WO2020062469A1 - 麦克风模组、电子设备 - Google Patents

麦克风模组、电子设备 Download PDF

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Publication number
WO2020062469A1
WO2020062469A1 PCT/CN2018/114933 CN2018114933W WO2020062469A1 WO 2020062469 A1 WO2020062469 A1 WO 2020062469A1 CN 2018114933 W CN2018114933 W CN 2018114933W WO 2020062469 A1 WO2020062469 A1 WO 2020062469A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
microphone module
cavity
adhesive member
module according
Prior art date
Application number
PCT/CN2018/114933
Other languages
English (en)
French (fr)
Inventor
颜嘉甫
杜慧
Original Assignee
北京小米移动软件有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 北京小米移动软件有限公司 filed Critical 北京小米移动软件有限公司
Priority to KR1020187037858A priority Critical patent/KR102121511B1/ko
Priority to JP2018566595A priority patent/JP6903693B2/ja
Priority to RU2019130581A priority patent/RU2747707C2/ru
Publication of WO2020062469A1 publication Critical patent/WO2020062469A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/028—Casings; Cabinets ; Supports therefor; Mountings therein associated with devices performing functions other than acoustics, e.g. electric candles
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/08—Mouthpieces; Microphones; Attachments therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0035—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS
    • B81B7/0038—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0045—Packages or encapsulation for reducing stress inside of the package structure
    • B81B7/0048—Packages or encapsulation for reducing stress inside of the package structure between the MEMS die and the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0061—Packages or encapsulation suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/04—Structural association of microphone with electric circuitry therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/08—Mouthpieces; Microphones; Attachments therefor
    • H04R1/083—Special constructions of mouthpieces
    • H04R1/086—Protective screens, e.g. all weather or wind screens
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2410/00—Microphones
    • H04R2410/03—Reduction of intrinsic noise in microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's

Definitions

  • the present disclosure relates to the technical field of electronic devices, and in particular, to a microphone module and an electronic device.
  • the microphone module is an indispensable part of electronic equipment.
  • the microphone module includes a housing having a cavity and a sound receiving hole, and a signal converter located in the cavity; wherein, the signal converter includes a vibration diaphragm disposed corresponding to the sound receiving hole.
  • the sound signal is introduced into the cavity through the sound receiving hole, which drives the vibration diaphragm to vibrate, so that the signal converter converts the sound signal into an electrical signal.
  • impurities outside the microphone module can also enter the cavity through the sound receiving hole and fall on the diaphragm. As more and more impurities fall on the diaphragm, with the normal vibration of the diaphragm, these impurities can easily scratch and puncture the diaphragm, affecting the normal use of the microphone module, and even shortening the microphone module. Life.
  • the present disclosure provides a microphone module and an electronic device to solve the deficiencies in related technologies.
  • a first aspect of the present disclosure provides a microphone module, including:
  • a shell formed with a cavity and a sound receiving hole in communication
  • a circuit board which is connected to the casing and blocks the cavity
  • a signal converter is used to convert an acoustic signal into an electrical signal, and is placed in the cavity.
  • the adhesive member includes a first adhesive member attached to an inner wall of the housing.
  • the first adhesive member covers an inner wall of the housing.
  • the first adhesive member extends from the cavity to the sound receiving hole, and covers the side wall of the sound receiving hole.
  • the adhesive member includes a second adhesive member attached to the circuit board.
  • the microphone module further includes: a connection layer;
  • connection layer includes oppositely disposed adhesive surfaces, which are respectively glued to the adhesive member and the target application carrier.
  • the circuit board includes a flexible circuit board.
  • the circuit board includes a first flexible circuit board provided corresponding to the cavity;
  • a slit is provided on the first flexible circuit board, and the lines adjacent to the slit are distributed concentrically.
  • the circuit board includes a second flexible circuit board located outside the cavity, and the second flexible circuit board is provided with staggered slits.
  • the slit includes an arcuate end.
  • the signal converter includes: an integrated circuit module connected to the flexible circuit board, and the integrated circuit module includes a component having a surrounding structure.
  • a second aspect of the present disclosure provides an electronic device including the microphone module provided by the first aspect.
  • the adhesive is provided in the cavity, the impurities entering the cavity through the sound receiving hole can directly adhere to the adhesive, avoiding contact with components other than the adhesive in the cavity.
  • the impurities in the cavity are adhered to the adherent during the movement process, so as to avoid repeated contact between the impurities and components other than the adherent.
