CN107710070B - 用于在金属表面上产生抗蚀刻图案的方法及其组合物组 - Google Patents

用于在金属表面上产生抗蚀刻图案的方法及其组合物组 Download PDF

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Publication number
CN107710070B
CN107710070B CN201680038043.6A CN201680038043A CN107710070B CN 107710070 B CN107710070 B CN 107710070B CN 201680038043 A CN201680038043 A CN 201680038043A CN 107710070 B CN107710070 B CN 107710070B
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China
Prior art keywords
etch
polymer component
resistant
reactive polymer
composition
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CN201680038043.6A
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Chinese (zh)
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CN107710070A (zh
Inventor
摩西·夫伦克尔
纳瓦·什帕斯曼
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Kedihua Display Technology Shaoxing Co ltd
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Jet Cu Pcb Ltd
Kateeva Inc
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Priority to CN202110700960.9A priority Critical patent/CN113597123B/zh
Publication of CN107710070A publication Critical patent/CN107710070A/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/54—Inks based on two liquids, one liquid being the ink, the other liquid being a reaction solution, a fixer or a treatment solution for the ink
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • ing And Chemical Polishing (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
CN201680038043.6A 2015-06-04 2016-06-02 用于在金属表面上产生抗蚀刻图案的方法及其组合物组 Active CN107710070B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110700960.9A CN113597123B (zh) 2015-06-04 2016-06-02 用于在金属表面上产生抗蚀刻图案的方法及其组合物组

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201562170713P 2015-06-04 2015-06-04
US62/170,713 2015-06-04
PCT/IL2016/050567 WO2016193978A2 (en) 2015-06-04 2016-06-02 Methods for producing an etch resist pattern on a metallic surface

Related Child Applications (1)

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CN202110700960.9A Division CN113597123B (zh) 2015-06-04 2016-06-02 用于在金属表面上产生抗蚀刻图案的方法及其组合物组

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CN107710070A CN107710070A (zh) 2018-02-16
CN107710070B true CN107710070B (zh) 2021-07-13

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US (4) US10743420B2 (enExample)
EP (1) EP3304197A4 (enExample)
JP (4) JP6944197B2 (enExample)
KR (3) KR20250043600A (enExample)
CN (2) CN107710070B (enExample)
WO (1) WO2016193978A2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3304197A4 (en) * 2015-06-04 2019-01-23 Kateeva, Inc. METHOD FOR PRODUCING AN ESTETRESIST PATTERN ON A METALLIC SURFACE
KR102626521B1 (ko) 2015-08-13 2024-01-17 카티바, 인크. 금속 표면 상에 에치 레지스트 패턴을 형성하는 방법
TWI886572B (zh) * 2016-12-12 2025-06-11 美商凱特伊夫公司 蝕刻導電特徵之方法
US10398034B2 (en) 2016-12-12 2019-08-27 Kateeva, Inc. Methods of etching conductive features, and related devices and systems
KR102028920B1 (ko) * 2017-11-28 2019-10-07 이현주 금속 발색 방법
KR20220127272A (ko) * 2020-01-13 2022-09-19 카티바, 인크. 잉크젯 인쇄 회로 기판

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KR20180015193A (ko) 2018-02-12
EP3304197A4 (en) 2019-01-23
CN107710070A (zh) 2018-02-16
US12414239B2 (en) 2025-09-09
JP2018519677A (ja) 2018-07-19
US20250374437A1 (en) 2025-12-04
CN113597123B (zh) 2025-02-14
US20230189447A1 (en) 2023-06-15
WO2016193978A3 (en) 2017-01-12
US10743420B2 (en) 2020-08-11
US11606863B2 (en) 2023-03-14
JP2022079453A (ja) 2022-05-26
KR102787541B1 (ko) 2025-03-26
JP7713254B2 (ja) 2025-07-25
JP7426735B2 (ja) 2024-02-02
JP2024045238A (ja) 2024-04-02
JP6944197B2 (ja) 2021-10-06
KR102628632B1 (ko) 2024-01-23
US20200396842A1 (en) 2020-12-17
KR20250043600A (ko) 2025-03-28
CN113597123A (zh) 2021-11-02
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