JP6944197B2 - 金属表面上のエッチレジストパターンの製造方法 - Google Patents

金属表面上のエッチレジストパターンの製造方法 Download PDF

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Publication number
JP6944197B2
JP6944197B2 JP2018515364A JP2018515364A JP6944197B2 JP 6944197 B2 JP6944197 B2 JP 6944197B2 JP 2018515364 A JP2018515364 A JP 2018515364A JP 2018515364 A JP2018515364 A JP 2018515364A JP 6944197 B2 JP6944197 B2 JP 6944197B2
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component
reactive polymer
polymer component
reactive
etch resist
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Japanese (ja)
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JP2018519677A (ja
JP2018519677A5 (enExample
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フレンケル、モシェ
シュパイスマン、ナバ
Original Assignee
カティーバ， インコーポレイテッド
カティーバ， インコーポレイテッド
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/54—Inks based on two liquids, one liquid being the ink, the other liquid being a reaction solution, a fixer or a treatment solution for the ink
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • ing And Chemical Polishing (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
JP2018515364A 2015-06-04 2016-06-02 金属表面上のエッチレジストパターンの製造方法 Active JP6944197B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201562170713P 2015-06-04 2015-06-04
US62/170,713 2015-06-04
PCT/IL2016/050567 WO2016193978A2 (en) 2015-06-04 2016-06-02 Methods for producing an etch resist pattern on a metallic surface

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2019092613A Division JP7083500B2 (ja) 2015-06-04 2019-05-16 金属表面上のエッチレジストパターンの製造方法

Publications (3)

Publication Number Publication Date
JP2018519677A JP2018519677A (ja) 2018-07-19
JP2018519677A5 JP2018519677A5 (enExample) 2019-08-22
JP6944197B2 true JP6944197B2 (ja) 2021-10-06

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Family Applications (4)

Application Number Title Priority Date Filing Date
JP2018515364A Active JP6944197B2 (ja) 2015-06-04 2016-06-02 金属表面上のエッチレジストパターンの製造方法
JP2019092613A Active JP7083500B2 (ja) 2015-06-04 2019-05-16 金属表面上のエッチレジストパターンの製造方法
JP2022020846A Active JP7426735B2 (ja) 2015-06-04 2022-02-14 金属表面上のエッチレジストパターンの製造方法
JP2024004871A Active JP7713254B2 (ja) 2015-06-04 2024-01-16 金属表面上のエッチレジストパターンの製造方法

Family Applications After (3)

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JP2019092613A Active JP7083500B2 (ja) 2015-06-04 2019-05-16 金属表面上のエッチレジストパターンの製造方法
JP2022020846A Active JP7426735B2 (ja) 2015-06-04 2022-02-14 金属表面上のエッチレジストパターンの製造方法
JP2024004871A Active JP7713254B2 (ja) 2015-06-04 2024-01-16 金属表面上のエッチレジストパターンの製造方法

Country Status (6)

Country Link
US (4) US10743420B2 (enExample)
EP (1) EP3304197A4 (enExample)
JP (4) JP6944197B2 (enExample)
KR (3) KR20250043600A (enExample)
CN (2) CN107710070B (enExample)
WO (1) WO2016193978A2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3304197A4 (en) * 2015-06-04 2019-01-23 Kateeva, Inc. METHOD FOR PRODUCING AN ESTETRESIST PATTERN ON A METALLIC SURFACE
KR102626521B1 (ko) 2015-08-13 2024-01-17 카티바, 인크. 금속 표면 상에 에치 레지스트 패턴을 형성하는 방법
TWI886572B (zh) * 2016-12-12 2025-06-11 美商凱特伊夫公司 蝕刻導電特徵之方法
US10398034B2 (en) 2016-12-12 2019-08-27 Kateeva, Inc. Methods of etching conductive features, and related devices and systems
KR102028920B1 (ko) * 2017-11-28 2019-10-07 이현주 금속 발색 방법
KR20220127272A (ko) * 2020-01-13 2022-09-19 카티바, 인크. 잉크젯 인쇄 회로 기판

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Also Published As

Publication number Publication date
KR20180015193A (ko) 2018-02-12
EP3304197A4 (en) 2019-01-23
CN107710070A (zh) 2018-02-16
US12414239B2 (en) 2025-09-09
JP2018519677A (ja) 2018-07-19
US20250374437A1 (en) 2025-12-04
CN113597123B (zh) 2025-02-14
US20230189447A1 (en) 2023-06-15
WO2016193978A3 (en) 2017-01-12
US10743420B2 (en) 2020-08-11
US11606863B2 (en) 2023-03-14
JP2022079453A (ja) 2022-05-26
KR102787541B1 (ko) 2025-03-26
JP7713254B2 (ja) 2025-07-25
JP7426735B2 (ja) 2024-02-02
JP2024045238A (ja) 2024-04-02
CN107710070B (zh) 2021-07-13
KR102628632B1 (ko) 2024-01-23
US20200396842A1 (en) 2020-12-17
KR20250043600A (ko) 2025-03-28
CN113597123A (zh) 2021-11-02
WO2016193978A2 (en) 2016-12-08
US20180146556A1 (en) 2018-05-24
KR20240014607A (ko) 2024-02-01
JP7083500B2 (ja) 2022-06-13
EP3304197A2 (en) 2018-04-11
JP2019134190A (ja) 2019-08-08

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