TWI778081B - 排氣板及電漿處理裝置 - Google Patents

排氣板及電漿處理裝置 Download PDF

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Publication number
TWI778081B
TWI778081B TW107120698A TW107120698A TWI778081B TW I778081 B TWI778081 B TW I778081B TW 107120698 A TW107120698 A TW 107120698A TW 107120698 A TW107120698 A TW 107120698A TW I778081 B TWI778081 B TW I778081B
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TW
Taiwan
Prior art keywords
space
exhaust
processing
porous metal
metal sheet
Prior art date
Application number
TW107120698A
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English (en)
Chinese (zh)
Other versions
TW201922064A (zh
Inventor
檜森慎司
阿部淳
Original Assignee
日商東京威力科創股份有限公司
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Application filed by 日商東京威力科創股份有限公司 filed Critical 日商東京威力科創股份有限公司
Publication of TW201922064A publication Critical patent/TW201922064A/zh
Application granted granted Critical
Publication of TWI778081B publication Critical patent/TWI778081B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32633—Baffles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32816—Pressure
    • H01J37/32834—Exhausting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/02—Details
    • H01J2237/026—Shields
    • H01J2237/0262—Shields electrostatic

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Plasma Technology (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
  • Paper (AREA)
  • Absorbent Articles And Supports Therefor (AREA)
TW107120698A 2017-06-23 2018-06-15 排氣板及電漿處理裝置 TWI778081B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-123656 2017-06-23
JP2017123656A JP6906377B2 (ja) 2017-06-23 2017-06-23 排気プレート及びプラズマ処理装置

Publications (2)

Publication Number Publication Date
TW201922064A TW201922064A (zh) 2019-06-01
TWI778081B true TWI778081B (zh) 2022-09-21

Family

ID=64692700

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107120698A TWI778081B (zh) 2017-06-23 2018-06-15 排氣板及電漿處理裝置

Country Status (4)

Country Link
US (1) US20180374720A1 (enExample)
JP (1) JP6906377B2 (enExample)
KR (1) KR20190000797A (enExample)
TW (1) TWI778081B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11721527B2 (en) 2019-01-07 2023-08-08 Applied Materials, Inc. Processing chamber mixing systems
JP7535260B2 (ja) * 2020-04-16 2024-08-16 株式会社イー・エム・ディー 高周波アンテナ及びプラズマ処理装置
WO2023032705A1 (ja) * 2021-09-01 2023-03-09 東京エレクトロン株式会社 プラズマ処理装置及びシャワーヘッドアセンブリ
CN116614926B (zh) * 2022-02-09 2026-07-14 中微半导体设备(上海)股份有限公司 等离子体约束系统及方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020038791A1 (en) * 2000-10-03 2002-04-04 Tomohiro Okumura Plasma processing method and apparatus
JP2004140379A (ja) * 2000-10-03 2004-05-13 Matsushita Electric Ind Co Ltd プラズマ処理方法及び装置
US20090104781A1 (en) * 2003-02-07 2009-04-23 Tokyo Electron Limited Plasma processing apparatus, ring member and plasma processing method
TW201220962A (en) * 2010-06-07 2012-05-16 Tokyo Electron Ltd can suppress the consumption of partially eroding a dielectric protection mask disposed inside a dielectric window

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3468446B2 (ja) * 1997-05-20 2003-11-17 東京エレクトロン株式会社 プラズマ処理装置
US6051100A (en) * 1997-10-24 2000-04-18 International Business Machines Corporation High conductance plasma containment structure
JP3814510B2 (ja) * 2000-10-03 2006-08-30 松下電器産業株式会社 プラズマ処理方法及び装置
JP4338355B2 (ja) * 2002-05-10 2009-10-07 東京エレクトロン株式会社 プラズマ処理装置
US7927066B2 (en) * 2005-03-02 2011-04-19 Tokyo Electron Limited Reflecting device, communicating pipe, exhausting pump, exhaust system, method for cleaning the system, storage medium storing program for implementing the method, substrate processing apparatus, and particle capturing component
US8298379B2 (en) * 2007-03-22 2012-10-30 Tokyo Electron Limited Method and apparatus for extending chamber component life in a substrate processing system
JP5412239B2 (ja) * 2009-02-24 2014-02-12 株式会社島津製作所 ターボ分子ポンプおよびターボ分子ポンプ用パーティクルトラップ
US8360003B2 (en) * 2009-07-13 2013-01-29 Applied Materials, Inc. Plasma reactor with uniform process rate distribution by improved RF ground return path
JP5432629B2 (ja) * 2009-08-07 2014-03-05 東京エレクトロン株式会社 バッフル板及びプラズマ処理装置
JP2012038761A (ja) * 2010-08-03 2012-02-23 Hitachi Kokusai Electric Inc 基板処理装置
JP5865596B2 (ja) * 2011-03-25 2016-02-17 東京エレクトロン株式会社 粒子捕捉ユニット、該粒子捕捉ユニットの製造方法及び基板処理装置
US20140051253A1 (en) * 2012-08-14 2014-02-20 Lam Research Corporation Plasma baffle ring for a plasma processing apparatus and method of use

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020038791A1 (en) * 2000-10-03 2002-04-04 Tomohiro Okumura Plasma processing method and apparatus
JP2004140379A (ja) * 2000-10-03 2004-05-13 Matsushita Electric Ind Co Ltd プラズマ処理方法及び装置
US20090104781A1 (en) * 2003-02-07 2009-04-23 Tokyo Electron Limited Plasma processing apparatus, ring member and plasma processing method
TW201220962A (en) * 2010-06-07 2012-05-16 Tokyo Electron Ltd can suppress the consumption of partially eroding a dielectric protection mask disposed inside a dielectric window

Also Published As

Publication number Publication date
US20180374720A1 (en) 2018-12-27
JP6906377B2 (ja) 2021-07-21
JP2019008986A (ja) 2019-01-17
TW201922064A (zh) 2019-06-01
KR20190000797A (ko) 2019-01-03

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