JP6949882B2 - 液体材料または粘性材料を基材上にディスペンスするためのシステム及び方法 - Google Patents

液体材料または粘性材料を基材上にディスペンスするためのシステム及び方法 Download PDF

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Publication number
JP6949882B2
JP6949882B2 JP2018564380A JP2018564380A JP6949882B2 JP 6949882 B2 JP6949882 B2 JP 6949882B2 JP 2018564380 A JP2018564380 A JP 2018564380A JP 2018564380 A JP2018564380 A JP 2018564380A JP 6949882 B2 JP6949882 B2 JP 6949882B2
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Prior art keywords
substrate
regions
height
applicator
electronic substrate
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JP2018564380A
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English (en)
Japanese (ja)
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JP2019517387A (ja
JP2019517387A5 (enExample
Inventor
ペール オルラ−イェンセン
ペール オルラ−イェンセン
ケネス エス エスペンシード
ケネス エス エスペンシード
パトリック ティー ホーガン
パトリック ティー ホーガン
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Nordson Corp
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Nordson Corp
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Publication of JP2019517387A5 publication Critical patent/JP2019517387A5/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
    • H05K13/0853—Determination of transport trajectories inside mounting machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/16—Programme controls
    • B25J9/1694—Programme controls characterised by use of sensors other than normal servo-feedback from position, speed or acceleration sensors, perception control, multi-sensor controlled systems, sensor fusion
    • B25J9/1697—Vision controlled systems
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0469—Surface mounting by applying a glue or viscous material
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/40—Robotics, robotics mapping to robotics vision
    • G05B2219/40425—Sensing, vision based motion planning
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/40—Robotics, robotics mapping to robotics vision
    • G05B2219/40476—Collision, planning for collision free path
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45235—Dispensing adhesive, solder paste, for pcb
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/49—Nc machine tool, till multiple
    • G05B2219/49154—Detect position of slide to change hover height of tool to avoid collision
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S901/00—Robots
    • Y10S901/30—End effector
    • Y10S901/41—Tool
    • Y10S901/43—Spray painting or coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Operations Research (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Spray Control Apparatus (AREA)
  • Computer Hardware Design (AREA)
JP2018564380A 2016-06-08 2017-06-01 液体材料または粘性材料を基材上にディスペンスするためのシステム及び方法 Active JP6949882B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/176,570 2016-06-08
US15/176,570 US10881005B2 (en) 2016-06-08 2016-06-08 Methods for dispensing a liquid or viscous material onto a substrate
PCT/US2017/035357 WO2017213946A1 (en) 2016-06-08 2017-06-01 Systems and methods for dispensing a liquid or viscous material onto a substrate

Publications (3)

Publication Number Publication Date
JP2019517387A JP2019517387A (ja) 2019-06-24
JP2019517387A5 JP2019517387A5 (enExample) 2020-07-09
JP6949882B2 true JP6949882B2 (ja) 2021-10-13

Family

ID=59270110

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018564380A Active JP6949882B2 (ja) 2016-06-08 2017-06-01 液体材料または粘性材料を基材上にディスペンスするためのシステム及び方法

Country Status (6)

Country Link
US (1) US10881005B2 (enExample)
EP (2) EP4210447A1 (enExample)
JP (1) JP6949882B2 (enExample)
KR (1) KR102389974B1 (enExample)
CN (1) CN109479393B (enExample)
WO (1) WO2017213946A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018192551A (ja) * 2017-05-16 2018-12-06 セイコーエプソン株式会社 制御装置、ロボットおよびロボットシステム
CN115463806A (zh) * 2022-08-04 2022-12-13 东莞市慧视智能科技有限公司 一种速度可控的点胶方法及点胶系统
CN115463804A (zh) * 2022-08-04 2022-12-13 东莞市慧视智能科技有限公司 一种基于点胶路径的点胶方法
CN116351666B (zh) * 2023-04-24 2024-04-30 歌尔股份有限公司 点胶方法和点胶设备

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US5328085A (en) * 1992-08-18 1994-07-12 Precision Dispensing Equipment, Inc. Apparatus for applying flux
JP3222334B2 (ja) * 1994-10-19 2001-10-29 ヤマハ発動機株式会社 表面実装機における認識用ノズル高さ調整方法及び同装置
AU7262496A (en) * 1995-10-13 1997-04-30 Nordson Corporation Flip chip underfill system and method
JPH09314015A (ja) * 1996-05-28 1997-12-09 Matsushita Electric Ind Co Ltd 粘性流体塗布装置
US6132809A (en) * 1997-01-16 2000-10-17 Precision Valve & Automation, Inc. Conformal coating using multiple applications
US6093251A (en) * 1997-02-21 2000-07-25 Speedline Technologies, Inc. Apparatus for measuring the height of a substrate in a dispensing system
WO2002046713A2 (en) * 2000-12-08 2002-06-13 Cyberoptics Corporation Automated system with improved height sensing
US7150791B2 (en) * 2001-03-29 2006-12-19 Nordson Corporation Floating head liquid dispenser with dispensing head sensor
US7256833B2 (en) * 2002-05-22 2007-08-14 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Method and apparatus for automatically optimizing optical contrast in automated equipment
US7028867B2 (en) 2003-10-30 2006-04-18 Nordson Corporation Conformal coating applicator and method
US20050095366A1 (en) * 2003-10-31 2005-05-05 Liang Fang Method of conformal coating using noncontact dispensing
US7404861B2 (en) * 2004-04-23 2008-07-29 Speedline Technologies, Inc. Imaging and inspection system for a dispenser and method for same
TW200800411A (en) * 2006-06-28 2008-01-01 Nordson Corp Conformal coating system with closed loop control
JP2008010554A (ja) * 2006-06-28 2008-01-17 Yamaha Motor Co Ltd 基板の処理装置および部品実装システム
US8004860B2 (en) * 2006-08-29 2011-08-23 Texas Instruments Incorporated Radiofrequency and electromagnetic interference shielding
US20080099515A1 (en) * 2006-10-11 2008-05-01 Nordson Corporation Thin line conformal coating apparatus and method
JP4576372B2 (ja) * 2006-10-31 2010-11-04 富士機械製造株式会社 電子部品保持装置および電子部品装着システム
US20080166490A1 (en) * 2007-01-09 2008-07-10 Nordson Corporation Closed-loop bubble elimination system and methods for applying a conformal coating material to a substrate
US8173906B2 (en) * 2007-02-07 2012-05-08 Raytheon Company Environmental protection coating system and method
US8765212B2 (en) * 2007-09-21 2014-07-01 Nordson Corporation Methods for continuously moving a fluid dispenser while dispensing amounts of a fluid material
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US8115117B2 (en) * 2009-06-22 2012-02-14 General Electric Company System and method of forming isolated conformal shielding areas
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JP6587832B2 (ja) * 2015-05-26 2019-10-09 アルファーデザイン株式会社 液体吐出装置、スプレーパス設定方法、プログラム

Also Published As

Publication number Publication date
JP2019517387A (ja) 2019-06-24
WO2017213946A1 (en) 2017-12-14
US10881005B2 (en) 2020-12-29
EP3469864A1 (en) 2019-04-17
KR102389974B1 (ko) 2022-04-26
CN109479393A (zh) 2019-03-15
KR20190015752A (ko) 2019-02-14
EP4210447A1 (en) 2023-07-12
US20170359901A1 (en) 2017-12-14
CN109479393B (zh) 2021-12-28

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