JP6937549B2 - 発光素子の製造装置 - Google Patents

発光素子の製造装置 Download PDF

Info

Publication number
JP6937549B2
JP6937549B2 JP2016115945A JP2016115945A JP6937549B2 JP 6937549 B2 JP6937549 B2 JP 6937549B2 JP 2016115945 A JP2016115945 A JP 2016115945A JP 2016115945 A JP2016115945 A JP 2016115945A JP 6937549 B2 JP6937549 B2 JP 6937549B2
Authority
JP
Japan
Prior art keywords
substrate
port
transfer machine
processed
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016115945A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017220410A (ja
JP2017220410A5 (https=
Inventor
孝明 石川
孝明 石川
孝明 上村
孝明 上村
教行 平田
教行 平田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Display Inc
Original Assignee
Japan Display Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Display Inc filed Critical Japan Display Inc
Priority to JP2016115945A priority Critical patent/JP6937549B2/ja
Priority to TW106112151A priority patent/TWI655799B/zh
Priority to US15/599,788 priority patent/US10269597B2/en
Priority to KR1020170064177A priority patent/KR101952814B1/ko
Priority to CN201911155469.1A priority patent/CN110828349A/zh
Priority to CN201710391405.6A priority patent/CN107492602B/zh
Priority to CN201910608870.XA priority patent/CN110246789B/zh
Publication of JP2017220410A publication Critical patent/JP2017220410A/ja
Priority to KR1020190020467A priority patent/KR102059069B1/ko
Publication of JP2017220410A5 publication Critical patent/JP2017220410A5/ja
Application granted granted Critical
Publication of JP6937549B2 publication Critical patent/JP6937549B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41865—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • H10K50/125—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers specially adapted for multicolour light emission, e.g. for emitting white light
    • H10K50/13—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers specially adapted for multicolour light emission, e.g. for emitting white light comprising stacked EL layers within one EL unit
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/14—Carrier transporting layers
    • H10K50/15—Hole transporting layers
    • H10K50/157—Hole transporting layers between the light-emitting layer and the cathode
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/14—Carrier transporting layers
    • H10K50/16—Electron transporting layers
    • H10K50/167—Electron transporting layers between the light-emitting layer and the anode
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0438—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0444—Apparatus for wiring semiconductor or solid-state device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0456—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0461—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the presence of two or more transfer chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0478—Apparatus for manufacture or treatment the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
JP2016115945A 2016-06-10 2016-06-10 発光素子の製造装置 Active JP6937549B2 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2016115945A JP6937549B2 (ja) 2016-06-10 2016-06-10 発光素子の製造装置
TW106112151A TWI655799B (zh) 2016-06-10 2017-04-12 發光元件之製造裝置及製造方法
US15/599,788 US10269597B2 (en) 2016-06-10 2017-05-19 Manufacturing apparatus of light-emitting element
KR1020170064177A KR101952814B1 (ko) 2016-06-10 2017-05-24 발광 소자의 제조 장치 및 그 제조 방법
CN201911155469.1A CN110828349A (zh) 2016-06-10 2017-05-27 发光元件的制造装置
CN201710391405.6A CN107492602B (zh) 2016-06-10 2017-05-27 发光元件的制造装置和制造方法
CN201910608870.XA CN110246789B (zh) 2016-06-10 2017-05-27 发光元件的制造方法
KR1020190020467A KR102059069B1 (ko) 2016-06-10 2019-02-21 발광 소자의 제조 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016115945A JP6937549B2 (ja) 2016-06-10 2016-06-10 発光素子の製造装置

Publications (3)

Publication Number Publication Date
JP2017220410A JP2017220410A (ja) 2017-12-14
JP2017220410A5 JP2017220410A5 (https=) 2019-07-11
JP6937549B2 true JP6937549B2 (ja) 2021-09-22

Family

ID=60572988

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016115945A Active JP6937549B2 (ja) 2016-06-10 2016-06-10 発光素子の製造装置

Country Status (5)

Country Link
US (1) US10269597B2 (https=)
JP (1) JP6937549B2 (https=)
KR (2) KR101952814B1 (https=)
CN (3) CN107492602B (https=)
TW (1) TWI655799B (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6830772B2 (ja) * 2016-08-04 2021-02-17 株式会社ジャパンディスプレイ 積層膜の製造装置、及び積層膜の製造方法
CN110544660B (zh) * 2018-08-02 2022-08-16 北京北方华创微电子装备有限公司 模块化晶圆传输系统和半导体设备
JP7240980B2 (ja) * 2019-07-29 2023-03-16 東京エレクトロン株式会社 基板処理装置及び基板搬送方法
JP7759192B2 (ja) * 2020-05-12 2025-10-23 エーエスエム・アイピー・ホールディング・ベー・フェー 高スループットマルチチャンバ基材処理システム
US20240057462A1 (en) * 2020-12-25 2024-02-15 Semiconductor Energy Laboratory Co., Ltd. Manufacturing equipment of display device

