KR102389974B1 - 액체 또는 점성 재료를 기판상에 분배하기 위한 시스템들 및 방법들 - Google Patents

액체 또는 점성 재료를 기판상에 분배하기 위한 시스템들 및 방법들 Download PDF

Info

Publication number
KR102389974B1
KR102389974B1 KR1020197000274A KR20197000274A KR102389974B1 KR 102389974 B1 KR102389974 B1 KR 102389974B1 KR 1020197000274 A KR1020197000274 A KR 1020197000274A KR 20197000274 A KR20197000274 A KR 20197000274A KR 102389974 B1 KR102389974 B1 KR 102389974B1
Authority
KR
South Korea
Prior art keywords
electronic substrate
regions
applicator
substrate
sub
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020197000274A
Other languages
English (en)
Korean (ko)
Other versions
KR20190015752A (ko
Inventor
퍼 올라-젠센
케네스 에스. 에스펜시드
패트릭 티. 호간
Original Assignee
노드슨 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 노드슨 코포레이션 filed Critical 노드슨 코포레이션
Publication of KR20190015752A publication Critical patent/KR20190015752A/ko
Application granted granted Critical
Publication of KR102389974B1 publication Critical patent/KR102389974B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/16—Programme controls
    • B25J9/1694—Programme controls characterised by use of sensors other than normal servo-feedback from position, speed or acceleration sensors, perception control, multi-sensor controlled systems, sensor fusion
    • B25J9/1697—Vision controlled systems
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0469—Surface mounting by applying a glue or viscous material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
    • H05K13/0853—Determination of transport trajectories inside mounting machines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/40—Robotics, robotics mapping to robotics vision
    • G05B2219/40425—Sensing, vision based motion planning
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/40—Robotics, robotics mapping to robotics vision
    • G05B2219/40476—Collision, planning for collision free path
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45235—Dispensing adhesive, solder paste, for pcb
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/49—Nc machine tool, till multiple
    • G05B2219/49154—Detect position of slide to change hover height of tool to avoid collision
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S901/00—Robots
    • Y10S901/30—End effector
    • Y10S901/41—Tool
    • Y10S901/43—Spray painting or coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Operations Research (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Spray Control Apparatus (AREA)
  • Computer Hardware Design (AREA)
KR1020197000274A 2016-06-08 2017-06-01 액체 또는 점성 재료를 기판상에 분배하기 위한 시스템들 및 방법들 Active KR102389974B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/176,570 2016-06-08
US15/176,570 US10881005B2 (en) 2016-06-08 2016-06-08 Methods for dispensing a liquid or viscous material onto a substrate
PCT/US2017/035357 WO2017213946A1 (en) 2016-06-08 2017-06-01 Systems and methods for dispensing a liquid or viscous material onto a substrate

Publications (2)

Publication Number Publication Date
KR20190015752A KR20190015752A (ko) 2019-02-14
KR102389974B1 true KR102389974B1 (ko) 2022-04-26

Family

ID=59270110

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020197000274A Active KR102389974B1 (ko) 2016-06-08 2017-06-01 액체 또는 점성 재료를 기판상에 분배하기 위한 시스템들 및 방법들

Country Status (6)

Country Link
US (1) US10881005B2 (enExample)
EP (2) EP4210447A1 (enExample)
JP (1) JP6949882B2 (enExample)
KR (1) KR102389974B1 (enExample)
CN (1) CN109479393B (enExample)
WO (1) WO2017213946A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018192551A (ja) * 2017-05-16 2018-12-06 セイコーエプソン株式会社 制御装置、ロボットおよびロボットシステム
CN115463806A (zh) * 2022-08-04 2022-12-13 东莞市慧视智能科技有限公司 一种速度可控的点胶方法及点胶系统
CN115463804A (zh) * 2022-08-04 2022-12-13 东莞市慧视智能科技有限公司 一种基于点胶路径的点胶方法
CN116351666B (zh) * 2023-04-24 2024-04-30 歌尔股份有限公司 点胶方法和点胶设备

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014103258A (ja) * 2012-11-20 2014-06-05 Alpha- Design Kk 液体吐出装置、スプレーパス設定方法、プログラム

