JPWO2022176448A1 - - Google Patents

Info

Publication number
JPWO2022176448A1
JPWO2022176448A1 JP2022529603A JP2022529603A JPWO2022176448A1 JP WO2022176448 A1 JPWO2022176448 A1 JP WO2022176448A1 JP 2022529603 A JP2022529603 A JP 2022529603A JP 2022529603 A JP2022529603 A JP 2022529603A JP WO2022176448 A1 JPWO2022176448 A1 JP WO2022176448A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022529603A
Other versions
JPWO2022176448A5 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022176448A1 publication Critical patent/JPWO2022176448A1/ja
Publication of JPWO2022176448A5 publication Critical patent/JPWO2022176448A5/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/12—Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
JP2022529603A 2021-02-18 2022-01-13 Pending JPWO2022176448A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021023920 2021-02-18
PCT/JP2022/000854 WO2022176448A1 (ja) 2021-02-18 2022-01-13 熱硬化性樹脂組成物、パワーモジュール用基板およびパワーモジュール

Publications (2)

Publication Number Publication Date
JPWO2022176448A1 true JPWO2022176448A1 (ja) 2022-08-25
JPWO2022176448A5 JPWO2022176448A5 (ja) 2023-01-24

Family

ID=82930748

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022529603A Pending JPWO2022176448A1 (ja) 2021-02-18 2022-01-13

Country Status (2)

Country Link
JP (1) JPWO2022176448A1 (ja)
WO (1) WO2022176448A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118222959B (zh) * 2024-04-11 2024-09-24 哈尔滨工业大学（威海） 超声辅助热固性塑料及其复合材料金属化方法及复合基板

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5935497A (ja) * 1982-08-24 1984-02-27 日立電線株式会社 銅張り積層板
JPH03110889A (ja) * 1989-09-26 1991-05-10 Matsushita Electric Works Ltd 多層積層板の製造方法
JP2003082066A (ja) * 2001-09-12 2003-03-19 Sumitomo Bakelite Co Ltd 積層板用エポキシ樹脂組成物、プリプレグ及び積層板
JP2011046816A (ja) * 2009-08-26 2011-03-10 Panasonic Electric Works Co Ltd 樹脂組成物、樹脂ワニス、プリプレグ、金属張積層板、及びプリント配線板
JP2012072209A (ja) * 2010-09-27 2012-04-12 Panasonic Corp 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置
JP2017025186A (ja) * 2015-07-21 2017-02-02 住友ベークライト株式会社 熱伝導性樹脂組成物、回路基板用積層体、回路基板および半導体装置
JP2017188518A (ja) * 2016-04-04 2017-10-12 東洋紡株式会社 金属ベース回路基板
JP2019036716A (ja) * 2017-08-14 2019-03-07 東洋インキＳｃホールディングス株式会社 複合部材
WO2020256005A1 (ja) * 2019-06-21 2020-12-24 住友ベークライト株式会社 熱硬化性樹脂組成物、樹脂シートおよび金属ベース基板

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020019277A1 (zh) * 2018-07-27 2020-01-30 湖州五爻硅基材料研究院有限公司 一种球形粉体填料的制备方法、由此得到的球形粉体填料及其应用

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5935497A (ja) * 1982-08-24 1984-02-27 日立電線株式会社 銅張り積層板
JPH03110889A (ja) * 1989-09-26 1991-05-10 Matsushita Electric Works Ltd 多層積層板の製造方法
JP2003082066A (ja) * 2001-09-12 2003-03-19 Sumitomo Bakelite Co Ltd 積層板用エポキシ樹脂組成物、プリプレグ及び積層板
JP2011046816A (ja) * 2009-08-26 2011-03-10 Panasonic Electric Works Co Ltd 樹脂組成物、樹脂ワニス、プリプレグ、金属張積層板、及びプリント配線板
JP2012072209A (ja) * 2010-09-27 2012-04-12 Panasonic Corp 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置
JP2017025186A (ja) * 2015-07-21 2017-02-02 住友ベークライト株式会社 熱伝導性樹脂組成物、回路基板用積層体、回路基板および半導体装置
JP2017188518A (ja) * 2016-04-04 2017-10-12 東洋紡株式会社 金属ベース回路基板
JP2019036716A (ja) * 2017-08-14 2019-03-07 東洋インキＳｃホールディングス株式会社 複合部材
WO2020256005A1 (ja) * 2019-06-21 2020-12-24 住友ベークライト株式会社 熱硬化性樹脂組成物、樹脂シートおよび金属ベース基板

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Publication number Publication date
WO2022176448A1 (ja) 2022-08-25

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