JP6900367B2 - 撮像システムに関する近赤外スペクトル応答を拡張するためのシステムおよび方法 - Google Patents
撮像システムに関する近赤外スペクトル応答を拡張するためのシステムおよび方法 Download PDFInfo
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- JP6900367B2 JP6900367B2 JP2018508724A JP2018508724A JP6900367B2 JP 6900367 B2 JP6900367 B2 JP 6900367B2 JP 2018508724 A JP2018508724 A JP 2018508724A JP 2018508724 A JP2018508724 A JP 2018508724A JP 6900367 B2 JP6900367 B2 JP 6900367B2
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Images
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
- H10F39/184—Infrared image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
- H10F39/024—Manufacture or treatment of image sensors covered by group H10F39/12 of coatings or optical elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/199—Back-illuminated image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/806—Optical elements or arrangements associated with the image sensors
- H10F39/8063—Microlenses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/806—Optical elements or arrangements associated with the image sensors
- H10F39/8067—Reflectors
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Light Receiving Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/832,290 | 2015-08-21 | ||
| US14/832,290 US9698191B2 (en) | 2015-08-21 | 2015-08-21 | System and method to extend near infrared spectral response for imaging systems |
| PCT/US2016/043307 WO2017034712A1 (en) | 2015-08-21 | 2016-07-21 | System and method to extend near infrared spectral response for imaging systems |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018525837A JP2018525837A (ja) | 2018-09-06 |
| JP2018525837A5 JP2018525837A5 (enExample) | 2019-08-08 |
| JP6900367B2 true JP6900367B2 (ja) | 2021-07-07 |
Family
ID=56682249
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018508724A Expired - Fee Related JP6900367B2 (ja) | 2015-08-21 | 2016-07-21 | 撮像システムに関する近赤外スペクトル応答を拡張するためのシステムおよび方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9698191B2 (enExample) |
| EP (1) | EP3338305B1 (enExample) |
| JP (1) | JP6900367B2 (enExample) |
| KR (1) | KR102125154B1 (enExample) |
| CN (1) | CN107851653B (enExample) |
| BR (1) | BR112018003194B1 (enExample) |
| WO (1) | WO2017034712A1 (enExample) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9786705B2 (en) * | 2015-12-21 | 2017-10-10 | Qualcomm Incorporated | Solid state image sensor with extended spectral response |
| CN107665930B (zh) * | 2017-08-30 | 2023-05-05 | 中国科学院上海技术物理研究所 | 一种实现波长拓展功能的量子阱红外探测器及设计方法 |
| CN108847418A (zh) * | 2018-06-15 | 2018-11-20 | 上海微阱电子科技有限公司 | 一种增强近红外量子效率的图像传感器结构和形成方法 |
| JP2021168316A (ja) * | 2018-07-13 | 2021-10-21 | ソニーセミコンダクタソリューションズ株式会社 | センサ素子および電子機器 |
| KR102708011B1 (ko) * | 2018-09-03 | 2024-09-24 | 삼성전자주식회사 | 이미지 센서 |
| CN111048535B (zh) * | 2018-10-15 | 2022-06-07 | 联华电子股份有限公司 | 影像传感器 |
| CN109411500B (zh) | 2018-10-31 | 2021-01-22 | 京东方科技集团股份有限公司 | 探测面板及其制作方法 |
| CN109713003B (zh) * | 2018-12-27 | 2021-06-04 | 厦门天马微电子有限公司 | 显示面板和显示装置 |
| WO2020150938A1 (zh) * | 2019-01-23 | 2020-07-30 | 深圳市汇顶科技股份有限公司 | 光电传感器及其制备方法 |
| US11268849B2 (en) * | 2019-04-22 | 2022-03-08 | Applied Materials Israel Ltd. | Sensing unit having photon to electron converter and a method |
| CN110211981B (zh) * | 2019-06-12 | 2021-11-30 | 德淮半导体有限公司 | 图像传感器及其形成方法 |
| US11276716B2 (en) | 2019-12-17 | 2022-03-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Image sensor with improved near-infrared (NIR) radiation phase-detection autofocus (PDAF) performance |
| WO2021186908A1 (ja) * | 2020-03-17 | 2021-09-23 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像装置 |