  • the vibration diaphragm disposed in the cavity the number of impurities in contact with the vibration diaphragm can be reduced by the adhesive member on the one hand, and repeated contact between the impurities and the vibration diaphragm can be avoided on the other hand. Furthermore, it helps to reduce the impact and abrasion of impurities on the vibration diaphragm, avoid damage to the vibration diaphragm, and ensure the normal use of the microphone module to extend the service life of the microphone module.
  • Fig. 1 is a sectional view showing a microphone module according to an exemplary embodiment
  • Fig. 2 is a schematic structural diagram of a microphone module according to another exemplary embodiment
  • Fig. 3 is a schematic structural diagram of a microphone module according to another exemplary embodiment
  • Fig. 4 is a cross-sectional view showing a connection between an adhesive member and a housing according to an exemplary embodiment
  • Fig. 5 is a cross-sectional view showing a connection between an adhesive member and a housing according to another exemplary embodiment
  • Fig. 6 is a top view of a microphone module according to an exemplary embodiment.
  • Fig. 1 is a cross-sectional view of a microphone module according to an exemplary embodiment.
  • the microphone module includes: a housing 1, an adhesive member 2, a circuit board 3, and a signal converter 4.
  • the casing 1 is formed with a cavity 11 and a sound receiving hole 12 which are in communication with each other.
  • the adhesive member 2 is disposed in the cavity 11.
  • the circuit board 3 is connected to the casing 1 and blocks the cavity 11.
  • the signal converter 4 is configured to convert an acoustic signal into an electrical signal, and is electrically connected to the circuit board 3 and is placed in the cavity 11.
  • the signal converter 4 includes a signal conversion element, such as a vibration diaphragm 41 and the like.
  • the diaphragm 41 is provided corresponding to the sound receiving hole 12. Through the sound receiving hole 12 on the casing 1, the sound waves are introduced into the cavity 11. Furthermore, the signal converter 4 located in the cavity 11 and electrically connected to the circuit board 3 receives sound waves. The vibration diaphragm 41 in the signal converter 4 vibrates under the action of sound waves, and generates an electric signal corresponding to the sound waves.
  • the adhesive member 2 Since the adhesive member 2 is provided in the cavity 11, impurities entering the cavity 11 through the sound receiving hole 12 can be directly adhered to the adhesive member 2 to avoid contact with the members other than the adhesive member 2 in the cavity 11. In addition, by performing operations such as shaking the microphone mold, impurities in the cavity 11 are adhered to the adhesive member 2 during movement, and repeated contact with components other than the adhesive member 2 in the cavity 11 is avoided.
  • the microphone module provided in the embodiment of the present disclosure is used to adhere the impurities through the adhesive member 2 on the one hand to reduce the amount of impurities in contact with the diaphragm 41 on the other hand and avoid The foreign matter is repeatedly in contact with the diaphragm 41.
  • the adhesive member 2 helps to reduce the impact and abrasion of impurities on the vibration diaphragm 41, avoid damage to the vibration diaphragm 41, and ensure the normal use of the microphone module to extend the service life of the microphone module.
  • the adhesive member 2 is a sheet-shaped adhesive member, a rod-shaped adhesive member, or a mesh-shaped adhesive member provided in the cavity 11.
  • the adhesive 2 includes a sheet-like structure. The sheet-like structure helps to increase the effective adhesion area of the adhesive member 2 to sufficiently and effectively adhere the impurities.
  • the adhesive member 2 includes a first adhesive member 21 attached to the inner wall of the casing 1.
  • the inner wall of the casing 1 includes a side wall and a top wall of the cavity 11.
  • the first adhesive member 21 is disposed on the side wall or the top wall of the cavity 11, or the first adhesive member 21 covers the inner wall of the casing 1.
  • the impurities in the cavity 11 are adhered by the first adhesive 21 attached to the inner wall of the casing 1.
  • the first adhesive member 21 covers the inner wall of the casing 1, it is equivalent to forming an adhesion layer on the inner wall of the casing 1 to have a maximum adhesion area and achieve a maximum adhesion effect.
  • Fig. 2 is a sectional view showing a microphone module according to another exemplary embodiment. Further, in this embodiment, as shown in FIG. 2, the first adhesive member 21 extends from the cavity 11 to the sound receiving hole 12 and covers the sidewall of the sound receiving hole 12.