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07211762A (ja) * 1994-01-13 1995-08-11 Hitachi Ltd ウエハ搬送処理装置
US5934856A (en) * 1994-05-23 1999-08-10 Tokyo Electron Limited Multi-chamber treatment system
JP3783099B2 (ja) * 2000-05-16 2006-06-07 株式会社豊田中央研究所 有機電界発光素子
DE10061882C1 (de) * 2000-12-12 2002-05-29 Georg Bollig Dünnband-Gießanlage
JP4078813B2 (ja) * 2001-06-12 2008-04-23 ソニー株式会社 成膜装置および成膜方法
US8900366B2 (en) * 2002-04-15 2014-12-02 Samsung Display Co., Ltd. Apparatus for depositing a multilayer coating on discrete sheets
US20040035360A1 (en) * 2002-05-17 2004-02-26 Semiconductor Energy Laboratory Co., Ltd. Manufacturing apparatus
US20040040504A1 (en) * 2002-08-01 2004-03-04 Semiconductor Energy Laboratory Co., Ltd. Manufacturing apparatus
JP2004288463A (ja) 2003-03-20 2004-10-14 Semiconductor Energy Lab Co Ltd 製造装置
US20040206307A1 (en) * 2003-04-16 2004-10-21 Eastman Kodak Company Method and system having at least one thermal transfer station for making OLED displays
EP1717339A2 (de) * 2005-04-20 2006-11-02 Applied Films GmbH & Co. KG Kontinuierliche Beschichtungsanlage
JP5051869B2 (ja) * 2006-06-14 2012-10-17 東京エレクトロン株式会社 発光素子および発光素子の製造方法
JP5051870B2 (ja) * 2006-06-14 2012-10-17 東京エレクトロン株式会社 発光素子の製造装置および発光素子の製造方法
JP4712731B2 (ja) * 2007-01-25 2011-06-29 株式会社アルバック 搬送ロボット、真空装置
WO2008141106A1 (en) * 2007-05-09 2008-11-20 Applied Materials, Inc. Transfer chamber with vacuum extension for shutter disks
US9353436B2 (en) 2008-03-05 2016-05-31 Applied Materials, Inc. Coating apparatus with rotation module
WO2009109464A1 (en) * 2008-03-05 2009-09-11 Applied Materials Inc. Coating apparatus with rotation module
JP4934619B2 (ja) * 2008-03-17 2012-05-16 株式会社アルバック 有機ｅｌ製造装置及び有機ｅｌ製造方法
US8070408B2 (en) * 2008-08-27 2011-12-06 Applied Materials, Inc. Load lock chamber for large area substrate processing system
JP4954162B2 (ja) 2008-08-29 2012-06-13 東京エレクトロン株式会社 処理システム
TWI424784B (zh) * 2008-09-04 2014-01-21 日立全球先端科技股份有限公司 Organic electroluminescent device manufacturing apparatus, manufacturing method thereof, film forming apparatus and film forming method
JP5476171B2 (ja) * 2010-03-16 2014-04-23 株式会社日立ハイテクノロジーズ 真空処理装置
JP5427099B2 (ja) * 2010-04-23 2014-02-26 西部電機株式会社 板状物の搬送システム
JP5551625B2 (ja) * 2011-01-13 2014-07-16 東京エレクトロン株式会社 基板処理装置及び基板処理方法
TWI719331B (zh) * 2011-10-26 2021-02-21 美商布魯克斯自動機械公司 基板處理系統
KR20130074307A (ko) * 2011-12-26 2013-07-04 엘아이지에이디피 주식회사 척킹 및 디척킹 장치부를 갖는 유기발광소자 양산 시스템
JP2013251416A (ja) * 2012-05-31 2013-12-12 Tokyo Electron Ltd 積層膜の製造方法及び真空処理装置
KR101971199B1 (ko) * 2012-09-21 2019-08-14 삼성디스플레이 주식회사 유기층 증착 장치, 유기 발광 표시 장치 및 유기 발광 표시 장치 제조 방법
US20170092899A1 (en) * 2014-03-21 2017-03-30 Stefan Bangert Evaporation source for organic material

Also Published As

Publication number Publication date
CN107492602B (zh) 2019-12-20
US10269597B2 (en) 2019-04-23
JP2017220410A (ja) 2017-12-14
CN107492602A (zh) 2017-12-19
CN110246789A (zh) 2019-09-17
KR20170140075A (ko) 2017-12-20
TW201810763A (zh) 2018-03-16
KR102059069B1 (ko) 2019-12-24
TWI655799B (zh) 2019-04-01
CN110828349A (zh) 2020-02-21
KR101952814B1 (ko) 2019-02-28
US20170358469A1 (en) 2017-12-14
KR20190020014A (ko) 2019-02-27
CN110246789B (zh) 2023-05-23

Similar Documents

Publication Publication Date Title
JP6830772B2 (ja) 積層膜の製造装置、及び積層膜の製造方法
JP6937549B2 (ja) 発光素子の製造装置
US8802488B2 (en) Substrate depositing system and depositing method using the same
JP7148587B2 (ja) 成膜装置、および電子デバイスの製造方法
CN110387526A (zh) 处理体收纳装置、处理体收纳方法及蒸镀方法
JP2009170282A (ja) 基板処理装置および有機エレクトロルミネッセンス装置の製造方法
KR101409808B1 (ko) 기판처리시스템
KR101700608B1 (ko) 기판처리장치
KR101225212B1 (ko) Ｏｌｅｄ제조장치 및 방법
WO2011040538A1 (ja) 基板処理システム
KR102413664B1 (ko) 클러스터 증착 시스템
KR101586259B1 (ko) 증착 장치
KR101175988B1 (ko) 기판처리장치 및 방법
JP2009218384A (ja) 基板処理装置および有機エレクトロルミネッセンス装置の製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20190605

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20190605

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20200522

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20200728

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20200925

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20201119

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20210105

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20210305

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20210428

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20210803

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20210831

R150 Certificate of patent or registration of utility model

Ref document number: 6937549

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313113

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250