JP6908199B2 - 熱硬化性樹脂組成物、樹脂シートおよび金属ベース基板 - Google Patents

熱硬化性樹脂組成物、樹脂シートおよび金属ベース基板 Download PDF

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JP6908199B2
JP6908199B2 JP2020556988A JP2020556988A JP6908199B2 JP 6908199 B2 JP6908199 B2 JP 6908199B2 JP 2020556988 A JP2020556988 A JP 2020556988A JP 2020556988 A JP2020556988 A JP 2020556988A JP 6908199 B2 JP6908199 B2 JP 6908199B2
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resin composition
thermosetting resin
compound
epoxy
group
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JPWO2020256005A1 (ja
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智将 樫野
智将 樫野
佳樹 西川
佳樹 西川
忠相 遠藤
忠相 遠藤
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Sumitomo Bakelite Co Ltd
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Sumitomo Bakelite Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4028—Isocyanates; Thioisocyanates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/03—3 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C08K2003/385—Binary compounds of nitrogen with boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Physics & Mathematics (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
JP2020556988A 2019-06-21 2020-06-17 熱硬化性樹脂組成物、樹脂シートおよび金属ベース基板 Active JP6908199B2 (ja)

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Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112020006048T5 (de) * 2019-12-09 2022-09-29 Sumitomo Bakelite Co., Ltd. Wärmehärtbare harzzusammensetzung, harzplatte und metallgrundsubstrat
CN115190899A (zh) * 2020-02-27 2022-10-14 住友电木株式会社 热固性树脂组合物、树脂片和金属基底基板
JPWO2022176448A1 (https=) * 2021-02-18 2022-08-25
JP2022142755A (ja) * 2021-03-16 2022-09-30 三菱ケミカル株式会社 エポキシ樹脂組成物、硬化物及び電気・電子回路用積層板
JP7732222B2 (ja) * 2021-04-20 2025-09-02 住友ベークライト株式会社 熱硬化性樹脂組成物
JP7771539B2 (ja) * 2021-07-08 2025-11-18 住友ベークライト株式会社 熱硬化性樹脂組成物
JP7707699B2 (ja) * 2021-07-08 2025-07-15 住友ベークライト株式会社 熱硬化性樹脂組成物、樹脂シート、金属ベース基板、および電子装置
WO2023007894A1 (ja) * 2021-07-29 2023-02-02 昭和電工株式会社 熱伝導性樹脂組成物、硬化物、熱伝導部材及び電子機器
JP2023180727A (ja) * 2022-06-10 2023-12-21 住友ベークライト株式会社 レスベラトロール型エポキシ樹脂、熱硬化性樹脂組成物、樹脂シート、熱伝導性部材、金属ベース基板、及び電子装置
JP2023180728A (ja) * 2022-06-10 2023-12-21 住友ベークライト株式会社 熱硬化性樹脂組成物、樹脂シート、熱伝導性部材、金属ベース基板、及び電子装置
WO2026074903A1 (ja) * 2024-10-02 2026-04-09 日本発條株式会社 絶縁材料とその製造方法

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4114971A (en) 1976-09-30 1978-09-19 Van Products, A Division Of Standex International Corporation Cluster assembly and block therefor
EP1693395A4 (en) * 2003-12-08 2007-04-25 Sekisui Chemical Co Ltd HOT-RESISTANT RESIN COMPOSITION, RESIN SURFACES AND RESIN SURFACES FOR ISOLATED SUBSTRATE
JP4432481B2 (ja) * 2003-12-15 2010-03-17 住友ベークライト株式会社 半導体用樹脂ペースト及びそれを用いた半導体装置
JP2011241245A (ja) 2010-05-14 2011-12-01 Mitsubishi Chemicals Corp エポキシ樹脂組成物および硬化物
CN103429633A (zh) * 2011-03-07 2013-12-04 三菱瓦斯化学株式会社 树脂组合物以及使用其的预浸料和层叠板
KR101958506B1 (ko) * 2011-11-02 2019-03-14 히타치가세이가부시끼가이샤 수지 조성물, 및 그것을 이용한 수지 시트, 프리프레그, 적층판, 금속 기판, 프린트 배선판 및 파워 반도체 장치
CN104220533B (zh) 2012-03-30 2016-09-21 昭和电工株式会社 固化性散热组合物
JPWO2013161606A1 (ja) 2012-04-24 2015-12-24 新日鉄住金化学株式会社 エポキシ樹脂組成物、樹脂シート、硬化物及びフェノキシ樹脂
JP2014156531A (ja) 2013-02-15 2014-08-28 Hitachi Chemical Co Ltd エポキシ樹脂組成物、接着シート及び半導体素子
JP6159548B2 (ja) 2013-03-27 2017-07-05 新日鉄住金化学株式会社 エポキシ樹脂組成物、樹脂シート及びエポキシ樹脂硬化物
JP6595336B2 (ja) 2013-06-25 2019-10-23 味の素株式会社 樹脂組成物
JP6634717B2 (ja) * 2014-07-02 2020-01-22 住友ベークライト株式会社 熱伝導性シート、熱伝導性シートの硬化物および半導体装置
JP6657616B2 (ja) * 2014-07-02 2020-03-04 住友ベークライト株式会社 熱伝導性シート、熱伝導性シートの硬化物および半導体装置
JP2016155946A (ja) * 2015-02-25 2016-09-01 三菱電機株式会社 熱硬化性樹脂組成物、熱伝導性樹脂シート、回路基板及びパワーモジュール
CN109966776B (zh) 2017-12-26 2021-07-13 台达电子工业股份有限公司 核酸萃取方法及其萃取卡匣
JP6627303B2 (ja) * 2015-07-21 2020-01-08 住友ベークライト株式会社 熱伝導性樹脂組成物、回路基板用積層体、回路基板および半導体装置
JP2017028129A (ja) * 2015-07-23 2017-02-02 住友ベークライト株式会社 パワーモジュール用基板、パワーモジュール用回路基板およびパワーモジュール
JP6672953B2 (ja) * 2016-03-29 2020-03-25 味の素株式会社 樹脂シート
WO2017209210A1 (ja) * 2016-06-02 2017-12-07 日立化成株式会社 エポキシ樹脂組成物、ｂステージシート、硬化エポキシ樹脂組成物、樹脂シート、樹脂付金属箔、及び金属基板
JP6866858B2 (ja) * 2017-03-10 2021-04-28 味の素株式会社 樹脂組成物層
JP7028704B2 (ja) 2017-04-28 2022-03-02 積水化学工業株式会社 熱硬化性材料
JP6508384B2 (ja) * 2018-03-30 2019-05-08 住友ベークライト株式会社 熱伝導性シートおよび半導体装置
WO2020158758A1 (ja) * 2019-01-29 2020-08-06 デンカ株式会社 窒化ホウ素粉末及び樹脂組成物
CN116600998A (zh) * 2020-12-24 2023-08-15 东丽株式会社 树脂组合物、片状组合物、片固化物、叠层体、叠层构件、晶片保持体及半导体制造装置

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JP7608978B2 (ja) 2025-01-07
WO2020256005A1 (ja) 2020-12-24
JPWO2020256005A1 (ja) 2021-09-13
JP2021176959A (ja) 2021-11-11
DE112020002972T5 (de) 2022-03-17
CN113993947A (zh) 2022-01-28
US20220372208A1 (en) 2022-11-24

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