JP6903693B2 - マイクモジュール、および電子機器 - Google Patents

マイクモジュール、および電子機器 Download PDF

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Publication number
JP6903693B2
JP6903693B2 JP2018566595A JP2018566595A JP6903693B2 JP 6903693 B2 JP6903693 B2 JP 6903693B2 JP 2018566595 A JP2018566595 A JP 2018566595A JP 2018566595 A JP2018566595 A JP 2018566595A JP 6903693 B2 JP6903693 B2 JP 6903693B2
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JP
Japan
Prior art keywords
circuit board
microphone module
cavity
module according
flexible circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018566595A
Other languages
English (en)
Japanese (ja)
Other versions
JP2021502003A (ja
Inventor
嘉甫 ▲顏▼
嘉甫 ▲顏▼
慧 杜
慧 杜
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing Xiaomi Mobile Software Co Ltd
Original Assignee
Beijing Xiaomi Mobile Software Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beijing Xiaomi Mobile Software Co Ltd filed Critical Beijing Xiaomi Mobile Software Co Ltd
Publication of JP2021502003A publication Critical patent/JP2021502003A/ja
Application granted granted Critical
Publication of JP6903693B2 publication Critical patent/JP6903693B2/ja
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/08—Mouthpieces; Microphones; Attachments therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/028—Casings; Cabinets ; Supports therefor; Mountings therein associated with devices performing functions other than acoustics, e.g. electric candles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0035—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS
    • B81B7/0038—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0045—Packages or encapsulation for reducing stress inside of the package structure
    • B81B7/0048—Packages or encapsulation for reducing stress inside of the package structure between the MEMS die and the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0061—Packages or encapsulation suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/04—Structural association of microphone with electric circuitry therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/08—Mouthpieces; Microphones; Attachments therefor
    • H04R1/083—Special constructions of mouthpieces
    • H04R1/086—Protective screens, e.g. all weather or wind screens
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2410/00—Microphones
    • H04R2410/03—Reduction of intrinsic noise in microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
JP2018566595A 2018-09-27 2018-11-10 マイクモジュール、および電子機器 Active JP6903693B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201811133959.7A CN110958506A (zh) 2018-09-27 2018-09-27 麦克风模组、电子设备
CN201811133959.7 2018-09-27
PCT/CN2018/114933 WO2020062469A1 (zh) 2018-09-27 2018-11-10 麦克风模组、电子设备

Publications (2)

Publication Number Publication Date
JP2021502003A JP2021502003A (ja) 2021-01-21
JP6903693B2 true JP6903693B2 (ja) 2021-07-14

Family

ID=68069544

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018566595A Active JP6903693B2 (ja) 2018-09-27 2018-11-10 マイクモジュール、および電子機器

Country Status (7)

Country Link
US (1) US10834490B2 (ko)
EP (1) EP3628639B1 (ko)
JP (1) JP6903693B2 (ko)
KR (1) KR102121511B1 (ko)
CN (1) CN110958506A (ko)
RU (1) RU2747707C2 (ko)
WO (1) WO2020062469A1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110958506A (zh) 2018-09-27 2020-04-03 北京小米移动软件有限公司 麦克风模组、电子设备
CN112087693B (zh) * 2020-09-22 2022-06-03 歌尔微电子股份有限公司 一种mems麦克风

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6117705A (en) * 1997-04-18 2000-09-12 Amkor Technology, Inc. Method of making integrated circuit package having adhesive bead supporting planar lid above planar substrate
DE19721281C2 (de) * 1997-05-21 1999-04-01 Ods Landis & Gyr Gmbh & Co Kg Chipmodul für eine Chipkarte
US6841412B1 (en) * 1999-11-05 2005-01-11 Texas Instruments Incorporated Encapsulation for particle entrapment
KR100737732B1 (ko) 2006-04-21 2007-07-10 주식회사 비에스이 멤스 마이크로폰의 패키징 구조
US20080217709A1 (en) * 2007-03-07 2008-09-11 Knowles Electronics, Llc Mems package having at least one port and manufacturing method thereof
US20090175477A1 (en) * 2007-08-20 2009-07-09 Yamaha Corporation Vibration transducer
US20120207335A1 (en) * 2011-02-14 2012-08-16 Nxp B.V. Ported mems microphone
KR20120117553A (ko) * 2011-04-15 2012-10-24 삼성전기주식회사 카메라 모듈
CN102611954A (zh) * 2012-03-05 2012-07-25 广东步步高电子工业有限公司 麦克风防尘结构及其组装方法
KR101224448B1 (ko) * 2012-04-30 2013-01-21 (주)파트론 센서 패키지 및 그의 제조 방법
US20130327221A1 (en) * 2012-06-06 2013-12-12 Honeywell International Inc. Systems and methods for particle contaminant entrapment
WO2014193307A1 (en) * 2013-05-31 2014-12-04 Heptagon Micro Optics Pte. Ltd. Mems microphone modules and wafer-level techniques for fabricating the same
CN203407015U (zh) * 2013-07-02 2014-01-22 瑞声声学科技(深圳)有限公司 电容式麦克风
CN104768112A (zh) * 2014-01-03 2015-07-08 钰太芯微电子科技（上海）有限公司 一种新型麦克风结构
CN203989842U (zh) 2014-04-15 2014-12-10 樊书印 一种电子敲击棒
CN106686487A (zh) * 2017-03-02 2017-05-17 缪玉娣 微型音箱
CN207766455U (zh) * 2017-12-26 2018-08-24 歌尔科技有限公司 Mems麦克风
CN110958506A (zh) 2018-09-27 2020-04-03 北京小米移动软件有限公司 麦克风模组、电子设备

Also Published As

Publication number Publication date
RU2747707C2 (ru) 2021-05-13
WO2020062469A1 (zh) 2020-04-02
KR20200037720A (ko) 2020-04-09
RU2019130581A (ru) 2021-05-06
KR102121511B1 (ko) 2020-06-11
EP3628639B1 (en) 2022-12-28
EP3628639A3 (en) 2020-08-05
EP3628639A2 (en) 2020-04-01
US10834490B2 (en) 2020-11-10
CN110958506A (zh) 2020-04-03
US20200107094A1 (en) 2020-04-02
JP2021502003A (ja) 2021-01-21
RU2019130581A3 (ko) 2021-05-06

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