JP6869623B2 - レーザ加工装置 - Google Patents

レーザ加工装置 Download PDF

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Publication number
JP6869623B2
JP6869623B2 JP2017206874A JP2017206874A JP6869623B2 JP 6869623 B2 JP6869623 B2 JP 6869623B2 JP 2017206874 A JP2017206874 A JP 2017206874A JP 2017206874 A JP2017206874 A JP 2017206874A JP 6869623 B2 JP6869623 B2 JP 6869623B2
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Japan
Prior art keywords
processing
path
reflected light
incident
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017206874A
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English (en)
Japanese (ja)
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JP2019076937A (ja
Inventor
遠入　尚亮
尚亮 遠入
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Heavy Industries Ltd
Original Assignee
Sumitomo Heavy Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Heavy Industries Ltd filed Critical Sumitomo Heavy Industries Ltd
Priority to JP2017206874A priority Critical patent/JP6869623B2/ja
Priority to TW107124415A priority patent/TWI694880B/zh
Priority to CN201810807564.4A priority patent/CN109702328B/zh
Priority to KR1020180083469A priority patent/KR102333897B1/ko
Publication of JP2019076937A publication Critical patent/JP2019076937A/ja
Application granted granted Critical
Publication of JP6869623B2 publication Critical patent/JP6869623B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/705—Beam measuring device
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
JP2017206874A 2017-10-26 2017-10-26 レーザ加工装置 Active JP6869623B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2017206874A JP6869623B2 (ja) 2017-10-26 2017-10-26 レーザ加工装置
TW107124415A TWI694880B (zh) 2017-10-26 2018-07-16 雷射加工裝置
CN201810807564.4A CN109702328B (zh) 2017-10-26 2018-07-18 激光加工装置
KR1020180083469A KR102333897B1 (ko) 2017-10-26 2018-07-18 레이저가공장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017206874A JP6869623B2 (ja) 2017-10-26 2017-10-26 レーザ加工装置

Publications (2)

Publication Number Publication Date
JP2019076937A JP2019076937A (ja) 2019-05-23
JP6869623B2 true JP6869623B2 (ja) 2021-05-12

Family

ID=66253813

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017206874A Active JP6869623B2 (ja) 2017-10-26 2017-10-26 レーザ加工装置

Country Status (4)

Country Link
JP (1) JP6869623B2 (zh)
KR (1) KR102333897B1 (zh)
CN (1) CN109702328B (zh)
TW (1) TWI694880B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102217738B1 (ko) * 2019-09-09 2021-02-22 원텍 주식회사 레이저 빔의 조사위치 측정이 가능한 광학 시스템
CN112620964B (zh) * 2021-03-15 2021-06-04 金洲数控(北京)软件技术有限公司 一种基于包覆建模的激光加工控制方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3259695B2 (ja) * 1998-10-22 2002-02-25 松下電器産業株式会社 レーザ加工装置及びレーザ加工方法
JP3491545B2 (ja) 1998-12-25 2004-01-26 松下電器産業株式会社 レーザ加工装置および加工方法
JP3642969B2 (ja) * 1999-02-09 2005-04-27 松下電器産業株式会社 レーザー加工装置および方法
US6639177B2 (en) * 2001-03-29 2003-10-28 Gsi Lumonics Corporation Method and system for processing one or more microstructures of a multi-material device
JP3926620B2 (ja) 2001-12-19 2007-06-06 日立ビアメカニクス株式会社 レーザ加工装置およびその方法
KR100584838B1 (ko) * 2004-10-13 2006-05-30 주식회사 이오테크닉스 레이저 드릴링 시스템의 보정방법
JP4765378B2 (ja) * 2005-04-08 2011-09-07 パナソニック株式会社 レーザ加工装置
JP2009123421A (ja) * 2007-11-13 2009-06-04 Canon Inc 気密容器の製造方法
KR101300575B1 (ko) * 2011-09-30 2013-08-27 앰코 테크놀로지 코리아 주식회사 반도체 패키지 제조용 레이저 가공 장치 및 방법
JP2013219168A (ja) 2012-04-09 2013-10-24 Panasonic Corp レーザー加工装置
KR20150009123A (ko) * 2013-07-15 2015-01-26 삼성전자주식회사 레이저를 이용하여 반도체를 가공하는 장치
FR3020684B1 (fr) * 2014-04-30 2017-05-19 Horiba Jobin Yvon Sas Systeme et procede de spectrometrie de decharge luminescente et de mesure in situ de la profondeur de gravure d'un echantillon
JP2016129203A (ja) * 2015-01-09 2016-07-14 株式会社ディスコ ウエーハの加工方法
JP6277986B2 (ja) 2015-03-24 2018-02-14 トヨタ自動車株式会社 レーザ溶接装置及びレーザ溶接方法
WO2017126363A1 (ja) * 2016-01-18 2017-07-27 三菱電機株式会社 レーザ光のためのパワーバランス装置、レーザ加工装置

Also Published As

Publication number Publication date
JP2019076937A (ja) 2019-05-23
CN109702328B (zh) 2021-03-12
CN109702328A (zh) 2019-05-03
KR20190046609A (ko) 2019-05-07
TWI694880B (zh) 2020-06-01
KR102333897B1 (ko) 2021-12-01
TW201916963A (zh) 2019-05-01

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