TWI655799B - 發光元件之製造裝置及製造方法 - Google Patents

發光元件之製造裝置及製造方法 Download PDF

Info

Publication number
TWI655799B
TWI655799B TW106112151A TW106112151A TWI655799B TW I655799 B TWI655799 B TW I655799B TW 106112151 A TW106112151 A TW 106112151A TW 106112151 A TW106112151 A TW 106112151A TW I655799 B TWI655799 B TW I655799B
Authority
TW
Taiwan
Prior art keywords
transfer
room
substrate
processed
machine
Prior art date
Application number
TW106112151A
Other languages
English (en)
Chinese (zh)
Other versions
TW201810763A (zh
Inventor
石川孝明
Takaaki Ishikawa
上村孝明
Takaaki Kamimura
平田教行
Noriyuki Hirata
Original Assignee
日商日本顯示器股份有限公司
Japan Display Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日本顯示器股份有限公司, Japan Display Inc. filed Critical 日商日本顯示器股份有限公司
Publication of TW201810763A publication Critical patent/TW201810763A/zh
Application granted granted Critical
Publication of TWI655799B publication Critical patent/TWI655799B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41865—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • H10K50/125—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers specially adapted for multicolour light emission, e.g. for emitting white light
    • H10K50/13—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers specially adapted for multicolour light emission, e.g. for emitting white light comprising stacked EL layers within one EL unit
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/14—Carrier transporting layers
    • H10K50/15—Hole transporting layers
    • H10K50/157—Hole transporting layers between the light-emitting layer and the cathode
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/14—Carrier transporting layers
    • H10K50/16—Electron transporting layers
    • H10K50/167—Electron transporting layers between the light-emitting layer and the anode
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0438—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0444—Apparatus for wiring semiconductor or solid-state device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0456—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0461—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the presence of two or more transfer chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0478—Apparatus for manufacture or treatment the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
TW106112151A 2016-06-10 2017-04-12 發光元件之製造裝置及製造方法 TWI655799B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016115945A JP6937549B2 (ja) 2016-06-10 2016-06-10 発光素子の製造装置
JP??2016-115945 2016-06-10

Publications (2)

Publication Number Publication Date
TW201810763A TW201810763A (zh) 2018-03-16
TWI655799B true TWI655799B (zh) 2019-04-01

Family

ID=60572988

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106112151A TWI655799B (zh) 2016-06-10 2017-04-12 發光元件之製造裝置及製造方法

Country Status (5)

Country Link
US (1) US10269597B2 (https=)
JP (1) JP6937549B2 (https=)
KR (2) KR101952814B1 (https=)
CN (3) CN107492602B (https=)
TW (1) TWI655799B (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6830772B2 (ja) * 2016-08-04 2021-02-17 株式会社ジャパンディスプレイ 積層膜の製造装置、及び積層膜の製造方法
CN110544660B (zh) * 2018-08-02 2022-08-16 北京北方华创微电子装备有限公司 模块化晶圆传输系统和半导体设备
JP7240980B2 (ja) * 2019-07-29 2023-03-16 東京エレクトロン株式会社 基板処理装置及び基板搬送方法
JP7759192B2 (ja) * 2020-05-12 2025-10-23 エーエスエム・アイピー・ホールディング・ベー・フェー 高スループットマルチチャンバ基材処理システム
US20240057462A1 (en) * 2020-12-25 2024-02-15 Semiconductor Energy Laboratory Co., Ltd. Manufacturing equipment of display device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020187265A1 (en) * 2001-06-12 2002-12-12 Takao Mori Apparatus and method for manufacturing an organic electroluminescence display
JP2009224231A (ja) * 2008-03-17 2009-10-01 Ulvac Japan Ltd 有機ｅｌ製造装置及び有機ｅｌ製造方法
US20140084263A1 (en) * 2012-09-21 2014-03-27 Samsung Display Co., Ltd. Organic layer deposition apparatus, organic light-emitting display apparatus, and method of manufacturing the organic light-emitting display apparatus
TWI463029B (zh) * 2008-03-05 2014-12-01 應用材料股份有限公司 具有旋轉模組之塗覆設備
US8900366B2 (en) * 2002-04-15 2014-12-02 Samsung Display Co., Ltd. Apparatus for depositing a multilayer coating on discrete sheets

