TWI794259B - 校正測量器之方法及箱 - Google Patents

校正測量器之方法及箱 Download PDF

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Publication number
TWI794259B
TWI794259B TW107125983A TW107125983A TWI794259B TW I794259 B TWI794259 B TW I794259B TW 107125983 A TW107125983 A TW 107125983A TW 107125983 A TW107125983 A TW 107125983A TW I794259 B TWI794259 B TW I794259B
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TW
Taiwan
Prior art keywords
sensing electrodes
complex
box
measuring instrument
measuring device
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Application number
TW107125983A
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English (en)
Chinese (zh)
Other versions
TW201913135A (zh
Inventor
杉田吉平
南朋秀
Original Assignee
日商東京威力科創股份有限公司
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Publication of TW201913135A publication Critical patent/TW201913135A/zh
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Publication of TWI794259B publication Critical patent/TWI794259B/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R35/00—Testing or calibrating of apparatus covered by the other groups of this subclass
    • G01R35/005—Calibrating; Standards or reference devices, e.g. voltage or resistance standards, "golden" references
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D18/00—Testing or calibrating apparatus or arrangements provided for in groups G01D1/00 - G01D15/00
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G01D11/245—Housings for sensors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D18/00—Testing or calibrating apparatus or arrangements provided for in groups G01D1/00 - G01D15/00
    • G01D18/001—Calibrating encoders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32174—Circuits specially adapted for controlling the RF discharge
    • H01J37/32183—Matching circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0421—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
    • G01D5/14—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage
    • G01D5/24—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/002—Cooling arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/245—Detection characterised by the variable being measured
    • H01J2237/24564—Measurements of electric or magnetic variables, e.g. voltage, current, frequency
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0454—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers surrounding a central transfer chamber

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Drying Of Semiconductors (AREA)
TW107125983A 2017-07-31 2018-07-27 校正測量器之方法及箱 TWI794259B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017148031A JP6948873B2 (ja) 2017-07-31 2017-07-31 測定器を較正する方法、及び、ケース
JP2017-148031 2017-07-31

Publications (2)

Publication Number Publication Date
TW201913135A TW201913135A (zh) 2019-04-01
TWI794259B true TWI794259B (zh) 2023-03-01

Family

ID=65038540

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107125983A TWI794259B (zh) 2017-07-31 2018-07-27 校正測量器之方法及箱

Country Status (5)

Country Link
US (1) US10837810B2 (enExample)
JP (1) JP6948873B2 (enExample)
KR (1) KR102636225B1 (enExample)
CN (1) CN109324303B (enExample)
TW (1) TWI794259B (enExample)

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US11468590B2 (en) * 2018-04-24 2022-10-11 Cyberoptics Corporation Wireless substrate-like teaching sensor for semiconductor processing
US10782157B2 (en) * 2018-06-26 2020-09-22 Faurecia Automotive Seating, Llc Analog signal conditioning with diagnostics for capacitive sensor elements
JP7038621B2 (ja) * 2018-07-20 2022-03-18 東京エレクトロン株式会社 位置測定装置および位置測定方法
CN110560892B (zh) * 2019-07-09 2020-05-22 济南邦德激光股份有限公司 一种基于激光切管设备的管材识别方法及装置
CN111261565B (zh) * 2020-01-21 2023-11-14 北京北方华创微电子装备有限公司 一种半导体设备及其晶圆传输腔室和晶圆传输方法
JP7418241B2 (ja) * 2020-02-27 2024-01-19 東京エレクトロン株式会社 位置決め装置、処理システム及び位置決め方法
JP7445532B2 (ja) * 2020-06-15 2024-03-07 東京エレクトロン株式会社 実行装置及び実行方法
TWI741715B (zh) * 2020-08-03 2021-10-01 矽品精密工業股份有限公司 承載裝置
CN114613657B (zh) * 2020-12-09 2025-11-07 细美事有限公司 用于晶片型传感器的充电和自动校准的控制程序、容器及半导体元件制造设备
KR102584512B1 (ko) 2020-12-31 2023-10-05 세메스 주식회사 버퍼 유닛 및 온도 변화가 수반되는 기판 지지 부재의 수평 측정용 기판형 센서의 보관 방법
JP7630420B2 (ja) * 2021-12-27 2025-02-17 東京エレクトロン株式会社 測定器
KR102543728B1 (ko) * 2022-07-20 2023-06-14 주식회사 위트코퍼레이션 에지 영역의 특성 측정이 가능한 모니터링 기기 및 이를 제조하는 방법

Citations (4)

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US5432457A (en) * 1994-01-28 1995-07-11 Northrop Grumman Corporation Capacitive disk probe
TW364951B (en) * 1996-11-25 1999-07-21 Nohken Co Ltd Electrostatic capacitor inspection apparatus
TW200902991A (en) * 2007-03-29 2009-01-16 Dainippon Screen Mfg Surface voltmeter
US20150001200A1 (en) * 2012-01-10 2015-01-01 Hzo, Inc. Methods, apparatuses and systems for sensing exposure of electronic devices to moisture

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JP4249448B2 (ja) * 2001-09-06 2009-04-02 東京エレクトロン株式会社 容量計の校正方法、校正用標準容量ボックス、静電容量の測定方法、容量測定用ボックス及び容量計
CN100474551C (zh) * 2006-08-23 2009-04-01 北京北方微电子基地设备工艺研究中心有限责任公司 定位校准装置及定位校准系统
JP4956328B2 (ja) 2007-08-24 2012-06-20 東京エレクトロン株式会社 搬送アームの移動位置の調整方法及び位置検出用治具
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CN105097601A (zh) * 2014-04-17 2015-11-25 北京北方微电子基地设备工艺研究中心有限责任公司 晶片校准装置以及半导体加工设备
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KR102307737B1 (ko) 2015-06-11 2021-10-01 도쿄엘렉트론가부시키가이샤 정전 용량 측정용의 센서 칩 및 센서 칩을 구비한 측정기
JP6537433B2 (ja) * 2015-06-11 2019-07-03 東京エレクトロン株式会社 静電容量測定用のセンサチップ及び同センサチップを備えた測定器

Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
US5432457A (en) * 1994-01-28 1995-07-11 Northrop Grumman Corporation Capacitive disk probe
TW364951B (en) * 1996-11-25 1999-07-21 Nohken Co Ltd Electrostatic capacitor inspection apparatus
TW200902991A (en) * 2007-03-29 2009-01-16 Dainippon Screen Mfg Surface voltmeter
US20150001200A1 (en) * 2012-01-10 2015-01-01 Hzo, Inc. Methods, apparatuses and systems for sensing exposure of electronic devices to moisture

Also Published As

Publication number Publication date
JP2019027944A (ja) 2019-02-21
KR20190013634A (ko) 2019-02-11
US10837810B2 (en) 2020-11-17
JP6948873B2 (ja) 2021-10-13
KR102636225B1 (ko) 2024-02-13
CN109324303B (zh) 2021-05-28
US20190033103A1 (en) 2019-01-31
CN109324303A (zh) 2019-02-12
TW201913135A (zh) 2019-04-01

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