JP6948873B2 - 測定器を較正する方法、及び、ケース - Google Patents

測定器を較正する方法、及び、ケース Download PDF

Info

Publication number
JP6948873B2
JP6948873B2 JP2017148031A JP2017148031A JP6948873B2 JP 6948873 B2 JP6948873 B2 JP 6948873B2 JP 2017148031 A JP2017148031 A JP 2017148031A JP 2017148031 A JP2017148031 A JP 2017148031A JP 6948873 B2 JP6948873 B2 JP 6948873B2
Authority
JP
Japan
Prior art keywords
sensor electrodes
measuring instrument
reference planes
sensor
case
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017148031A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019027944A (ja
JP2019027944A5 (enExample
Inventor
吉平 杉田
吉平 杉田
朋秀 南
朋秀 南
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2017148031A priority Critical patent/JP6948873B2/ja
Priority to US16/045,910 priority patent/US10837810B2/en
Priority to TW107125983A priority patent/TWI794259B/zh
Priority to CN201810842703.7A priority patent/CN109324303B/zh
Priority to KR1020180088373A priority patent/KR102636225B1/ko
Publication of JP2019027944A publication Critical patent/JP2019027944A/ja
Publication of JP2019027944A5 publication Critical patent/JP2019027944A5/ja
Application granted granted Critical
Publication of JP6948873B2 publication Critical patent/JP6948873B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D18/00—Testing or calibrating apparatus or arrangements provided for in groups G01D1/00 - G01D15/00
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R35/00—Testing or calibrating of apparatus covered by the other groups of this subclass
    • G01R35/005—Calibrating; Standards or reference devices, e.g. voltage or resistance standards, "golden" references
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G01D11/245—Housings for sensors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D18/00—Testing or calibrating apparatus or arrangements provided for in groups G01D1/00 - G01D15/00
    • G01D18/001—Calibrating encoders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32174—Circuits specially adapted for controlling the RF discharge
    • H01J37/32183—Matching circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0421—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
    • G01D5/14—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage
    • G01D5/24—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/002—Cooling arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/245—Detection characterised by the variable being measured
    • H01J2237/24564—Measurements of electric or magnetic variables, e.g. voltage, current, frequency
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0454—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers surrounding a central transfer chamber

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Drying Of Semiconductors (AREA)
JP2017148031A 2017-07-31 2017-07-31 測定器を較正する方法、及び、ケース Active JP6948873B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2017148031A JP6948873B2 (ja) 2017-07-31 2017-07-31 測定器を較正する方法、及び、ケース
US16/045,910 US10837810B2 (en) 2017-07-31 2018-07-26 Method for calibrating measuring device and case used in the calibration method
TW107125983A TWI794259B (zh) 2017-07-31 2018-07-27 校正測量器之方法及箱
CN201810842703.7A CN109324303B (zh) 2017-07-31 2018-07-27 对测定器进行校准的方法和箱体
KR1020180088373A KR102636225B1 (ko) 2017-07-31 2018-07-30 측정기를 교정하는 방법 및 케이스

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017148031A JP6948873B2 (ja) 2017-07-31 2017-07-31 測定器を較正する方法、及び、ケース

Publications (3)

Publication Number Publication Date
JP2019027944A JP2019027944A (ja) 2019-02-21
JP2019027944A5 JP2019027944A5 (enExample) 2020-07-16
JP6948873B2 true JP6948873B2 (ja) 2021-10-13

Family

ID=65038540

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017148031A Active JP6948873B2 (ja) 2017-07-31 2017-07-31 測定器を較正する方法、及び、ケース

Country Status (5)

Country Link
US (1) US10837810B2 (enExample)
JP (1) JP6948873B2 (enExample)
KR (1) KR102636225B1 (enExample)
CN (1) CN109324303B (enExample)
TW (1) TWI794259B (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11468590B2 (en) * 2018-04-24 2022-10-11 Cyberoptics Corporation Wireless substrate-like teaching sensor for semiconductor processing
US10782157B2 (en) * 2018-06-26 2020-09-22 Faurecia Automotive Seating, Llc Analog signal conditioning with diagnostics for capacitive sensor elements
JP7038621B2 (ja) * 2018-07-20 2022-03-18 東京エレクトロン株式会社 位置測定装置および位置測定方法
CN110560892B (zh) * 2019-07-09 2020-05-22 济南邦德激光股份有限公司 一种基于激光切管设备的管材识别方法及装置
CN111261565B (zh) * 2020-01-21 2023-11-14 北京北方华创微电子装备有限公司 一种半导体设备及其晶圆传输腔室和晶圆传输方法
JP7418241B2 (ja) * 2020-02-27 2024-01-19 東京エレクトロン株式会社 位置決め装置、処理システム及び位置決め方法
JP7445532B2 (ja) * 2020-06-15 2024-03-07 東京エレクトロン株式会社 実行装置及び実行方法
TWI741715B (zh) * 2020-08-03 2021-10-01 矽品精密工業股份有限公司 承載裝置
CN114613657B (zh) * 2020-12-09 2025-11-07 细美事有限公司 用于晶片型传感器的充电和自动校准的控制程序、容器及半导体元件制造设备
KR102584512B1 (ko) 2020-12-31 2023-10-05 세메스 주식회사 버퍼 유닛 및 온도 변화가 수반되는 기판 지지 부재의 수평 측정용 기판형 센서의 보관 방법
JP7630420B2 (ja) * 2021-12-27 2025-02-17 東京エレクトロン株式会社 測定器
KR102543728B1 (ko) * 2022-07-20 2023-06-14 주식회사 위트코퍼레이션 에지 영역의 특성 측정이 가능한 모니터링 기기 및 이를 제조하는 방법

