JPWO2022176448A1 - - Google Patents

Info

Publication number
JPWO2022176448A1
JPWO2022176448A1 JP2022529603A JP2022529603A JPWO2022176448A1 JP WO2022176448 A1 JPWO2022176448 A1 JP WO2022176448A1 JP 2022529603 A JP2022529603 A JP 2022529603A JP 2022529603 A JP2022529603 A JP 2022529603A JP WO2022176448 A1 JPWO2022176448 A1 JP WO2022176448A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022529603A
Other languages
Japanese (ja)
Other versions
JPWO2022176448A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022176448A1 publication Critical patent/JPWO2022176448A1/ja
Publication of JPWO2022176448A5 publication Critical patent/JPWO2022176448A5/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/12—Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
JP2022529603A 2021-02-18 2022-01-13 Pending JPWO2022176448A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021023920 2021-02-18
PCT/JP2022/000854 WO2022176448A1 (ja) 2021-02-18 2022-01-13 熱硬化性樹脂組成物、パワーモジュール用基板およびパワーモジュール

Publications (2)

Publication Number Publication Date
JPWO2022176448A1 true JPWO2022176448A1 (https=) 2022-08-25
JPWO2022176448A5 JPWO2022176448A5 (https=) 2023-01-24

Family

ID=82930748

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022529603A Pending JPWO2022176448A1 (https=) 2021-02-18 2022-01-13

Country Status (2)

Country Link
JP (1) JPWO2022176448A1 (https=)
WO (1) WO2022176448A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118222959B (zh) * 2024-04-11 2024-09-24 哈尔滨工业大学（威海） 超声辅助热固性塑料及其复合材料金属化方法及复合基板
WO2025258021A1 (ja) * 2024-06-13 2025-12-18 大熊ダイヤモンドデバイス株式会社 電子回路及び電気機械器具

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5935497A (ja) * 1982-08-24 1984-02-27 日立電線株式会社 銅張り積層板
JPH03110889A (ja) * 1989-09-26 1991-05-10 Matsushita Electric Works Ltd 多層積層板の製造方法
JP2003082066A (ja) * 2001-09-12 2003-03-19 Sumitomo Bakelite Co Ltd 積層板用エポキシ樹脂組成物、プリプレグ及び積層板
JP2011046816A (ja) * 2009-08-26 2011-03-10 Panasonic Electric Works Co Ltd 樹脂組成物、樹脂ワニス、プリプレグ、金属張積層板、及びプリント配線板
JP2012072209A (ja) * 2010-09-27 2012-04-12 Panasonic Corp 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置
JP2017025186A (ja) * 2015-07-21 2017-02-02 住友ベークライト株式会社 熱伝導性樹脂組成物、回路基板用積層体、回路基板および半導体装置
JP2017188518A (ja) * 2016-04-04 2017-10-12 東洋紡株式会社 金属ベース回路基板
JP2019036716A (ja) * 2017-08-14 2019-03-07 東洋インキＳｃホールディングス株式会社 複合部材
WO2020256005A1 (ja) * 2019-06-21 2020-12-24 住友ベークライト株式会社 熱硬化性樹脂組成物、樹脂シートおよび金属ベース基板

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020019277A1 (zh) * 2018-07-27 2020-01-30 湖州五爻硅基材料研究院有限公司 一种球形粉体填料的制备方法、由此得到的球形粉体填料及其应用

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5935497A (ja) * 1982-08-24 1984-02-27 日立電線株式会社 銅張り積層板
JPH03110889A (ja) * 1989-09-26 1991-05-10 Matsushita Electric Works Ltd 多層積層板の製造方法
JP2003082066A (ja) * 2001-09-12 2003-03-19 Sumitomo Bakelite Co Ltd 積層板用エポキシ樹脂組成物、プリプレグ及び積層板
JP2011046816A (ja) * 2009-08-26 2011-03-10 Panasonic Electric Works Co Ltd 樹脂組成物、樹脂ワニス、プリプレグ、金属張積層板、及びプリント配線板
JP2012072209A (ja) * 2010-09-27 2012-04-12 Panasonic Corp 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置
JP2017025186A (ja) * 2015-07-21 2017-02-02 住友ベークライト株式会社 熱伝導性樹脂組成物、回路基板用積層体、回路基板および半導体装置
JP2017188518A (ja) * 2016-04-04 2017-10-12 東洋紡株式会社 金属ベース回路基板
JP2019036716A (ja) * 2017-08-14 2019-03-07 東洋インキＳｃホールディングス株式会社 複合部材
WO2020256005A1 (ja) * 2019-06-21 2020-12-24 住友ベークライト株式会社 熱硬化性樹脂組成物、樹脂シートおよび金属ベース基板

Also Published As

Publication number Publication date
WO2022176448A1 (ja) 2022-08-25

Similar Documents

Publication Publication Date Title
BR112023005462A2 (https=)
BR112023012656A2 (https=)
BR112021014123A2 (https=)
BR112023009656A2 (https=)
BR112022009896A2 (https=)
BR112021017747A2 (https=)
BR112022024743A2 (https=)
JPWO2022176448A1 (https=)
BR112022026905A2 (https=)
BR112023011738A2 (https=)
BR112023004146A2 (https=)
BR112023006729A2 (https=)
BR102021018859A2 (https=)
BR102021015500A2 (https=)
BR102021007058A2 (https=)
BR102020022030A2 (https=)
BR112023016292A2 (https=)
BR112023011539A2 (https=)
BR112023011610A2 (https=)
BR112023008976A2 (https=)
BR102021020147A2 (https=)
BR102021018926A2 (https=)
BR102021018167A2 (https=)
BR102021017576A2 (https=)
BR102021016837A2 (https=)

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220520

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20220520

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20220520

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20220705

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20220901

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20221104

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20221206

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230203

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20230307