  • the first adhesive member 21 By the first adhesive member 21 extending to the sound receiving hole 12, impurities can be prevented from entering the cavity 11 through the sound receiving hole 12, the amount of impurities entering the cavity 11 can be fundamentally reduced, and damage to the vibration diaphragm 41 caused by the impurities can be avoided.
  • the first adhesive member 21 covers the side wall of the sound receiving hole 12 to prevent the sound wave from entering the cavity 11 through the sound receiving hole 12.
  • Fig. 3 is a sectional view showing a microphone module according to another exemplary embodiment.
  • the adhesive member 2 includes a second adhesive member 22 attached to the circuit board 3. If the impurities in the cavity 11 are not adhered by the first adhesive 21, they will easily fall on the circuit board 3 that blocks the cavity 11. In this case, the impurities falling on the circuit board 3 are adhered by the second adhesive member 22.
  • the second adhesive member 22 is provided on a portion of the circuit board 3 which is not provided with a structure such as a wiring or a solder joint, which is equivalent to forming a hollow adhesive layer on the circuit board 3, taking into account Effectively adheres to impurities and normal use of the circuit board 3.
  • Fig. 4 is a schematic structural diagram of an adhesive member 2 according to an exemplary embodiment
  • Fig. 5 is a schematic structural diagram of an adhesive member 2 according to another exemplary embodiment.
  • the adhesive member 2 is directly attached to the target application carrier.
  • the optional adhesive device 2 can be directly attached to the target application carrier to simplify the manufacturing process.
  • the target sticking carrier is the casing 1 and / or the circuit board 3, and only the casing 1 is taken as an example in FIG. 4.
  • the microphone module further includes a connection layer 5.
  • the connection layer 5 includes an adhesive surface disposed oppositely, and the adhesive surface disposed oppositely adheres the adhesive member 2 and the target application carrier, respectively.
  • the adhesive member 2 and the target application carrier are connected by the connection layer 5.
  • the adhesive member 2 and the connection layer 5 have different viscosities, so that when the working layer 5 cannot be stably bonded to the target application carrier, the connection layer 5 is used to achieve a stable connection between the adhesive member 2 and the target application carrier.
  • the material selection of the adhesive member 2 is enriched to achieve the desired adhesion effect.
  • the target sticking carrier is the casing 1 and / or the circuit board 3, and only the casing 1 is taken as an example in FIG. 5.
  • the material of the adhesive member 2 is not specifically limited, such as a viscous gel, a viscous oil, or an adhesive used in the related art.
  • the circuit board 3 includes a flexible circuit board.
  • flexible circuit boards Compared with printed circuit boards, flexible circuit boards have the characteristics of high wiring density, light weight, thin thickness, and good bendability.
  • a microphone module provided with a flexible circuit board can be more closely assembled with other components or modules by using the good bending property of the flexible circuit board.
  • the signal converter 4 includes a microelectromechanical system (MEMS) sensor, and an integrated circuit module 42.
  • MEMS microelectromechanical system
  • the mems sensor includes a diaphragm 41; the integrated circuit module 42 is electrically connected to the mems sensor.
  • the integrated circuit module 42 is connected to a flexible circuit board and includes components having a surrounding structure, such as a resistor, a capacitor, and the like.
  • a surrounding structure such as a resistor, a capacitor, and the like.
  • the surrounding structure can reduce the length and width of the components, and is arranged on a thin flexible circuit board, which helps to reduce the volume of the integrated circuit module 42 and thus reduce the overall microphone module Installation space.
  • Fig. 6 is a top view of a microphone module according to an exemplary embodiment.
  • the circuit board 3 includes a first flexible circuit board 31 covering the cavity 11, a slit 6 is provided on the first flexible circuit board 31, and a connection line between adjacent slits 6 is provided. Concentric distribution.
  • the deformability of the first flexible circuit board 31 can be further increased.
  • the lines of adjacent slits 6 are distributed concentrically, which optimizes the ductility of the first flexible circuit board 31, and can produce convex deformation or depression deformation with the slit center as the vertex.
  • the first flexible circuit board 31 can be stably attached to the protruding or recessed component to improve the installation stability of the microphone module.
  • the connecting lines of adjacent slits 6 are in a concentric ring shape.
  • the circuit board 3 includes a second flexible circuit board 32 located outside the cavity 11, and the second flexible circuit board 32 is provided with staggered slits 6.
  • the second flexible circuit board 32 located outside the cavity 11 can connect the microphone module with other modules or components.
