JP6860451B2 - 機能性チップを備える基板を研磨する方法 - Google Patents

機能性チップを備える基板を研磨する方法 Download PDF

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Publication number
JP6860451B2
JP6860451B2 JP2017170302A JP2017170302A JP6860451B2 JP 6860451 B2 JP6860451 B2 JP 6860451B2 JP 2017170302 A JP2017170302 A JP 2017170302A JP 2017170302 A JP2017170302 A JP 2017170302A JP 6860451 B2 JP6860451 B2 JP 6860451B2
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Japan
Prior art keywords
polishing
substrate
end point
insulating material
metal layer
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JP2017170302A
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English (en)
Japanese (ja)
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JP2019047022A5 (zh
JP2019047022A (ja
Inventor
哲二 戸川
哲二 戸川
曽布川　拓司
拓司 曽布川
畠山　雅規
雅規 畠山
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Ebara Corp
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Ebara Corp
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Priority to JP2017170302A priority Critical patent/JP6860451B2/ja
Priority to PCT/JP2018/030894 priority patent/WO2019049659A1/ja
Priority to KR1020237021860A priority patent/KR20230101949A/ko
Priority to KR1020207005105A priority patent/KR102550564B1/ko
Priority to US16/643,124 priority patent/US11597051B2/en
Priority to CN201880057226.1A priority patent/CN111095492B/zh
Priority to TW107129857A priority patent/TWI773810B/zh
Publication of JP2019047022A publication Critical patent/JP2019047022A/ja
Publication of JP2019047022A5 publication Critical patent/JP2019047022A5/ja
Priority to JP2021053348A priority patent/JP7177207B2/ja
Application granted granted Critical
Publication of JP6860451B2 publication Critical patent/JP6860451B2/ja
Priority to US18/161,707 priority patent/US20230173636A1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/31051—Planarisation of the insulating layers
    • H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/561—Batch processing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2017170302A 2017-09-05 2017-09-05 機能性チップを備える基板を研磨する方法 Active JP6860451B2 (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP2017170302A JP6860451B2 (ja) 2017-09-05 2017-09-05 機能性チップを備える基板を研磨する方法
KR1020237021860A KR20230101949A (ko) 2017-09-05 2018-08-22 기능성 칩을 구비하는 기판을 연마하는 방법
KR1020207005105A KR102550564B1 (ko) 2017-09-05 2018-08-22 기능성 칩을 구비하는 기판을 연마하는 방법
US16/643,124 US11597051B2 (en) 2017-09-05 2018-08-22 Method for polishing substrate including functional chip
CN201880057226.1A CN111095492B (zh) 2017-09-05 2018-08-22 基板、具备功能性芯片的基板的研磨方法、非暂时性的计算机可读取的记录介质
PCT/JP2018/030894 WO2019049659A1 (ja) 2017-09-05 2018-08-22 機能性チップを備える基板を研磨する方法
TW107129857A TWI773810B (zh) 2017-09-05 2018-08-28 具備功能性晶片之基板的研磨方法、使包含電腦之控制裝置執行該方法之程式、電腦可讀取之記錄媒介、及基板
JP2021053348A JP7177207B2 (ja) 2017-09-05 2021-03-26 機能性チップを備える基板を研磨する方法
US18/161,707 US20230173636A1 (en) 2017-09-05 2023-01-30 Method for polishing substrate including functional chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017170302A JP6860451B2 (ja) 2017-09-05 2017-09-05 機能性チップを備える基板を研磨する方法

Related Child Applications (1)

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JP2021053348A Division JP7177207B2 (ja) 2017-09-05 2021-03-26 機能性チップを備える基板を研磨する方法

Publications (3)

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JP2019047022A JP2019047022A (ja) 2019-03-22
JP2019047022A5 JP2019047022A5 (zh) 2020-07-16
JP6860451B2 true JP6860451B2 (ja) 2021-04-14

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JP2017170302A Active JP6860451B2 (ja) 2017-09-05 2017-09-05 機能性チップを備える基板を研磨する方法
JP2021053348A Active JP7177207B2 (ja) 2017-09-05 2021-03-26 機能性チップを備える基板を研磨する方法

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JP2021053348A Active JP7177207B2 (ja) 2017-09-05 2021-03-26 機能性チップを備える基板を研磨する方法

Country Status (6)

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US (2) US11597051B2 (zh)
JP (2) JP6860451B2 (zh)
KR (2) KR20230101949A (zh)
CN (1) CN111095492B (zh)
TW (1) TWI773810B (zh)
WO (1) WO2019049659A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7325913B2 (ja) * 2019-11-22 2023-08-15 株式会社ディスコ ウェーハ加工装置

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* Cited by examiner, † Cited by third party
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US5234868A (en) * 1992-10-29 1993-08-10 International Business Machines Corporation Method for determining planarization endpoint during chemical-mechanical polishing
JPH09139369A (ja) * 1995-11-15 1997-05-27 Hitachi Ltd 半導体装置の製造方法およびそれに使用される研磨装置
MY139405A (en) * 1998-09-28 2009-09-30 Ibiden Co Ltd Printed circuit board and method for its production
JP2000124601A (ja) * 1998-10-13 2000-04-28 Ibiden Co Ltd プリント配線板の製造方法
JP3141939B2 (ja) * 1998-11-26 2001-03-07 日本電気株式会社 金属配線形成方法
JP4056854B2 (ja) 2002-11-05 2008-03-05 新光電気工業株式会社 半導体装置の製造方法
US20050173259A1 (en) * 2004-02-06 2005-08-11 Applied Materials, Inc. Endpoint system for electro-chemical mechanical polishing
JP2007214402A (ja) 2006-02-10 2007-08-23 Cmk Corp 半導体素子及び半導体素子内蔵型プリント配線板
JP4899604B2 (ja) 2006-04-13 2012-03-21 ソニー株式会社 三次元半導体パッケージ製造方法
JP5006883B2 (ja) * 2006-10-06 2012-08-22 株式会社荏原製作所 加工終点検知方法および加工装置
JP2008100319A (ja) * 2006-10-19 2008-05-01 Sharp Corp 研削加工方法および研削加工装置
JP2011000647A (ja) 2009-06-16 2011-01-06 Ebara Corp 研磨監視方法
TWI453837B (zh) * 2011-06-13 2014-09-21 Advanced Semiconductor Eng 具有非導電層的半導體封裝及其製造方法
JP2013044782A (ja) * 2011-08-22 2013-03-04 Seiko Epson Corp 光学素子、電気光学装置、投射型映像装置及び光学素子の製造方法
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US9754805B1 (en) * 2016-02-25 2017-09-05 Taiwan Semiconductor Manufacturing Company, Ltd. Packaging method and structure

Also Published As

Publication number Publication date
US20200391341A1 (en) 2020-12-17
JP7177207B2 (ja) 2022-11-22
US20230173636A1 (en) 2023-06-08
KR102550564B1 (ko) 2023-07-04
KR20200049767A (ko) 2020-05-08
CN111095492B (zh) 2023-12-01
TW201919822A (zh) 2019-06-01
KR20230101949A (ko) 2023-07-06
JP2021103789A (ja) 2021-07-15
CN111095492A (zh) 2020-05-01
US11597051B2 (en) 2023-03-07
WO2019049659A1 (ja) 2019-03-14
JP2019047022A (ja) 2019-03-22
TWI773810B (zh) 2022-08-11

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