JP6880723B2 - 両面金属積層板、両面金属積層板の製造方法、及びパターンの画像転写方法 - Google Patents

両面金属積層板、両面金属積層板の製造方法、及びパターンの画像転写方法 Download PDF

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Publication number
JP6880723B2
JP6880723B2 JP2016254151A JP2016254151A JP6880723B2 JP 6880723 B2 JP6880723 B2 JP 6880723B2 JP 2016254151 A JP2016254151 A JP 2016254151A JP 2016254151 A JP2016254151 A JP 2016254151A JP 6880723 B2 JP6880723 B2 JP 6880723B2
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Japan
Prior art keywords
metal
double
layer
metal layer
sided
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Active
Application number
JP2016254151A
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English (en)
Japanese (ja)
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JP2018103531A (ja
Inventor
基行 富澤
基行 富澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Metal Mining Co Ltd
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Sumitomo Metal Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Mining Co Ltd filed Critical Sumitomo Metal Mining Co Ltd
Priority to JP2016254151A priority Critical patent/JP6880723B2/ja
Priority to TW106144842A priority patent/TWI806847B/zh
Priority to CN201711393635.2A priority patent/CN108237801B/zh
Priority to KR1020170177238A priority patent/KR102514230B1/ko
Publication of JP2018103531A publication Critical patent/JP2018103531A/ja
Application granted granted Critical
Publication of JP6880723B2 publication Critical patent/JP6880723B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
    • B41M5/382—Contact thermal transfer or sublimation processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/06—Coating on the layer surface on metal layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/20—Inorganic coating
    • B32B2255/205—Metallic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B32B2307/734—Dimensional stability

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2016254151A 2016-12-27 2016-12-27 両面金属積層板、両面金属積層板の製造方法、及びパターンの画像転写方法 Active JP6880723B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2016254151A JP6880723B2 (ja) 2016-12-27 2016-12-27 両面金属積層板、両面金属積層板の製造方法、及びパターンの画像転写方法
TW106144842A TWI806847B (zh) 2016-12-27 2017-12-20 兩面金屬疊層板、兩面金屬疊層板之製造方法、及圖案之圖像轉印方法
CN201711393635.2A CN108237801B (zh) 2016-12-27 2017-12-21 两面金属叠层板、两面金属叠层板的制造方法、及图案的图像转印方法
KR1020170177238A KR102514230B1 (ko) 2016-12-27 2017-12-21 양면 금속 적층판, 양면 금속 적층판 제조방법 및 패턴의 화상 전사 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016254151A JP6880723B2 (ja) 2016-12-27 2016-12-27 両面金属積層板、両面金属積層板の製造方法、及びパターンの画像転写方法

Publications (2)

Publication Number Publication Date
JP2018103531A JP2018103531A (ja) 2018-07-05
JP6880723B2 true JP6880723B2 (ja) 2021-06-02

Family

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JP2016254151A Active JP6880723B2 (ja) 2016-12-27 2016-12-27 両面金属積層板、両面金属積層板の製造方法、及びパターンの画像転写方法

Country Status (4)

Country Link
JP (1) JP6880723B2 (zh)
KR (1) KR102514230B1 (zh)
CN (1) CN108237801B (zh)
TW (1) TWI806847B (zh)

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002124763A (ja) * 2000-10-16 2002-04-26 Matsushita Electric Ind Co Ltd 回路形成基板の製造方法、回路形成基板および回路形成基板用材料
TWI320046B (en) * 2002-02-26 2010-02-01 Polyamide-imide resin, flexible metal-clad laminate and flexible print substrate
JP4341023B2 (ja) 2004-04-13 2009-10-07 住友金属鉱山株式会社 金属被覆液晶ポリマーフィルムの製造方法
JPWO2006001305A1 (ja) * 2004-06-23 2008-04-17 日立化成工業株式会社 印刷配線板用プリプレグ、金属箔張積層板、及び印刷配線板、並びに、多層印刷配線板の製造方法
CN100566515C (zh) * 2004-07-27 2009-12-02 加古川塑料株式会社 双层膜、双层膜的制造方法以及印刷电路板的制造方法
TWI375114B (en) * 2004-10-22 2012-10-21 Shinetsu Chemical Co Photomask-blank, photomask and fabrication method thereof
JP2006137011A (ja) 2004-11-10 2006-06-01 Kuraray Co Ltd 金属張積層体およびその製造方法
US20090056981A1 (en) * 2005-04-18 2009-03-05 Toyo Boseki Kabushiki Kaisha Thin film-laminated polyimide film and flexible printed wiring board
JP2007196671A (ja) * 2005-12-26 2007-08-09 Du Pont Toray Co Ltd 銅張り板
TWI752316B (zh) * 2006-05-16 2022-01-11 日商半導體能源研究所股份有限公司 液晶顯示裝置
JP2008118105A (ja) * 2006-10-11 2008-05-22 Hitachi Chem Co Ltd イオンガン処理方法、ならびにそれを用いて作製された銅張積層板およびプリント配線基板
JP2008172025A (ja) * 2007-01-11 2008-07-24 Sharp Corp 多層プリント配線板の製造方法
JP5194602B2 (ja) 2007-07-20 2013-05-08 住友金属鉱山株式会社 金属被覆ポリイミド基板の製造方法
TWI441573B (zh) * 2007-07-27 2014-06-11 Ube Industries 配線基板之製造程序
WO2009054456A1 (ja) * 2007-10-23 2009-04-30 Ube Industries, Ltd. プリント配線板の製造方法
JP5266925B2 (ja) * 2008-07-23 2013-08-21 住友金属鉱山株式会社 金属化ポリイミドフィルムとその製造方法
JP5267379B2 (ja) * 2009-08-18 2013-08-21 住友金属鉱山株式会社 金属被覆ポリイミドフィルムとその製造方法
CN101998761A (zh) * 2009-08-26 2011-03-30 比亚迪股份有限公司 一种金属积层板及其制备方法
JP5541122B2 (ja) * 2010-11-30 2014-07-09 山一電機株式会社 フレキシブル配線板
JP5746866B2 (ja) * 2011-01-05 2015-07-08 Jx日鉱日石金属株式会社 銅張積層板及びその製造方法
TWI568865B (zh) * 2013-10-23 2017-02-01 Sumitomo Metal Mining Co Layer 2 flexible wiring substrate and manufacturing method thereof, and two-layer flexible wiring board and manufacturing method thereof
TWI621381B (zh) * 2014-04-02 2018-04-11 Jx Nippon Mining & Metals Corp Laminated body with metal foil with carrier
JP2016015359A (ja) * 2014-06-30 2016-01-28 新日鉄住金化学株式会社 金属張積層体の寸法安定性の評価方法及び回路基板の製造方法
JP6252988B2 (ja) * 2014-10-31 2017-12-27 住友金属鉱山株式会社 ２層銅張積層板及びその製造方法、並びにそれを用いたフレキシブル配線板及びその製造方法

Also Published As

Publication number Publication date
JP2018103531A (ja) 2018-07-05
CN108237801A (zh) 2018-07-03
KR102514230B1 (ko) 2023-03-24
TWI806847B (zh) 2023-07-01
CN108237801B (zh) 2020-12-29
TW201830539A (zh) 2018-08-16
KR20180076326A (ko) 2018-07-05

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