  • Setting the staggered slits 6 on the second flexible circuit board 32 can further increase the deformability of the second flexible circuit board 32.
  • the slit 6 is provided along the width direction of the second flexible circuit board 32. This case helps to increase the elasticity of the second flexible circuit board 32. It can be understood that when the second flexible circuit board 32 is stretched, the width of the slit 6 is increased, and the length of the second flexible circuit board 32 is increased.
  • the slit 6 improves the elasticity of the second flexible circuit board 32, so that when the microphone module and the module or device connected to it are relatively displaced, the second flexible circuit board 32 is still continuous, so as to avoid breakage and affect the normal use of the microphone module .
  • the slit 6 is rectangular, shuttle-shaped, linear, or the like.
  • the slit 6 includes an arc-shaped end, such as an ellipse. The arc-shaped end reduces the stress concentration at the end of the slit 6 to prevent the circuit board 3 from being torn from the slit 6 and ensures the safety of the equipment.
  • a second aspect of the present disclosure provides an electronic device including the microphone module provided in the first aspect. Since the electronic device has the microphone module provided in the first aspect, the electronic device also has the beneficial effects of the microphone module provided in the first aspect, and will not be repeated here.
  • the type of the electronic device is not specifically limited.
  • the electronic device may be a mobile phone, a computer, a notebook computer, a digital broadcasting electronic device, a game console, a tablet device, a medical device, a fitness device, a personal digital assistant, and the like.

Abstract

本公开提供了一种麦克风模组、电子设备，涉及电子设备技术领域。该麦克风模组包括：外壳、电路板、信号转换器、以及粘附件。其中，外壳形成有相连通的腔体与收声孔；电路板与所述外壳相连，封堵所述腔体；粘附件设置在所述腔体内；信号转换器用于将声信号转换为电信号，与所述电路板电连接，置于所述腔体内。本公开提供的麦克风模组通过设置在腔体内的粘附件，降低了杂质接触振动膜片的可能性，进而减少杂质对振动膜片的冲击和磨损，避免振动膜片损坏，保障麦克风模组的正常使用，并有助于延长麦克风模组的使用寿命。 (图1)

