JP2017220410A - 積層膜の製造装置、及び積層膜の製造方法 - Google Patents
積層膜の製造装置、及び積層膜の製造方法 Download PDFInfo
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Abstract
Description
Claims (21)
- 第1受渡室を介して接続された、第1及び第2移載機を有する主搬送路と、
前記第1又は第2移載機に接続された第2受渡室、及び前記第2受渡室に接続された搬送室とを有し、前記主搬送路と交差する方向に延在する副搬送路と、
前記搬送室に接続された複数の処理室と、を有し、
前記第1及び第2移載機と、前記第1受渡室と、前記第2受渡室と、が接続された領域は、連続した真空環境であることを特徴とする、発光素子の製造装置。 - 前記第1移載機又は前記第2移載機は、
前記第1受渡室が接続される第1ポートと、前記第2受渡室が接続される第2ポートと、被処理基板を格納するバッファが接続される第3ポートと、を有し、
前記バッファは、前記第3ポートを介して接続される前記第1又は前記第2移載機と連続した真空環境であることを特徴とする、請求項1記載の発光素子の製造装置。 - 第1受渡室を介して接続された、第1及び第2移載機を有する主搬送路と、
前記主搬送路に交差する方向に、前記第1又は第2移載機から、第2受渡室を介して接続された搬送室と、
前記搬送室に接続された複数の処理室と、を有し、
前記第1移載機又は前記第2移載機は、前記第1受渡室が接続される第1ポートと、前記第2受渡室が接続される第2ポートと、被処理基板を格納するバッファが接続される第3ポートと、を有し、
前記搬送室は、前記第2受渡室が接続される第4ポート、及び前記複数の処理室の一が接続される第5ポートと、を有し、
前記第1受渡室は、少なくとも二つが並行して設けられていることを特徴とする、発光素子の製造装置。 - 前記第1乃至第3ポートは、前記第1又は前記第2移載機を中心に放射状に配置され、
前記第1又は前記第2移載機の、隣接しない2箇所に前記第1ポートが配置され、
前記第1又は前記第2移載機の、前記第1ポートが配置された箇所を除く、隣接しない2箇所に前記第2ポートが配置され、
前記第1ポートと前記第2ポートとの間に前記第3ポートが配置されることを特徴とする、請求項2又は請求項3記載の発光素子の製造装置。 - 前記複数の処理室はそれぞれ、前記搬送室を中心に、放射状に接続されることを特徴とする、請求項1又は請求項3に記載の発光素子の製造装置。
- 前記第1乃至第3ポートはそれぞれ、気密性を有することを特徴とする、請求項2記載の発光素子の製造装置。
- 前記第1乃至第5ポートはそれぞれ、気密性を有することを特徴とする、請求項3又は請求項4記載の発光素子の製造装置。
- 前記主搬送路上の末端に位置する前記第1又は前記第2移載機の前記第1ポートに、基板投入取出口をさらに有し、
処理前の前記被処理基板の投入と、処理済の前記被処理基板の取り出しは、いずれも前記基板投入取出口を介して行われることを特徴とする、請求項2乃至請求項7のいずれか一に記載の発光素子の製造装置。 - 前記主搬送路上の一の末端に位置する前記第1又は前記第2移載機の前記第1ポートに、基板投入口をさらに有し、
前記主搬送路上の他の末端に位置する前記第1又は前記第2移載機の前記第1ポートに、基板取出口をさらに有し、
処理前の前記被処理基板の投入は、前記基板投入口を介して行われ、処理済の前記被処理基板の取り出しは、前記基板取出口を介して行われることを特徴とする、請求項2乃至請求項7のいずれか一に記載の発光素子の製造装置。 - 前記主搬送路上の他の移載機の一の前記第1ポートの一に、基板投入取出口をさらに有し、
前記基板投入取出口は、前記主搬送路上の前記移載機の他の一の前記第1ポートの一と接続され、
前記主搬送路は、前記第1移載機、前記第1受渡室、前記第2移載機、前記他の移載機の一、及び前記基板投入取出口を通る環状経路を有し、
処理前の前記被処理基板の投入と、処理済の前記被処理基板の取り出しは、いずれも前記基板投入取出口を介して行われることを特徴とする、請求項2乃至請求項7のいずれか一に記載の発光素子の製造装置。 - 前記主搬送路は、一筆書き形状であることを特徴とする、請求項1乃至請求項10のいずれか一に記載の発光素子の製造装置。
- 前記第1受渡室は、前記第1及び前記第2移載機の間に複数並列に接続されることを特徴とする、請求項1乃至請求項11のいずれか一に記載の発光素子の製造装置。
- 前記第1受渡室は、前記主搬送路と前記副搬送路とが交差する箇所に設けられ、
