実質的に80%以上である、請求項4に記載の高反射率基板構造。
- 前記保護層が、ポリイミド層、ポリフェニレンスルファイド(PPS)層、ポリフェニレンスルホン(PPSU)層、又は透明接着層を含む、請求項4に記載の高反射率基板構造。
- 第1の表面と、前記第1の表面と反対の第2の表面とを有する基材と、
前記第1の表面に配設された第1のパターン化回路層と、
前記第2の表面に配設された第2のパターン化回路層と、
前記第1のパターン化回路層と、前記第1の表面の前記第1のパターン化回路層によって露出された部分とを覆う第1の絶縁層と、
前記第1の絶縁層を覆う金属反射層と、
前記金属反射層を覆う保護層と、
前記金属反射層と前記保護層の間に配設された透明接着層と、を備え、
前記金属反射層の反射率が実質的に85%以上であり、
前記基材を貫通して延び、前記第1のパターン化回路層及び前記第2のパターン化回路層に電気的に接続する導電性ビアをさらに備える、高反射率基板構造。 - 前記第1のパターン化回路層と前記第1の絶縁層の間に配設された接着層をさらに備える、請求項1から7のいずれかに記載の高反射率基板構造。
- 前記第2のパターン化回路層及び前記第2の表面の前記第2のパターン化回路層によって露出された部分上に配設された第2の絶縁層をさらに備える、請求項1から8のいずれかに記載の高反射率基板構造。
- 第1の表面と、前記第1の表面と反対の第2の表面とを有する基材と、
前記第1の表面に配設された第1のパターン化回路層と、
前記第2の表面に配設された第2のパターン化回路層と、
前記第1のパターン化回路層と、前記第1の表面の前記第1のパターン化回路層によって露出された部分とを覆う第1の絶縁層と、
前記第1の絶縁層を覆う金属反射層と、
前記第1の絶縁層と前記金属反射層の間に配設された接合層とを備え、
前記金属反射層の反射率が実質的に85%以上であり、
前記基材を貫通して延び、前記第1のパターン化回路層及び前記第2のパターン化回路層に電気的に接続する導電性ビアをさらに備える、高反射率基板構造。 - 前記接合層が熱可塑性ポリイミド層又は接着層を含む、請求項10に記載の高反射率基板構造。
- 基材を設けること、
第1のパターン化回路層及び第2のパターン化回路層を前記基材の第1の表面及び第2の表面に形成すること、及び
第1の絶縁層及び金属反射層を前記第1のパターン化回路層及び前記第1の表面の前記第1のパターン化回路層によって露出された部分上に設けること、
前記第1の絶縁層と前記第1のパターン化回路層の間に接着層を形成することを含み、
前記金属反射層が前記第1の絶縁層を覆い、前記金属反射層の反射率が実質的に85%以上であり、
前記基材を貫通して延び、前記第1のパターン化回路層及び前記第2のパターン化回路層に電気的に接続する導電性ビアをさらに設けること、を含む、高反射率基板構造を製造する方法。 - 前記金属反射層を形成する方法が、スパッタリング、蒸着、無電解めっき、電気めっき、化学的置換反応、又は銀鏡反応を含む、請求項12に記載の高反射率基板構造を製造する方法。
- 前記金属反射層上に保護層を形成することをさらに含む、請求項12又は13に記載の高反射率基板構造を製造する方法。
- 前記第1の絶縁層及び前記金属反射層を前記第1のパターン化回路層及び前記第1の表面の前記第1のパターン化回路層によって露出された部分上に設けることが、
保護層を設けること、
前記保護層上に前記金属反射層を形成すること、及び
前記金属反射層及び前記保護層を前記第1のパターン化回路層及び前記第1の表面の前記第1のパターン化回路層によって露出された部分上に前記第1の絶縁層によって配設すること、をさらに含む、請求項12から14のいずれかに記載の高反射率基板構造を製造する方法。 - 前記第1の絶縁層が絶縁接着層である、請求項15に記載の高反射率基板構造を製造する方法。
- 前記第2のパターン化回路層及び前記第2の表面の前記第2のパターン化回路層によって露出された部分上に第2の絶縁層を形成することをさらに含む、請求項12から16のいずれかに記載の高反射率基板構造を製造する方法。
- 基材を設けること、
第1のパターン化回路層及び第2のパターン化回路層を前記基材の第1の表面及び第2の表面に形成すること、及び
第1の絶縁層及び金属反射層を前記第1のパターン化回路層及び前記第1の表面の前記第1のパターン化回路層によって露出された部分上に設けること、を含み、
前記金属反射層が前記第1の絶縁層を覆い、前記金属反射層の反射率が実質的に85%以上であり、
前記金属反射層を形成する前に前記第1の絶縁層上にインク層を形成することをさらに含み、
前記基材を貫通して延び、前記第1のパターン化回路層及び前記第2のパターン化回路層に電気的に接続する導電性ビアをさらに設けること、を含む、高反射率基板構造を製造する方法。 - 前記インク層を形成する方法が、スクリーン印刷、ジェット印刷、噴霧塗装又はフィルム貼付を含む、請求項18に記載の高反射率基板構造を製造する方法。
- 基材を設けること、
第1のパターン化回路層及び第2のパターン化回路層を前記基材の第1の表面及び第2の表面に形成すること、及び
第1の絶縁層及び金属反射層を前記第1のパターン化回路層及び前記第1の表面の前記第1のパターン化回路層によって露出された部分上に設けること、を含み、
前記金属反射層が前記第1の絶縁層を覆い、前記金属反射層の反射率が実質的に85%以上であり、
前記金属反射層を形成する前に前記第1の絶縁層上に接合層を形成することをさらに含み、
前記基材を貫通して延び、前記第1のパターン化回路層及び前記第2のパターン化回路層に電気的に接続する導電性ビアをさらに設けること、を含む、高反射率基板構造を製造する方法。 - 前記接合層を形成する方法が噴霧塗装、噴霧又は分配を含む、請求項20に記載の高反射率基板構造を製造する方法。
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CN112349214A (zh) * | 2020-10-27 | 2021-02-09 | 合肥鑫晟光电科技有限公司 | 一种微led面板、其制作方法及显示装置 |
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Family Cites Families (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4085899B2 (ja) * | 2003-06-30 | 2008-05-14 | 日立エーアイシー株式会社 | 発光デバイス用基板および発光デバイス |