| FR3114189A1 (fr) * | 2020-09-11 | 2022-03-18 | Stmicroelectronics (Crolles 2) Sas | Dispositif électronique comprenant une région semiconductrice photosensible et procédé de fabrication correspondant |
| CN114695397A (zh) * | 2020-12-30 | 2022-07-01 | 上海集成电路装备材料产业创新中心有限公司 | 增强近红外量子效率的图像传感器结构和形成方法 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7615808B2 (en) * | 2004-09-17 | 2009-11-10 | California Institute Of Technology | Structure for implementation of back-illuminated CMOS or CCD imagers |
| JP5147226B2 (ja) | 2006-12-15 | 2013-02-20 | 株式会社日立製作所 | 固体撮像素子、光検出器及びこれを用いた認証装置 |
| JP5364989B2 (ja) | 2007-10-02 | 2013-12-11 | ソニー株式会社 | 固体撮像装置およびカメラ |
| US7982177B2 (en) | 2008-01-31 | 2011-07-19 | Omnivision Technologies, Inc. | Frontside illuminated image sensor comprising a complex-shaped reflector |
| JP5121764B2 (ja) * | 2009-03-24 | 2013-01-16 | 株式会社東芝 | 固体撮像装置 |
| US20100259826A1 (en) * | 2009-04-10 | 2010-10-14 | Lightwave Power, Inc. | Planar plasmonic device for light reflection, diffusion and guiding |
| US8389921B2 (en) | 2010-04-30 | 2013-03-05 | Omnivision Technologies, Inc. | Image sensor having array of pixels and metal reflectors with widths scaled based on distance from center of the array |
| JP2012064824A (ja) * | 2010-09-17 | 2012-03-29 | Toshiba Corp | 固体撮像素子、その製造方法、カメラ |
| JP2012238632A (ja) | 2011-05-10 | 2012-12-06 | Sony Corp | 固体撮像装置、固体撮像装置の製造方法、及び、電子機器 |
| JP5814625B2 (ja) * | 2011-05-27 | 2015-11-17 | キヤノン株式会社 | 固体撮像装置、それを用いた撮像システム及び固体撮像装置の製造方法 |
| US20120313205A1 (en) * | 2011-06-10 | 2012-12-13 | Homayoon Haddad | Photosensitive Imagers Having Defined Textures for Light Trapping and Associated Methods |
| JP5760811B2 (ja) | 2011-07-28 | 2015-08-12 | ソニー株式会社 | 固体撮像素子および撮像システム |
| JP2013098503A (ja) | 2011-11-07 | 2013-05-20 | Toshiba Corp | 固体撮像素子 |
| US8716823B2 (en) | 2011-11-08 | 2014-05-06 | Aptina Imaging Corporation | Backside image sensor pixel with silicon microlenses and metal reflector |
| US8941203B2 (en) | 2012-03-01 | 2015-01-27 | Raytheon Company | Photodetector with surface plasmon resonance |
| JP6035921B2 (ja) * | 2012-07-10 | 2016-11-30 | 富士通株式会社 | 光検出器およびその製造方法 |
| US9105546B2 (en) * | 2012-09-19 | 2015-08-11 | Semiconductor Components Industries, Llc | Imaging systems with backside illuminated near infrared imaging pixels |
| US9093345B2 (en) * | 2012-10-26 | 2015-07-28 | Canon Kabushiki Kaisha | Solid-state imaging apparatus and imaging system |
| US9349770B2 (en) | 2014-02-11 | 2016-05-24 | Semiconductor Components Industries, Llc | Imaging systems with infrared pixels having increased quantum efficiency |
| JP2016001633A (ja) * | 2014-06-11 | 2016-01-07 | ソニー株式会社 | 固体撮像素子、および電子装置 |
-
2015
- 2015-08-21 US US14/832,290 patent/US9698191B2/en active Active
-
2016
- 2016-07-21 BR BR112018003194-1A patent/BR112018003194B1/pt not_active IP Right Cessation
- 2016-07-21 KR KR1020187004847A patent/KR102125154B1/ko not_active Expired - Fee Related
- 2016-07-21 JP JP2018508724A patent/JP6900367B2/ja not_active Expired - Fee Related
- 2016-07-21 EP EP16750551.0A patent/EP3338305B1/en active Active
- 2016-07-21 WO PCT/US2016/043307 patent/WO2017034712A1/en not_active Ceased
- 2016-07-21 CN CN201680045447.8A patent/CN107851653B/zh active Active
Also Published As
| Publication number | Publication date |
|---|---|
| EP3338305B1 (en) | 2019-11-27 |
| KR102125154B1 (ko) | 2020-06-19 |
| BR112018003194A2 (pt) | 2018-09-25 |
| US20170053964A1 (en) | 2017-02-23 |
| JP2018525837A (ja) | 2018-09-06 |
| US9698191B2 (en) | 2017-07-04 |
| BR112018003194B1 (pt) | 2022-11-16 |
| CN107851653A (zh) | 2018-03-27 |
| KR20180043271A (ko) | 2018-04-27 |
| CN107851653B (zh) | 2022-03-22 |
| EP3338305A1 (en) | 2018-06-27 |
| WO2017034712A1 (en) | 2017-03-02 |
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