Description

麦克风模组、电子设备
交叉引用
本公开基于并要求2018年9月27日提交的中国专利申请第201811133959.7号的优先权，其全部内容通过引用结合在本文中。
技术领域
本公开涉及电子设备技术领域，尤其涉及一种麦克风模组、电子设备。
背景技术
麦克风模组是电子设备设备中不可缺少的组成部分。通常，麦克风模组包括具有腔体和收声孔的外壳，以及位于腔体中的信号转换器；其中，信号转换器包括对应收声孔设置的振动膜片。声音信号通过收声孔传入腔体，带动振动膜片振动，进而使得信号转换器将声音信号转换为电信号。
但是在使用中，麦克风模组外部的杂质亦可通过收声孔进入腔体，掉落在振动膜片上。当掉落在振动膜片上的杂质越来越多，随着振动膜片的正常振动，这些杂质极易划伤、刺破振动膜片，影响麦克风模组的正常使用，甚至缩短麦克风模组的使用寿命。
发明内容
本公开提供一种麦克风模组、电子设备，以解决相关技术中的不足。
本公开第一方面提供了一种麦克风模组，包括：
外壳，形成有相连通的腔体与收声孔；
电路板，与所述外壳相连，封堵所述腔体；
粘附件，设置在所述腔体内；以及，
信号转换器，用于将声信号转换为电信号，置于所述腔体内。
可选择地，所述粘附件包括贴覆在所述外壳内壁上的第一粘附件。
可选择地，所述第一粘附件覆盖所述外壳内壁。
可选择地，所述第一粘附件自所述腔体延伸至所述收声孔，贴覆所述收声孔侧壁。
可选择地，所述粘附件包括贴覆在所述电路板上的第二粘附件。
可选择地，所述麦克风模组还包括：连接层；
所述连接层包括相对设置的粘性面，分别胶接所述粘附件和目标贴覆载体。
可选择地，所述电路板包括柔性电路板。
可选择地，所述电路板包括对应所述腔体设置的第一柔性电路板；
在所述第一柔性电路板上设置割缝，相邻所述割缝的连线同心分布。
可选择地，所述电路板包括位于所述腔体外部的第二柔性电路板，在所述第二柔性电路板上设置有交错分布的割缝。
可选择地，所述割缝包括弧形端部。
可选择地，所述信号转换器包括：与所述柔性电路板相连的集成电路模块，所述集成电路模块包括具有环绕结构的元器件。
本公开第二方面提供了一种电子设备，包括第一方面提供的麦克风模组。
本公开的实施例提供的技术方案可以包括以下有益效果：
由于在腔体内设置了粘附件，因此通过收声孔进入腔体的杂质可直接粘附在粘附件上，避免与腔体内除粘附件以外的组件接触。并且，通过例如晃动麦克风模等操作，使得腔体内的杂质在运动过程中粘附在粘附件上，避免杂质与除粘附件外的组件反复接触。对于设置在腔体内的振动膜片而言，通过粘附件一方面可减少与振动膜片接触的杂质数量，另一方面可避免杂质与振动膜片反复接触。进而有助于削弱杂质对振动膜片的冲击和磨损，避免振动膜片损坏，保障麦克风模组的正常使用，以延长麦克风模组的使用寿命。
应当理解的是，以上的一般描述和后文的细节描述仅是示例性和解释性的，并不能限制本公开。
附图说明
此处的附图被并入说明书中并构成本说明书的一部分，示出了符合本公开的实施例，并与说明书一起用于解释本公开的原理。
图1是根据一示例性实施例示出的麦克风模组的剖视图；
图2是根据另一示例性实施例示出的麦克风模组的结构示意图；
图3是根据另一示例性实施例示出的麦克风模组的结构示意图；
图4是根据一示例性实施例示出的粘附件与外壳连接处剖视图；
图5是根据另一示例性实施例示出的粘附件与外壳连接处剖视图；
图6是根据一示例性实施例示出的麦克风模组的俯视图。
附图中各标记意为：
1、外壳；
11、腔体；
12、收声孔；
2、粘附件；
21、第一粘附件；
22、第二粘附件；
3、电路板；
31、第一柔性电路板；
32、第二柔性电路板；
4、信号转换器；
41、振动膜片；
42、集成电路模块；
5、连接层；
6、割缝。
具体实施方式
这里将详细地对示例性实施例进行说明，其示例表示在附图中。下面的描述涉及附图时，除非另有表示，不同附图中的相同数字表示相同或相似的要素。以下示例性实施例中所描述的实施方式并不代表与本公开相一致的所有实施方式。相反，它们仅是与如所附权利要求书中所详述的、本公开的一些方面相一致的装置和方法的例子。
图1是根据一示例性实施例示出的麦克风模组的剖视图，如图1所示，该麦克风模组包括：外壳1、粘附件2、电路板3、以及信号转换器4。
其中，外壳1形成有相连通的腔体11与收声孔12。粘附件2设置在腔体11内。电路板3与外壳1相连，封堵腔体11。信号转换器4，用于将声信号转换为电信号，与电路板3电连接，置于腔体11内。