被処理基板を主搬送路から前記副搬送路へ、あるいは前記副搬送路から主搬送路へ移動させるように構成されることを特徴とする、請求項1乃至請求項11のいずれか一に記載の発光素子の製造装置。 - 第1受渡室を介して接続された、第1及び第2移載機を有する主搬送路と、
前記主搬送路に交差する方向に、前記第1移載機から、第2受渡室を介して接続された第1搬送室と、
前記主搬送路に交差する方向に、前記第2移載機から、第3受渡室を介して接続された第2搬送室と、
前記第1搬送室に接続された第1処理室と、
前記第2搬送室に接続された第2処理室と、を有する発光素子の製造装置を用いた発光素子の製造方法であって、
絶縁表面上に、画素電極と、前記画素電極の端部を覆うと共に、前記画素電極の一部を露出するバンクと、を有する被処理基板を用意し、
前記被処理基板を、製造装置の主搬送路上に設けられた第1移載機に搬入し、
前記被処理基板を、前記第1移載機から、前記第2受渡室を介して第1搬送室に搬入し、
前記被処理基板を、前記第1搬送室から前記第1搬送室に接続された第1処理室に搬入し、
前記画素電極及び前記バンク上に第1有機層を形成し、
前記被処理基板を、前記第1処理室から前記第1搬送室に戻し、
前記被処理基板を、前記第1搬送室から前記第2受渡室を介して前記第1移載機に戻し、
前記被処理基板を、前記第1移載機から前記主搬送路上に設けられた第2移載機に搬入し、
前記被処理基板を、前記第2移載機から、前記第3受渡室を介して第2搬送室に搬入し、
前記被処理基板を、前記第2搬送室から前記第2搬送室に接続された第2処理室に搬入し、
前記第1有機層上の、前記画素電極に重畳する領域に第2有機層を形成し、
前記被処理基板を、前記第2処理室から前記第2搬送室に戻し、
前記被処理基板を、前記第2搬送室から、前記第3受渡室を介して前記第2移載機に戻す工程を含み、
前記被処理基板は、前記主搬送路、前記第2受渡室、前記第1搬送室、前記第1処理室、前記第3受渡室、前記第2搬送室、及び前記第2処理室を通じて連続した真空環境下に置かれることを特徴とする、発光素子の製造方法。 - 前記第1搬送室に接続された、第3処理室をさらに有し、
前記第2有機層の形成後、
前記被処理基板を、前記第2移載機から前記第1移載機に搬入し、
前記被処理基板を、前記第1移載機から、前記第1副搬送路を介して前記第1搬送室に搬入し、
前記被処理基板を、前記第1搬送室から前記第3処理室に搬入し、
前記第1有機層及び前記第2有機層上に第3有機層を形成する工程をさらに含み、
前記被処理基板は、前記第3処理室において真空環境下に置かれることを特徴とする、請求項14記載の発光素子の製造方法。 - 前記主搬送路上で、前記第1移載機又は前記第2移載機に、第4受渡室を介して接続された第3移載機と、
前記主搬送路に交差する方向に、前記第3移載機から、第5受渡室を介して接続された第3搬送室と、
前記第3搬送室に接続された、第3処理室をさらに有し、
前記第2有機層の形成後、
前記被処理基板を、前記第2移載機から前記第3移載機に搬入し、
前記被処理基板を、前記第3移載機から、前記第5受渡室を介して前記第3搬送室に搬入し、
前記被処理基板を、前記第3搬送室から前記第3処理室に搬入し、
前記第1有機層及び前記第2有機層上に第3有機層を形成する工程をさらに含み、
前記被処理基板は、前記第4受渡室、前記第5受渡室、前記第3搬送室、及び前記第3処理室において真空環境下に置かれることを特徴とする、請求項14記載の発光素子の製造方法。 - 前記第1有機層は、前記発光素子のホール輸送層又は電子輸送層を含むことを特徴とする、請求項14記載の発光素子の製造方法。
- 前記第2有機層は、前記発光素子の発光層を含むことを特徴とする、請求項14記載の発光素子の製造方法。
- 前記第1有機層は、前記発光素子のホール輸送層又は電子輸送層のいずれか一方を含み、
前記第3有機層は、前記発光素子のホール輸送層又は電子輸送層の他方を含むことを特徴とする、請求項15又は請求項16記載の発光素子の製造方法。 - 前記第1移載機又は前記第2移載機に接続されたバッファを有し、
前記第1移載機又は前記第2移載機から前記バッファに前記被処理基板を搬入する工程をさらに含むことを特徴とする、請求項14記載の発光素子の製造方法。 - 前記第1移載機、前記第2移載機、及び前記第3移載機のいずれか一に接続されたバッファを有し、
前記第1移載機、前記第2移載機、及び前記第3移載機のいずれか一から前記バッファに前記被処理基板を搬入する工程をさらに含むことを特徴とする、請求項16記載の発光素子の製造方法。
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