CN100442551C (zh) * | 2003-09-30 | 2008-12-10 | 株式会社东芝 | 发光装置 |
KR101146208B1 (ko) * | 2003-11-14 | 2012-05-25 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 액정 표시 장치 및 그 제조 방법 |
TWI394300B (zh) * | 2007-10-24 | 2013-04-21 | Advanced Optoelectronic Tech | 光電元件之封裝結構及其製造方法 |
US7633144B1 (en) * | 2006-05-24 | 2009-12-15 | Amkor Technology, Inc. | Semiconductor package |
TWI407583B (zh) * | 2006-06-27 | 2013-09-01 | Mitsubishi Chem Corp | 照明裝置 |
JP2008009006A (ja) * | 2006-06-28 | 2008-01-17 | Reiko Co Ltd | 高反射フイルム |
US7919849B2 (en) * | 2007-04-04 | 2011-04-05 | Ibiden Co., Ltd. | Package substrate and device for optical communication |
JP4465385B2 (ja) * | 2007-12-25 | 2010-05-19 | 株式会社沖データ | Ledバックライト装置及び液晶表示装置 |
DE202009017825U1 (de) * | 2009-02-14 | 2010-09-23 | Luxexcel Holding Bv | Vorrichtung zur Lenkung von Lichtstrahlen |
KR101097431B1 (ko) * | 2009-04-28 | 2011-12-23 | 제일모직주식회사 | 디스플레이 패널용 플렉서블 기판 및 그 제조 방법 |
US20110186874A1 (en) * | 2010-02-03 | 2011-08-04 | Soraa, Inc. | White Light Apparatus and Method |
KR101129002B1 (ko) * | 2010-04-28 | 2012-03-23 | 엘지이노텍 주식회사 | 광 패키지 및 그 제조 방법 |
TWI472067B (zh) * | 2010-04-28 | 2015-02-01 | Lg Innotek Co Ltd | 光學封裝及其製造方法 |
KR101189401B1 (ko) * | 2010-12-24 | 2012-10-10 | 엘지이노텍 주식회사 | 연성 회로기판 및 그의 제조 방법 |
JP5971927B2 (ja) * | 2011-11-29 | 2016-08-17 | デクセリアルズ株式会社 | 光学体、窓材、建具、日射遮蔽装置および建築物 |
JP2013157341A (ja) * | 2012-01-05 | 2013-08-15 | Canon Components Inc | Led照明装置 |
JP6293995B2 (ja) * | 2012-03-23 | 2018-03-14 | 新光電気工業株式会社 | 発光素子搭載用パッケージ及びその製造方法、並びに発光素子パッケージ |
TWM441133U (en) * | 2012-05-10 | 2012-11-11 | Mortech Corp | A reflecting film preventing light leakage, and a led light bar and a LCD's backlight using the same |
US9385289B2 (en) * | 2012-11-28 | 2016-07-05 | Lumens Co., Ltd. | Light-emitting-device package and production method therefor |
WO2014208495A1 (ja) * | 2013-06-28 | 2014-12-31 | シチズンホールディングス株式会社 | Led装置 |
JP6273897B2 (ja) * | 2014-02-26 | 2018-02-07 | 日亜化学工業株式会社 | 接着剤塗布方法および実装基板製造方法 |
JPWO2016143201A1 (ja) * | 2015-03-06 | 2018-01-18 | コニカミノルタ株式会社 | 透明電極とその製造方法及び有機エレクトロルミネッセンス素子 |
JP6659993B2 (ja) * | 2015-07-27 | 2020-03-04 | 大日本印刷株式会社 | Led素子用のフレキシブル基板 |
US10132967B2 (en) * | 2015-11-02 | 2018-11-20 | Kawasaki Jukogyo Kabushiki Kaisha | Metal gloss design member |
TWI577251B (zh) * | 2015-12-01 | 2017-04-01 | 同泰電子科技股份有限公司 | 軟硬複合線路板及其製作方法 |
TWI604763B (zh) * | 2016-11-18 | 2017-11-01 | 同泰電子科技股份有限公司 | 軟硬複合板結構 |
JP6495229B2 (ja) * | 2016-12-21 | 2019-04-03 | 日鉄ケミカル&マテリアル株式会社 | 基材フィルムの製造方法 |
JP7083683B2 (ja) * | 2017-04-25 | 2022-06-13 | 株式会社ジャパンディスプレイ | 液晶表示装置 |
US10483445B2 (en) * | 2017-08-31 | 2019-11-19 | Nichia Corporation | Lead frame, package for light emitting device, light emitting device, and method for manufacturing light emitting device |
TWI684835B (zh) * | 2018-12-25 | 2020-02-11 | 同泰電子科技股份有限公司 | 具有高反射率的基板結構及其製作方法 |
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