作为一种实现方式，信号转换器4包括信号转换元件，例如振动膜片41等。在这样的情况下，振动膜片41对应收声孔12设置。通过外壳1上的收声孔12使得声波传入腔体11内。进而，位于腔体11内、并与电路板3电连接的信号转换器4接收声波。信号转换器4中的振动膜片41在声波的作用下振动，产生与声波对应的电信号。
由于在腔体11内设置了粘附件2，通过收声孔12进入腔体11的杂质可直接粘附在粘附件2上，避免与腔体11内除粘附件2以外的件接触。并且，通过例如晃动麦克风模等操作，使得腔体11内的杂质在运动过程中被粘在粘附件2上，避免与腔体11内除粘附件2以外的组件反复接触。
特别是针对以振动膜片41为例的信号转换元件，采用本公开实施例提供的麦克风模组，通过粘附件2粘附杂质一方面减少与振动膜片41接触的杂质数量，另一方面避免杂质与振动膜片41反复接触。进而通过该粘附件2有助于削弱杂质对振动膜片41的冲击和磨损，避免振动膜片41损坏，保障麦克风模组的正常使用，以延长麦克风模组的使用寿命。
其中，可选地，粘附件2为设置在腔体11内的片状粘附件、杆状粘附件、或者网状粘附件等。在一个实施例中，粘附件2包括片状结构。片状结构有助于增加粘附件2的有效粘附面积，以对杂质进行充分有效粘附。
如图1所示，粘附件2包括贴覆在外壳1内壁上的第一粘附件21。其中，外壳1的内壁包括腔体11的侧壁和顶壁，第一粘附件21设置在腔体11的侧壁或顶壁上，或者第一粘附件21覆盖外壳1的内壁。
通过贴覆在外壳1内壁上的第一粘附件21粘附腔体11内的杂质。并且，当第一粘附件21覆盖外壳1的内壁时，相当于在外壳1的内壁上形成了粘附层，以具有最大粘附面积，实现最大程度的粘附效果。
图2是根据另一示例性实施例示出的麦克风模组的剖视图。进一步地，在该实施例中，如图2所示，第一粘附件21自腔体11延伸至收声孔12，并贴覆收声孔12的侧壁。
通过延伸至收声孔12的第一粘附件21可避免杂质通过收声孔12进入腔体11，从根本上减少进入腔体11的杂质数量，进而避免杂质对振动膜片41造成的损坏。并且，第一粘附件21贴覆收声孔12的侧壁，避免阻碍声波通过收声孔12进入腔体11。
图3是根据另一示例性实施例示出的麦克风模组的剖视图。在一个实施例中，如图3所示，粘附件2包括贴覆在电路板3上的第二粘附件22。若腔体11内的杂质未被第一粘附件21粘附，则易掉落在封堵腔体11的电路板3上。这种情况下，通过第二粘附件22粘附掉落在电路板3上的杂质。需要说明的是，在该实施例中，第二粘附件22设置在电路板3未设有布线或焊点等结构的部分，相当于在电路板3上形成了具有镂空的粘附层，兼顾有效粘附杂质以及电路板3的正常使用。
图4是根据一示例性实施例示出的粘附件2的结构示意图；图5是根据另一示例性实施例示出的粘附件2的结构示意图。
在一个实施例中，如图4所示，粘附件2直接贴覆在目标贴覆载体上。当粘附件2可与目标贴覆载体稳定胶接时，可选粘附件2直接贴覆在目标贴覆载体上，以简化制备工艺。其中，目标贴覆载体为外壳1和/或电路板3，图4中仅以外壳1为例。
在另一个实施例中，如图5所示，麦克风模组还包括连接层5。其中，连接层5包括相对设置的粘性面，相对设置的粘性面分别胶接粘性件2和目标贴覆载体。其中，通过连接层5连接粘性件2与目标贴覆载体。在该实施例中，粘性件2与连接层5具有不同粘性，使得当工作层5无法与目标贴覆载体稳定胶接时，通连接层5实现粘附件2与目标贴覆载体的稳定连接。这样的方式丰富了粘附件2的材质选择，以实现期望粘附效果。其中，目标贴覆载体为外壳1和/或电路板3，图5中仅以外壳1为例。
在本公开实施例中，对于粘性件2的材质不做具体限定，例如粘性凝胶、粘稠的油、或者相关技术中不干胶所采用的胶黏剂等。
在一个实施例中，电路板3包括柔性电路板。与印刷电路板相比，柔性电路板具有配线密度高、重量轻、厚度薄、弯折性好的特点。设置有柔性电路板的麦克风模组，利用柔性电路板的良好弯折性能够更贴合地与其他元件或模组装配。
在这样的情况下，如图1所示，可选地，信号转换器4包括微机电系统(Microelectro Mechanical Systems，mems)传感器，以及集成电路模块42。其中，mems传感器包括振动膜片41；集成电路模块42与mems传感器电连接。
进一步地，集成电路模块42与柔性电路板相连，且包括具有环绕结构的元器件，例如电阻、电容等。与直线型结构相比，环绕结构能够减小元器件的长度和宽度，并且设置在厚度较薄的柔性电路板上，有助于缩小集成电路模块42的体积，进而减少整体麦克风模组所需安装空间。
