JP6919776B1 - 接着フィルム、積層体およびプリント配線板 - Google Patents

接着フィルム、積層体およびプリント配線板 Download PDF

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Publication number
JP6919776B1
JP6919776B1 JP2021517738A JP2021517738A JP6919776B1 JP 6919776 B1 JP6919776 B1 JP 6919776B1 JP 2021517738 A JP2021517738 A JP 2021517738A JP 2021517738 A JP2021517738 A JP 2021517738A JP 6919776 B1 JP6919776 B1 JP 6919776B1
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Prior art keywords
group
adhesive film
mass
less
parts
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Japanese (ja)
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JPWO2021106847A1 (ja
Inventor
英之 小▲柳▼
英之 小▲柳▼
遼 薗田
遼 薗田
隼人 入澤
隼人 入澤
哲生 川楠
哲生 川楠
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Toyobo Co Ltd
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Toyobo Co Ltd
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/26—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment
    • C09J123/30—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment by oxidation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/26—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C09J171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C09J171/12—Polyphenylene oxides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
JP2021517738A 2019-11-28 2020-11-24 接着フィルム、積層体およびプリント配線板 Active JP6919776B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019215101 2019-11-28
JP2019215101 2019-11-28
PCT/JP2020/043609 WO2021106847A1 (fr) 2019-11-28 2020-11-24 Film adhésif, stratifié, et carte de circuit imprimé

Publications (2)

Publication Number Publication Date
JP6919776B1 true JP6919776B1 (ja) 2021-08-18
JPWO2021106847A1 JPWO2021106847A1 (ja) 2021-12-02

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021517738A Active JP6919776B1 (ja) 2019-11-28 2020-11-24 接着フィルム、積層体およびプリント配線板

Country Status (5)

Country Link
JP (1) JP6919776B1 (fr)
KR (1) KR20220104685A (fr)
CN (1) CN114555740B (fr)
TW (1) TW202130766A (fr)
WO (1) WO2021106847A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023054676A1 (fr) * 2021-09-30 2023-04-06 リンテック株式会社 Feuille adhésive durcissable

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008248141A (ja) * 2007-03-30 2008-10-16 Nippon Steel Chem Co Ltd 難燃硬化性樹脂組成物
JP2010275374A (ja) * 2009-05-26 2010-12-09 Panasonic Electric Works Co Ltd フレキシブルプリント配線板用樹脂組成物、樹脂フィルム、プリプレグ、樹脂付き金属箔、フレキシブルプリント配線板
JP2013170214A (ja) * 2012-02-21 2013-09-02 Adeka Corp エポキシ樹脂組成物及びポリイミド用絶縁接着剤
WO2016031342A1 (fr) * 2014-08-27 2016-03-03 東洋紡株式会社 Composition adhésive faiblement diélectrique
WO2016185956A1 (fr) * 2015-05-15 2016-11-24 東洋紡株式会社 Stratifié comprenant une couche adhésive à faible constante diélectrique
JP2017031301A (ja) * 2015-07-31 2017-02-09 東洋インキＳｃホールディングス株式会社 熱硬化性接着シート、およびその利用
WO2017033784A1 (fr) * 2015-08-25 2017-03-02 三井金属鉱業株式会社 Feuille métallique dotée d'une couche de résine, stratifié revêtu de métal, et procédé pour produire une carte de câblage imprimée
WO2017077912A1 (fr) * 2015-11-02 2017-05-11 東洋紡株式会社 Composition adhésive ignifuge à faible valeur diélectrique
WO2018131571A1 (fr) * 2017-01-10 2018-07-19 住友精化株式会社 Composition de résine époxyde
JP2019127501A (ja) * 2018-01-22 2019-08-01 藤森工業株式会社 熱硬化性接着剤組成物、接着フィルム、カバーレイフィルム及びフレキシブルプリント配線板