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5328085A (en) * 1992-08-18 1994-07-12 Precision Dispensing Equipment, Inc. Apparatus for applying flux
JP3222334B2 (ja) * 1994-10-19 2001-10-29 ヤマハ発動機株式会社 表面実装機における認識用ノズル高さ調整方法及び同装置
AU7262496A (en) * 1995-10-13 1997-04-30 Nordson Corporation Flip chip underfill system and method
JPH09314015A (ja) * 1996-05-28 1997-12-09 Matsushita Electric Ind Co Ltd 粘性流体塗布装置
US6132809A (en) * 1997-01-16 2000-10-17 Precision Valve & Automation, Inc. Conformal coating using multiple applications
US6093251A (en) * 1997-02-21 2000-07-25 Speedline Technologies, Inc. Apparatus for measuring the height of a substrate in a dispensing system
WO2002046713A2 (en) * 2000-12-08 2002-06-13 Cyberoptics Corporation Automated system with improved height sensing
US7150791B2 (en) * 2001-03-29 2006-12-19 Nordson Corporation Floating head liquid dispenser with dispensing head sensor
US7256833B2 (en) * 2002-05-22 2007-08-14 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Method and apparatus for automatically optimizing optical contrast in automated equipment
US7028867B2 (en) 2003-10-30 2006-04-18 Nordson Corporation Conformal coating applicator and method
US20050095366A1 (en) * 2003-10-31 2005-05-05 Liang Fang Method of conformal coating using noncontact dispensing
US7404861B2 (en) * 2004-04-23 2008-07-29 Speedline Technologies, Inc. Imaging and inspection system for a dispenser and method for same
TW200800411A (en) * 2006-06-28 2008-01-01 Nordson Corp Conformal coating system with closed loop control
JP2008010554A (ja) * 2006-06-28 2008-01-17 Yamaha Motor Co Ltd 基板の処理装置および部品実装システム
US8004860B2 (en) * 2006-08-29 2011-08-23 Texas Instruments Incorporated Radiofrequency and electromagnetic interference shielding
US20080099515A1 (en) * 2006-10-11 2008-05-01 Nordson Corporation Thin line conformal coating apparatus and method
JP4576372B2 (ja) * 2006-10-31 2010-11-04 富士機械製造株式会社 電子部品保持装置および電子部品装着システム
US20080166490A1 (en) * 2007-01-09 2008-07-10 Nordson Corporation Closed-loop bubble elimination system and methods for applying a conformal coating material to a substrate
US8173906B2 (en) * 2007-02-07 2012-05-08 Raytheon Company Environmental protection coating system and method
US8765212B2 (en) * 2007-09-21 2014-07-01 Nordson Corporation Methods for continuously moving a fluid dispenser while dispensing amounts of a fluid material
US20090107398A1 (en) * 2007-10-31 2009-04-30 Nordson Corporation Fluid dispensers and methods for dispensing viscous fluids with improved edge definition
JP5525190B2 (ja) * 2009-06-10 2014-06-18 株式会社日立製作所 塗布装置及び塗布方法
US8115117B2 (en) * 2009-06-22 2012-02-14 General Electric Company System and method of forming isolated conformal shielding areas
US9962728B2 (en) 2012-09-20 2018-05-08 Te Connectivity Corporation Fluid dispensing machine and method of dispensing fluid
US8944001B2 (en) * 2013-02-18 2015-02-03 Nordson Corporation Automated position locator for a height sensor in a dispensing system
US10082417B2 (en) * 2013-12-30 2018-09-25 Nordson Corporation Calibration methods for a viscous fluid dispensing system
US9707584B2 (en) * 2014-07-09 2017-07-18 Nordson Corporation Dual applicator fluid dispensing methods and systems
US9205562B1 (en) 2014-08-29 2015-12-08 Google Inc. Integration of depth points into a height map
KR102340828B1 (ko) * 2014-10-23 2021-12-17 삼성전자주식회사 인쇄회로기판 어셈블리 제조 방법
JP6587832B2 (ja) * 2015-05-26 2019-10-09 アルファーデザイン株式会社 液体吐出装置、スプレーパス設定方法、プログラム

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014103258A (ja) * 2012-11-20 2014-06-05 Alpha- Design Kk 液体吐出装置、スプレーパス設定方法、プログラム

Also Published As

Publication number Publication date
JP2019517387A (ja) 2019-06-24
WO2017213946A1 (en) 2017-12-14
US10881005B2 (en) 2020-12-29
EP3469864A1 (en) 2019-04-17
CN109479393A (zh) 2019-03-15
JP6949882B2 (ja) 2021-10-13
KR20190015752A (ko) 2019-02-14
EP4210447A1 (en) 2023-07-12
US20170359901A1 (en) 2017-12-14
CN109479393B (zh) 2021-12-28

Similar Documents

Publication Publication Date Title
KR102389974B1 (ko) 액체 또는 점성 재료를 기판상에 분배하기 위한 시스템들 및 방법들
JP6990931B2 (ja) 液体材料塗布装置
US10646889B2 (en) Methods for continuously moving a fluid dispenser while dispensing amounts of a fluid material
Nisser et al. LaserFactory: a laser cutter-based electromechanical assembly and fabrication platform to make functional devices & robots
CA2027731C (en) Apparatus and method for creating three-dimensional objects
JP3712927B2 (ja) ペースト塗布機
KR101445586B1 (ko) 이동 프로그램을 작성하는 프로그램이 기억된 기억 매체 및 장치
EP1479451A2 (en) Viscous material noncontact jetting system
US20210197225A1 (en) Systems and methods for enhanced coating dispensing controls
US10562054B2 (en) Automatically controlling a liquid spray pattern
JP2009532243A (ja) 押出装置における端部の自動較正
US12105499B2 (en) Method and apparatus for positional reference in an automated manufacturing system
CN114833040A (zh) 一种涂胶方法及新能源电驱动端盖涂胶设备
US20050095366A1 (en) Method of conformal coating using noncontact dispensing
CN208357158U (zh) 点胶机
CN105690767A (zh) 一种可应用于3d打印的机器人
Horiashchenko et al. Mechatronic System for Management and Control of a Device for Applying a Polymer Coating

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20190104

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20200601

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20210726

Patent event code: PE09021S01D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20220119

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20220420

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20220421

End annual number: 3

Start annual number: 1

PG1601 Publication of registration