KR20190000797A - 배기 플레이트 및 플라즈마 처리 장치 - Google Patents

배기 플레이트 및 플라즈마 처리 장치 Download PDF

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Publication number
KR20190000797A
KR20190000797A KR1020180068922A KR20180068922A KR20190000797A KR 20190000797 A KR20190000797 A KR 20190000797A KR 1020180068922 A KR1020180068922 A KR 1020180068922A KR 20180068922 A KR20180068922 A KR 20180068922A KR 20190000797 A KR20190000797 A KR 20190000797A
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KR
South Korea
Prior art keywords
processing
porous metal
space
metal sheet
exhaust plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020180068922A
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English (en)
Korean (ko)
Inventor
신지 히모리
준 아베
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20190000797A publication Critical patent/KR20190000797A/ko
Ceased legal-status Critical Current

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    • H01L21/67017—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32633—Baffles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32816—Pressure
    • H01J37/32834—Exhausting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/02—Details
    • H01J2237/026—Shields
    • H01J2237/0262—Shields electrostatic

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Plasma Technology (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
  • Paper (AREA)
  • Absorbent Articles And Supports Therefor (AREA)
KR1020180068922A 2017-06-23 2018-06-15 배기 플레이트 및 플라즈마 처리 장치 Ceased KR20190000797A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2017-123656 2017-06-23
JP2017123656A JP6906377B2 (ja) 2017-06-23 2017-06-23 排気プレート及びプラズマ処理装置

Publications (1)

Publication Number Publication Date
KR20190000797A true KR20190000797A (ko) 2019-01-03

Family

ID=64692700

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020180068922A Ceased KR20190000797A (ko) 2017-06-23 2018-06-15 배기 플레이트 및 플라즈마 처리 장치

Country Status (4)

Country Link
US (1) US20180374720A1 (enExample)
JP (1) JP6906377B2 (enExample)
KR (1) KR20190000797A (enExample)
TW (1) TWI778081B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11721527B2 (en) 2019-01-07 2023-08-08 Applied Materials, Inc. Processing chamber mixing systems
JP7535260B2 (ja) * 2020-04-16 2024-08-16 株式会社イー・エム・ディー 高周波アンテナ及びプラズマ処理装置
WO2023032705A1 (ja) * 2021-09-01 2023-03-09 東京エレクトロン株式会社 プラズマ処理装置及びシャワーヘッドアセンブリ
CN116614926B (zh) * 2022-02-09 2026-07-14 中微半导体设备(上海)股份有限公司 等离子体约束系统及方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3468446B2 (ja) * 1997-05-20 2003-11-17 東京エレクトロン株式会社 プラズマ処理装置
US6051100A (en) * 1997-10-24 2000-04-18 International Business Machines Corporation High conductance plasma containment structure
JP3814510B2 (ja) * 2000-10-03 2006-08-30 松下電器産業株式会社 プラズマ処理方法及び装置
US20020038791A1 (en) * 2000-10-03 2002-04-04 Tomohiro Okumura Plasma processing method and apparatus
JP4120566B2 (ja) * 2000-10-03 2008-07-16 松下電器産業株式会社 プラズマ処理方法及び装置
JP4338355B2 (ja) * 2002-05-10 2009-10-07 東京エレクトロン株式会社 プラズマ処理装置
CN100418187C (zh) * 2003-02-07 2008-09-10 东京毅力科创株式会社 等离子体处理装置、环形部件和等离子体处理方法
US7927066B2 (en) * 2005-03-02 2011-04-19 Tokyo Electron Limited Reflecting device, communicating pipe, exhausting pump, exhaust system, method for cleaning the system, storage medium storing program for implementing the method, substrate processing apparatus, and particle capturing component
US8298379B2 (en) * 2007-03-22 2012-10-30 Tokyo Electron Limited Method and apparatus for extending chamber component life in a substrate processing system
JP5412239B2 (ja) * 2009-02-24 2014-02-12 株式会社島津製作所 ターボ分子ポンプおよびターボ分子ポンプ用パーティクルトラップ
US8360003B2 (en) * 2009-07-13 2013-01-29 Applied Materials, Inc. Plasma reactor with uniform process rate distribution by improved RF ground return path
JP5432629B2 (ja) * 2009-08-07 2014-03-05 東京エレクトロン株式会社 バッフル板及びプラズマ処理装置
JP2011258622A (ja) * 2010-06-07 2011-12-22 Tokyo Electron Ltd プラズマ処理装置及びその誘電体窓構造
JP2012038761A (ja) * 2010-08-03 2012-02-23 Hitachi Kokusai Electric Inc 基板処理装置
JP5865596B2 (ja) * 2011-03-25 2016-02-17 東京エレクトロン株式会社 粒子捕捉ユニット、該粒子捕捉ユニットの製造方法及び基板処理装置
US20140051253A1 (en) * 2012-08-14 2014-02-20 Lam Research Corporation Plasma baffle ring for a plasma processing apparatus and method of use

Also Published As

Publication number Publication date
US20180374720A1 (en) 2018-12-27
JP6906377B2 (ja) 2021-07-21
JP2019008986A (ja) 2019-01-17
TW201922064A (zh) 2019-06-01
TWI778081B (zh) 2022-09-21

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St.27 status event code: U-3-3-T10-T11-oth-X000

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P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000