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60197781A (ja) * 1984-03-19 1985-10-07 Sumitomo Bakelite Co Ltd フレキシブル印刷回路用基板
EP0800914B1 (fr) * 1996-04-11 2002-07-03 Mitsui Chemicals, Inc. Film multicouche et matériau d'emballage
US6387990B1 (en) * 1999-09-10 2002-05-14 General Electric Company Curable epoxy resin compositions with brominated triazine flame retardants
US6906120B1 (en) * 2000-06-20 2005-06-14 General Electric Poly(arylene ether) adhesive compositions
US20020072585A1 (en) * 2000-10-17 2002-06-13 Industrial Technology Research Institute PPE derivatives and resin composition having the same
JP2003292767A (ja) * 2002-04-08 2003-10-15 Asahi Kasei Corp 高分子ワニス
JP2004137411A (ja) * 2002-10-18 2004-05-13 Sumitomo Bakelite Co Ltd 半導体用接着フィルム、半導体装置、及び半導体装置の製造方法
JP4411876B2 (ja) * 2003-06-23 2010-02-10 東レ株式会社 半導体装置用接着剤組成物およびそれを用いた接着剤シート及びカバーレイフィルム並びに銅張りポリイミドフィルム
JP4658735B2 (ja) * 2005-08-18 2011-03-23 信越化学工業株式会社 接着剤組成物及び接着フィルム
JP4872295B2 (ja) * 2005-09-30 2012-02-08 Ｄｉｃ株式会社 湿気硬化型ポリウレタンホットメルト接着剤
JP2012116954A (ja) * 2010-12-01 2012-06-21 Hitachi Cable Ltd 接着剤組成物、それを用いた接着フィルムおよび配線フィルム
JP6022893B2 (ja) * 2012-10-24 2016-11-09 ナミックス株式会社 カバーレイフィルム、及びそれを用いたフレキシブルプリント配線板、並びにそれらの製造方法
KR102138174B1 (ko) * 2013-03-22 2020-07-27 나믹스 가부시끼가이샤 수지 조성물, 그리고, 그것에 의한 접착 필름, 커버레이 필름, 층간 접착제
CN105452411A (zh) * 2013-09-03 2016-03-30 东洋纺株式会社 聚烯烃系粘接剂组合物
CN105492534B (zh) * 2013-09-26 2018-09-21 东洋纺株式会社 聚氨酯树脂组合物及使用其的粘接剂组合物、层叠体、印刷线路板
CN106459703B (zh) * 2014-06-11 2018-09-25 东洋纺株式会社 聚烯烃类粘合剂组合物
CN107075335B (zh) * 2014-09-24 2020-02-14 东亚合成株式会社 粘接剂组合物和使用了其的带有粘接剂层的层叠体
JP6458985B2 (ja) * 2014-10-22 2019-01-30 ナミックス株式会社 樹脂組成物、それを用いた絶縁フィルムおよび半導体装置
JP6724916B2 (ja) * 2015-07-03 2020-07-15 東洋紡株式会社 ポリオレフィン系自動車構造パネル用接着剤組成物
JP2017031276A (ja) * 2015-07-30 2017-02-09 パナソニックＩｐマネジメント株式会社 熱硬化性樹脂組成物、並びに、それを用いた樹脂ワニス、樹脂付金属箔、樹脂フィルム、金属張積層板及びプリント配線板
KR102189258B1 (ko) * 2015-08-19 2020-12-09 도요보 가부시키가이샤 저유전 접착제 조성물
CN106190004B (zh) * 2016-07-20 2020-05-15 律胜科技（苏州）有限公司 一种具有高频特性的接着剂组合物及其用途
KR102340014B1 (ko) * 2016-08-09 2021-12-16 도요보 가부시키가이샤 저유전 접착제층을 함유하는 적층체
KR102468900B1 (ko) * 2017-05-31 2022-11-18 린텍 가부시키가이샤 시트상 접착제, 가스 배리어성 적층체, 및 봉지체
JP7106819B2 (ja) * 2017-06-22 2022-07-27 昭和電工マテリアルズ株式会社 樹脂ワニス、樹脂組成物、プリプレグ、積層板、多層プリント配線板及び樹脂ワニスの保存方法
CN107880530B (zh) * 2017-12-25 2020-10-27 广东生益科技股份有限公司 无卤树脂组合物和覆盖膜及其制备方法

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008248141A (ja) * 2007-03-30 2008-10-16 Nippon Steel Chem Co Ltd 難燃硬化性樹脂組成物
JP2010275374A (ja) * 2009-05-26 2010-12-09 Panasonic Electric Works Co Ltd フレキシブルプリント配線板用樹脂組成物、樹脂フィルム、プリプレグ、樹脂付き金属箔、フレキシブルプリント配線板
JP2013170214A (ja) * 2012-02-21 2013-09-02 Adeka Corp エポキシ樹脂組成物及びポリイミド用絶縁接着剤
WO2016031342A1 (fr) * 2014-08-27 2016-03-03 東洋紡株式会社 Composition adhésive faiblement diélectrique
WO2016185956A1 (fr) * 2015-05-15 2016-11-24 東洋紡株式会社 Stratifié comprenant une couche adhésive à faible constante diélectrique
JP2017031301A (ja) * 2015-07-31 2017-02-09 東洋インキＳｃホールディングス株式会社 熱硬化性接着シート、およびその利用
WO2017033784A1 (fr) * 2015-08-25 2017-03-02 三井金属鉱業株式会社 Feuille métallique dotée d'une couche de résine, stratifié revêtu de métal, et procédé pour produire une carte de câblage imprimée
WO2017077912A1 (fr) * 2015-11-02 2017-05-11 東洋紡株式会社 Composition adhésive ignifuge à faible valeur diélectrique
WO2018131571A1 (fr) * 2017-01-10 2018-07-19 住友精化株式会社 Composition de résine époxyde
JP2019127501A (ja) * 2018-01-22 2019-08-01 藤森工業株式会社 熱硬化性接着剤組成物、接着フィルム、カバーレイフィルム及びフレキシブルプリント配線板

Also Published As

Publication number Publication date
CN114555740B (zh) 2024-01-05
TW202130766A (zh) 2021-08-16
JPWO2021106847A1 (ja) 2021-12-02
CN114555740A (zh) 2022-05-27
WO2021106847A1 (fr) 2021-06-03
KR20220104685A (ko) 2022-07-26

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