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5432457A (en) * 1994-01-28 1995-07-11 Northrop Grumman Corporation Capacitive disk probe
TW364951B (en) * 1996-11-25 1999-07-21 Nohken Co Ltd Electrostatic capacitor inspection apparatus
JP4249448B2 (ja) * 2001-09-06 2009-04-02 東京エレクトロン株式会社 容量計の校正方法、校正用標準容量ボックス、静電容量の測定方法、容量測定用ボックス及び容量計
CN100474551C (zh) * 2006-08-23 2009-04-01 北京北方微电子基地设备工艺研究中心有限责任公司 定位校准装置及定位校准系统
JP2008241642A (ja) * 2007-03-29 2008-10-09 Dainippon Screen Mfg Co Ltd 表面電位計
JP4956328B2 (ja) 2007-08-24 2012-06-20 東京エレクトロン株式会社 搬送アームの移動位置の調整方法及び位置検出用治具
US20110128014A1 (en) * 2008-06-05 2011-06-02 Martin Roy Harrison Position sensor
US9245786B2 (en) * 2011-06-02 2016-01-26 Applied Materials, Inc. Apparatus and methods for positioning a substrate using capacitive sensors
DE102011078369B4 (de) 2011-06-29 2013-02-28 Ident Technology Ag Kapazitive Sensoreinrichtung sowie Verfahren zum Kalibrieren einer kapazitiven Sensoreinrichtung
US9146207B2 (en) * 2012-01-10 2015-09-29 Hzo, Inc. Methods, apparatuses and systems for sensing exposure of electronic devices to moisture
KR101356774B1 (ko) * 2012-03-12 2014-01-27 최성훈 보정 지그 장치
US9425112B2 (en) * 2012-06-07 2016-08-23 Taiwan Semiconductor Manufacturing Company, Ltd. Calibration kits for RF passive devices
WO2014057843A1 (ja) * 2012-10-11 2014-04-17 株式会社クリエイティブ テクノロジー ワーク保持装置及びこれを用いたワークの横ずれ検出方法
WO2015105531A1 (en) * 2014-01-08 2015-07-16 Hzo, Inc. Methods, apparatuses and systems for sensing exposure of electronic devices to moisture
CN105097601A (zh) * 2014-04-17 2015-11-25 北京北方微电子基地设备工艺研究中心有限责任公司 晶片校准装置以及半导体加工设备
DE112015005942B4 (de) * 2015-01-13 2026-04-02 Sumitomo Riko Company Limited Kapazitätsmessvorrichtung, kapazitätstypartige Flachsensoreinrichtung und kapazitätstypartige Flüssigkeitspegeldetektionseinrichtung
KR102307737B1 (ko) 2015-06-11 2021-10-01 도쿄엘렉트론가부시키가이샤 정전 용량 측정용의 센서 칩 및 센서 칩을 구비한 측정기
JP6537433B2 (ja) * 2015-06-11 2019-07-03 東京エレクトロン株式会社 静電容量測定用のセンサチップ及び同センサチップを備えた測定器

Also Published As

Publication number Publication date
JP2019027944A (ja) 2019-02-21
KR20190013634A (ko) 2019-02-11
TWI794259B (zh) 2023-03-01
US10837810B2 (en) 2020-11-17
KR102636225B1 (ko) 2024-02-13
CN109324303B (zh) 2021-05-28
US20190033103A1 (en) 2019-01-31
CN109324303A (zh) 2019-02-12
TW201913135A (zh) 2019-04-01

Similar Documents

Publication Publication Date Title
KR102636225B1 (ko) 측정기를 교정하는 방법 및 케이스
TWI781253B (zh) 獲得測量器之偏離量的方法以及校正處理系統之搬送位置資料的方法
TWI794563B (zh) 搬送方法及搬送系統
JP6832207B2 (ja) 静電容量測定用の測定器
KR102307737B1 (ko) 정전 용량 측정용의 센서 칩 및 센서 칩을 구비한 측정기
JP7037964B2 (ja) 測定器、及びフォーカスリングを検査するためのシステムの動作方法
US12222379B2 (en) Measuring instrument and measuring method
TW202507908A (zh) 測定器及測定方法
JP7029983B2 (ja) 測定器及び測定器のずれ量を求める方法
JP2020190539A (ja) 測定器及び測定方法
JP2023121729A (ja) 測定方法、測定器及び測定システム
JP2022068582A (ja) 搬送位置データの較正方法
JP7572862B2 (ja) 測定器及び測定方法
JP2024036972A (ja) 測定方法
KR20230125758A (ko) 측정 방법, 측정기 및 측정 시스템
JP2025121117A (ja) 測定器の調整方法
CN116626397A (zh) 测定方法、测定器及测定系统
TW202443769A (zh) 測定方法、測定系統及測定器

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20200528

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20200528

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20210405

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20210511

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20210514

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20210824

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20210921

R150 Certificate of patent or registration of utility model

Ref document number: 6948873

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250