图6是根据一示例性实施例示出的麦克风模组的俯视图。在一个实施例中，如图6所示，电路板3包括覆盖腔体11的第一柔性电路板31，在第一柔性电路板31上设置割缝6，且相邻割缝6的连线同心分布。
通过在第一柔性电路板31上设置割缝6可进一步增加第一柔性电路板31的形变能力。 并且，相邻割缝6的连线同心分布，优化了第一柔性电路板31的延展性，能够产生以割缝中心为顶点的凸出形变或凹陷形变。在这样的情况下，第一柔性电路板31可稳定贴合在呈凸出状或凹陷状的组件上，以提升该麦克风模组的安装稳定性。可选地，相邻割缝6的连线呈同心环状。
在一个实施例中，如图6所示，电路板3包括位于腔体11外部的第二柔性电路板32，在第二柔性电路板32上设置有交错分布的割缝6。
位于腔体11外部的第二柔性电路板32可连接麦克风模组与其他模组或元器件。在第二柔性电路板32上设置交错分布的割缝6可进一步增加第二柔性电路板32的形变能力。示例地，如图6所示，割缝6沿第二柔性电路板32的宽度方向设置。这种情况下有助于增加第二柔性电路板32的弹性。可以理解的是，当拉伸第二柔性电路板32时，割缝6的宽度增加，第二柔性电路板32的长度增加。通过割缝6改善第二柔性电路板32的弹性，使得当麦克风模组和与其相连的模组或器件出现相对位移时，第二柔性电路板32依然连续，避免断裂影响麦克风模组的正常使用。
在该实施例中，割缝6的形状具有多种，例如，割缝6为长方形、梭形、线形等。其中，作为一种可选方式，割缝6包括弧形端部，例如椭圆形等。通过弧形端部降低割缝6端部的应力集中，避免电路板3由割缝6处撕裂，保障设备安全。
本公开第二方面提供了一种电子设备，该电子设备包括：上述第一方面所提供的麦克风模组。由于该电子设备电子设备具有上述第一方面所提供的麦克风模组，因此同样具有第一方面提供的麦克风模组的有益效果，此处不再赘述。
此外，在本公开实施例中，对于电子设备的种类不做具体限定。示例地，电子设备可以为移动电话、计算机、笔记本电脑、数字广播电子设备、游戏控制台、平板设备、医疗设备、健身设备、个人数字助理等。
本领域技术人员在考虑说明书及实践这里公开的公开后，将容易想到本公开的其它实施方案。本申请旨在涵盖本公开的任何变型、用途或者适应性变化，这些变型、用途或者适应性变化遵循本公开的一般性原理并包括本公开未公开的本技术领域中的公知常识或惯用技术手段。说明书和实施例仅被视为示例性的，本公开的真正范围和精神由下面的权利要求指出。
应当理解的是，本公开并不局限于上面已经描述并在附图中示出的精确结构，并且可以在不脱离其范围进行各种修改和改变。本公开的范围仅由所附的权利要求来限制。

Claims (12)

  1. 一种麦克风模组，其特征在于，包括：
    外壳，形成有相连通的腔体与收声孔；
    电路板，与所述外壳相连，封堵所述腔体；
    粘附件，设置在所述腔体内；以及，
    信号转换器，用于将声信号转换为电信号，置于所述腔体内。
  2. 根据权利要求1所述的麦克风模组，其特征在于，所述粘附件包括贴覆在所述外壳的内壁上的第一粘附件。
  3. 根据权利要求2所述的麦克风模组，其特征在于，所述第一粘附件覆盖所述外壳的内壁。
  4. 根据权利要求2所述的麦克风模组，其特征在于，所述第一粘附件自所述腔体延伸至所述收声孔，贴覆在所述收声孔的侧壁上。
  5. 根据权利要求1所述的麦克风模组，其特征在于，所述粘附件包括贴覆在所述电路板上的第二粘附件。
  6. 根据权利要求2～5中任一项所述的麦克风模组，其特征在于，所述麦克风模组还包括：连接层；
    所述连接层包括相对设置的粘性面，相对设置的所述粘性面分别胶接所述粘附件和目标贴覆载体。
  7. 根据权利要求1所述的麦克风模组，其特征在于，所述电路板包括柔性电路板。
  8. 根据权利要求7所述的麦克风模组，其特征在于，所述电路板包括覆盖所述腔体的第一柔性电路板；
    在所述第一柔性电路板上设置割缝，相邻所述割缝的连线同心分布。
  9. 根据权利要求7所述的麦克风模组，其特征在于，所述电路板包括位于所述腔体外部的第二柔性电路板；
    在所述第二柔性电路板上设置有交错分布的割缝。
  10. 根据权利要求8或9中任一项所述的麦克风模组，其特征在于，所述割缝包括弧形端部。
  11. 根据权利要求7所述的麦克风模组，其特征在于，所述信号转换器包括：与所述柔性电路板相连的集成电路模块，所述集成电路模块包括具有环绕结构的元器件。
  12. 一种电子设备，其特征在于，包括：权利要求1～11中任一项所述的麦克风模组。
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