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07211762A (ja) * 1994-01-13 1995-08-11 Hitachi Ltd ウエハ搬送処理装置
US5934856A (en) * 1994-05-23 1999-08-10 Tokyo Electron Limited Multi-chamber treatment system
JP3783099B2 (ja) * 2000-05-16 2006-06-07 株式会社豊田中央研究所 有機電界発光素子
DE10061882C1 (de) * 2000-12-12 2002-05-29 Georg Bollig Dünnband-Gießanlage
US20040035360A1 (en) * 2002-05-17 2004-02-26 Semiconductor Energy Laboratory Co., Ltd. Manufacturing apparatus
US20040040504A1 (en) * 2002-08-01 2004-03-04 Semiconductor Energy Laboratory Co., Ltd. Manufacturing apparatus
JP2004288463A (ja) 2003-03-20 2004-10-14 Semiconductor Energy Lab Co Ltd 製造装置
US20040206307A1 (en) * 2003-04-16 2004-10-21 Eastman Kodak Company Method and system having at least one thermal transfer station for making OLED displays
EP1717339A2 (de) * 2005-04-20 2006-11-02 Applied Films GmbH & Co. KG Kontinuierliche Beschichtungsanlage
JP5051869B2 (ja) * 2006-06-14 2012-10-17 東京エレクトロン株式会社 発光素子および発光素子の製造方法
JP5051870B2 (ja) * 2006-06-14 2012-10-17 東京エレクトロン株式会社 発光素子の製造装置および発光素子の製造方法
JP4712731B2 (ja) * 2007-01-25 2011-06-29 株式会社アルバック 搬送ロボット、真空装置
WO2008141106A1 (en) * 2007-05-09 2008-11-20 Applied Materials, Inc. Transfer chamber with vacuum extension for shutter disks
US9353436B2 (en) 2008-03-05 2016-05-31 Applied Materials, Inc. Coating apparatus with rotation module
US8070408B2 (en) * 2008-08-27 2011-12-06 Applied Materials, Inc. Load lock chamber for large area substrate processing system
JP4954162B2 (ja) 2008-08-29 2012-06-13 東京エレクトロン株式会社 処理システム
TWI424784B (zh) * 2008-09-04 2014-01-21 日立全球先端科技股份有限公司 Organic electroluminescent device manufacturing apparatus, manufacturing method thereof, film forming apparatus and film forming method
JP5476171B2 (ja) * 2010-03-16 2014-04-23 株式会社日立ハイテクノロジーズ 真空処理装置
JP5427099B2 (ja) * 2010-04-23 2014-02-26 西部電機株式会社 板状物の搬送システム
JP5551625B2 (ja) * 2011-01-13 2014-07-16 東京エレクトロン株式会社 基板処理装置及び基板処理方法
TWI719331B (zh) * 2011-10-26 2021-02-21 美商布魯克斯自動機械公司 基板處理系統
KR20130074307A (ko) * 2011-12-26 2013-07-04 엘아이지에이디피 주식회사 척킹 및 디척킹 장치부를 갖는 유기발광소자 양산 시스템
JP2013251416A (ja) * 2012-05-31 2013-12-12 Tokyo Electron Ltd 積層膜の製造方法及び真空処理装置
US20170092899A1 (en) * 2014-03-21 2017-03-30 Stefan Bangert Evaporation source for organic material

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020187265A1 (en) * 2001-06-12 2002-12-12 Takao Mori Apparatus and method for manufacturing an organic electroluminescence display
US8900366B2 (en) * 2002-04-15 2014-12-02 Samsung Display Co., Ltd. Apparatus for depositing a multilayer coating on discrete sheets
TWI463029B (zh) * 2008-03-05 2014-12-01 應用材料股份有限公司 具有旋轉模組之塗覆設備
JP2009224231A (ja) * 2008-03-17 2009-10-01 Ulvac Japan Ltd 有機ｅｌ製造装置及び有機ｅｌ製造方法
US20140084263A1 (en) * 2012-09-21 2014-03-27 Samsung Display Co., Ltd. Organic layer deposition apparatus, organic light-emitting display apparatus, and method of manufacturing the organic light-emitting display apparatus

Also Published As

Publication number Publication date
CN107492602B (zh) 2019-12-20
US10269597B2 (en) 2019-04-23
JP2017220410A (ja) 2017-12-14
CN107492602A (zh) 2017-12-19
CN110246789A (zh) 2019-09-17
KR20170140075A (ko) 2017-12-20
TW201810763A (zh) 2018-03-16
JP6937549B2 (ja) 2021-09-22
KR102059069B1 (ko) 2019-12-24
CN110828349A (zh) 2020-02-21
KR101952814B1 (ko) 2019-02-28
US20170358469A1 (en) 2017-12-14
KR20190020014A (ko) 2019-02-27
CN110246789B (zh) 2023-05-23

Similar Documents

Publication Publication Date Title
TWI671918B (zh) 發光元件之製造裝置及其製造方法
TWI655799B (zh) 發光元件之製造裝置及製造方法
JP7148587B2 (ja) 成膜装置、および電子デバイスの製造方法
US9644258B2 (en) Apparatus and method of manufacturing display device
US10041173B2 (en) Apparatus and method of manufacturing display apparatus
JP2009170282A (ja) 基板処理装置および有機エレクトロルミネッセンス装置の製造方法
KR101409808B1 (ko) 기판처리시스템
CN102479927B (zh) 基板处理系统
KR101225212B1 (ko) Ｏｌｅｄ제조장치 및 방법
JP7239549B2 (ja) 成膜装置、成膜方法及び電子デバイスの製造方法
KR20250119115A (ko) 도어 밸브 장치, 로드락 장치, 성막 장치, 성막 방법 및 전자 디바이스 제조방법
KR101175988B1 (ko) 기판처리장치 및 방법
JP2009218384A (ja) 基板処理装置および有機エレクトロルミネッセンス装置の製造方法
CN119101880A (zh) 成膜装置、控制方法及电子器件的制造方法
WO2011040538A1 (ja) 基板処理システム