JP6906377B2 - 排気プレート及びプラズマ処理装置 - Google Patents

排気プレート及びプラズマ処理装置 Download PDF

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Publication number
JP6906377B2
JP6906377B2 JP2017123656A JP2017123656A JP6906377B2 JP 6906377 B2 JP6906377 B2 JP 6906377B2 JP 2017123656 A JP2017123656 A JP 2017123656A JP 2017123656 A JP2017123656 A JP 2017123656A JP 6906377 B2 JP6906377 B2 JP 6906377B2
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Japan
Prior art keywords
space
exhaust
processing
porous metal
metal sheet
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JP2017123656A
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English (en)
Japanese (ja)
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JP2019008986A (ja
JP2019008986A5 (enExample
Inventor
慎司 檜森
慎司 檜森
阿部　淳
淳 阿部
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2017123656A priority Critical patent/JP6906377B2/ja
Priority to KR1020180068922A priority patent/KR20190000797A/ko
Priority to TW107120698A priority patent/TWI778081B/zh
Priority to US16/010,658 priority patent/US20180374720A1/en
Publication of JP2019008986A publication Critical patent/JP2019008986A/ja
Publication of JP2019008986A5 publication Critical patent/JP2019008986A5/ja
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Publication of JP6906377B2 publication Critical patent/JP6906377B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32633—Baffles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32816—Pressure
    • H01J37/32834—Exhausting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/02—Details
    • H01J2237/026—Shields
    • H01J2237/0262—Shields electrostatic

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Plasma Technology (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
  • Paper (AREA)
  • Absorbent Articles And Supports Therefor (AREA)
JP2017123656A 2017-06-23 2017-06-23 排気プレート及びプラズマ処理装置 Active JP6906377B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2017123656A JP6906377B2 (ja) 2017-06-23 2017-06-23 排気プレート及びプラズマ処理装置
KR1020180068922A KR20190000797A (ko) 2017-06-23 2018-06-15 배기 플레이트 및 플라즈마 처리 장치
TW107120698A TWI778081B (zh) 2017-06-23 2018-06-15 排氣板及電漿處理裝置
US16/010,658 US20180374720A1 (en) 2017-06-23 2018-06-18 Gas exhaust plate and plasma processing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017123656A JP6906377B2 (ja) 2017-06-23 2017-06-23 排気プレート及びプラズマ処理装置

Publications (3)

Publication Number Publication Date
JP2019008986A JP2019008986A (ja) 2019-01-17
JP2019008986A5 JP2019008986A5 (enExample) 2020-04-23
JP6906377B2 true JP6906377B2 (ja) 2021-07-21

Family

ID=64692700

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017123656A Active JP6906377B2 (ja) 2017-06-23 2017-06-23 排気プレート及びプラズマ処理装置

Country Status (4)

Country Link
US (1) US20180374720A1 (enExample)
JP (1) JP6906377B2 (enExample)
KR (1) KR20190000797A (enExample)
TW (1) TWI778081B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11721527B2 (en) 2019-01-07 2023-08-08 Applied Materials, Inc. Processing chamber mixing systems
JP7535260B2 (ja) * 2020-04-16 2024-08-16 株式会社イー・エム・ディー 高周波アンテナ及びプラズマ処理装置
WO2023032705A1 (ja) * 2021-09-01 2023-03-09 東京エレクトロン株式会社 プラズマ処理装置及びシャワーヘッドアセンブリ
CN116614926B (zh) * 2022-02-09 2026-07-14 中微半导体设备(上海)股份有限公司 等离子体约束系统及方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3468446B2 (ja) * 1997-05-20 2003-11-17 東京エレクトロン株式会社 プラズマ処理装置
US6051100A (en) * 1997-10-24 2000-04-18 International Business Machines Corporation High conductance plasma containment structure
JP3814510B2 (ja) * 2000-10-03 2006-08-30 松下電器産業株式会社 プラズマ処理方法及び装置
US20020038791A1 (en) * 2000-10-03 2002-04-04 Tomohiro Okumura Plasma processing method and apparatus
JP4120566B2 (ja) * 2000-10-03 2008-07-16 松下電器産業株式会社 プラズマ処理方法及び装置
JP4338355B2 (ja) * 2002-05-10 2009-10-07 東京エレクトロン株式会社 プラズマ処理装置
CN100418187C (zh) * 2003-02-07 2008-09-10 东京毅力科创株式会社 等离子体处理装置、环形部件和等离子体处理方法
US7927066B2 (en) * 2005-03-02 2011-04-19 Tokyo Electron Limited Reflecting device, communicating pipe, exhausting pump, exhaust system, method for cleaning the system, storage medium storing program for implementing the method, substrate processing apparatus, and particle capturing component
US8298379B2 (en) * 2007-03-22 2012-10-30 Tokyo Electron Limited Method and apparatus for extending chamber component life in a substrate processing system
JP5412239B2 (ja) * 2009-02-24 2014-02-12 株式会社島津製作所 ターボ分子ポンプおよびターボ分子ポンプ用パーティクルトラップ
US8360003B2 (en) * 2009-07-13 2013-01-29 Applied Materials, Inc. Plasma reactor with uniform process rate distribution by improved RF ground return path
JP5432629B2 (ja) * 2009-08-07 2014-03-05 東京エレクトロン株式会社 バッフル板及びプラズマ処理装置
JP2011258622A (ja) * 2010-06-07 2011-12-22 Tokyo Electron Ltd プラズマ処理装置及びその誘電体窓構造
JP2012038761A (ja) * 2010-08-03 2012-02-23 Hitachi Kokusai Electric Inc 基板処理装置
JP5865596B2 (ja) * 2011-03-25 2016-02-17 東京エレクトロン株式会社 粒子捕捉ユニット、該粒子捕捉ユニットの製造方法及び基板処理装置
US20140051253A1 (en) * 2012-08-14 2014-02-20 Lam Research Corporation Plasma baffle ring for a plasma processing apparatus and method of use

Also Published As

Publication number Publication date
US20180374720A1 (en) 2018-12-27
JP2019008986A (ja) 2019-01-17
TW201922064A (zh) 2019-06-01
TWI778081B (zh) 2022-09-21
KR20190000797A (ko) 2019-01-03

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