JP2019517387A5 - - Google Patents

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Publication number
JP2019517387A5
JP2019517387A5 JP2018564380A JP2018564380A JP2019517387A5 JP 2019517387 A5 JP2019517387 A5 JP 2019517387A5 JP 2018564380 A JP2018564380 A JP 2018564380A JP 2018564380 A JP2018564380 A JP 2018564380A JP 2019517387 A5 JP2019517387 A5 JP 2019517387A5
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Japan
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JP2018564380A
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Japanese (ja)
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JP2019517387A (ja
JP6949882B2 (ja
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Priority claimed from US15/176,570 external-priority patent/US10881005B2/en
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JP2018564380A 2016-06-08 2017-06-01 液体材料または粘性材料を基材上にディスペンスするためのシステム及び方法 Active JP6949882B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/176,570 2016-06-08
US15/176,570 US10881005B2 (en) 2016-06-08 2016-06-08 Methods for dispensing a liquid or viscous material onto a substrate
PCT/US2017/035357 WO2017213946A1 (en) 2016-06-08 2017-06-01 Systems and methods for dispensing a liquid or viscous material onto a substrate

Publications (3)

Publication Number Publication Date
JP2019517387A JP2019517387A (ja) 2019-06-24
JP2019517387A5 true JP2019517387A5 (enExample) 2020-07-09
JP6949882B2 JP6949882B2 (ja) 2021-10-13

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ID=59270110

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018564380A Active JP6949882B2 (ja) 2016-06-08 2017-06-01 液体材料または粘性材料を基材上にディスペンスするためのシステム及び方法

Country Status (6)

Country Link
US (1) US10881005B2 (enExample)
EP (2) EP4210447A1 (enExample)
JP (1) JP6949882B2 (enExample)
KR (1) KR102389974B1 (enExample)
CN (1) CN109479393B (enExample)
WO (1) WO2017213946A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018192551A (ja) * 2017-05-16 2018-12-06 セイコーエプソン株式会社 制御装置、ロボットおよびロボットシステム
CN115463806A (zh) * 2022-08-04 2022-12-13 东莞市慧视智能科技有限公司 一种速度可控的点胶方法及点胶系统
CN115463804A (zh) * 2022-08-04 2022-12-13 东莞市慧视智能科技有限公司 一种基于点胶路径的点胶方法
CN116351666B (zh) * 2023-04-24 2024-04-30 歌尔股份有限公司 点胶方法和点胶设备

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JP3222334B2 (ja) * 1994-10-19 2001-10-29 ヤマハ発動機株式会社 表面実装機における認識用ノズル高さ調整方法及び同装置
AU7262496A (en) * 1995-10-13 1997-04-30 Nordson Corporation Flip chip underfill system and method
JPH09314015A (ja) * 1996-05-28 1997-12-09 Matsushita Electric Ind Co Ltd 粘性流体塗布装置
US6132809A (en) * 1997-01-16 2000-10-17 Precision Valve & Automation, Inc. Conformal coating using multiple applications
US6093251A (en) * 1997-02-21 2000-07-25 Speedline Technologies, Inc. Apparatus for measuring the height of a substrate in a dispensing system
WO2002046713A2 (en) * 2000-12-08 2002-06-13 Cyberoptics Corporation Automated system with improved height sensing
US7150791B2 (en) * 2001-03-29 2006-12-19 Nordson Corporation Floating head liquid dispenser with dispensing head sensor
US7256833B2 (en) * 2002-05-22 2007-08-14 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Method and apparatus for automatically optimizing optical contrast in automated equipment
US7028867B2 (en) 2003-10-30 2006-04-18 Nordson Corporation Conformal coating applicator and method
US20050095366A1 (en) * 2003-10-31 2005-05-05 Liang Fang Method of conformal coating using noncontact dispensing
US7404861B2 (en) * 2004-04-23 2008-07-29 Speedline Technologies, Inc. Imaging and inspection system for a dispenser and method for same
TW200800411A (en) * 2006-06-28 2008-01-01 Nordson Corp Conformal coating system with closed loop control
JP2008010554A (ja) * 2006-06-28 2008-01-17 Yamaha Motor Co Ltd 基板の処理装置および部品実装システム
US8004860B2 (en) * 2006-08-29 2011-08-23 Texas Instruments Incorporated Radiofrequency and electromagnetic interference shielding
US20080099515A1 (en) * 2006-10-11 2008-05-01 Nordson Corporation Thin line conformal coating apparatus and method
JP4576372B2 (ja) * 2006-10-31 2010-11-04 富士機械製造株式会社 電子部品保持装置および電子部品装着システム
US20080166490A1 (en) * 2007-01-09 2008-07-10 Nordson Corporation Closed-loop bubble elimination system and methods for applying a conformal coating material to a substrate
US8173906B2 (en) * 2007-02-07 2012-05-08 Raytheon Company Environmental protection coating system and method
US8765212B2 (en) * 2007-09-21 2014-07-01 Nordson Corporation Methods for continuously moving a fluid dispenser while dispensing amounts of a fluid material
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JP5525190B2 (ja) * 2009-06-10 2014-06-18 株式会社日立製作所 塗布装置及び塗布方法
US8115117B2 (en) * 2009-06-22 2012-02-14 General Electric Company System and method of forming isolated conformal shielding areas
US9962728B2 (en) 2012-09-20 2018-05-08 Te Connectivity Corporation Fluid dispensing machine and method of dispensing fluid
JP6240383B2 (ja) * 2012-11-20 2017-11-29 アルファーデザイン株式会社 液体吐出装置、スプレーパス設定方法、プログラム
US8944001B2 (en) * 2013-02-18 2015-02-03 Nordson Corporation Automated position locator for a height sensor in a dispensing system
US10082417B2 (en) * 2013-12-30 2018-09-25 Nordson Corporation Calibration methods for a viscous fluid dispensing system
US9707584B2 (en) * 2014-07-09 2017-07-18 Nordson Corporation Dual applicator fluid dispensing methods and systems
US9205562B1 (en) 2014-08-29 2015-12-08 Google Inc. Integration of depth points into a height map
KR102340828B1 (ko) * 2014-10-23 2021-12-17 삼성전자주식회사 인쇄회로기판 어셈블리 제조 방법
JP6587832B2 (ja) * 2015-05-26 2019-10-09 アルファーデザイン株式会社 液体吐出装置、スプレーパス設定方法、プログラム

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