JP6858452B2 - 識別マーク付きウェーハ治具 - Google Patents
識別マーク付きウェーハ治具 Download PDFInfo
- Publication number
- JP6858452B2 JP6858452B2 JP2017123395A JP2017123395A JP6858452B2 JP 6858452 B2 JP6858452 B2 JP 6858452B2 JP 2017123395 A JP2017123395 A JP 2017123395A JP 2017123395 A JP2017123395 A JP 2017123395A JP 6858452 B2 JP6858452 B2 JP 6858452B2
- Authority
- JP
- Japan
- Prior art keywords
- identification mark
- wafer
- jig
- identification
- reader
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000013078 crystal Substances 0.000 claims description 12
- 235000012431 wafers Nutrition 0.000 description 121
- 238000012545 processing Methods 0.000 description 19
- 238000001514 detection method Methods 0.000 description 6
- 238000012546 transfer Methods 0.000 description 6
- 238000012795 verification Methods 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 229910003465 moissanite Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02021—Edge treatment, chamfering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67282—Marking devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54493—Peripheral marks on wafers, e.g. orientation flats, notches, lot number
Description
17 ノッチ
19 識別マーク
20 識別マーク読み取り機構
21 識別マーク付きウェーハ治具
22 センターテーブル
25 ウェーハ片
26 中心位置合わせ部材
27 ノッチ
29 識別マーク
32 結晶方位検出ユニット
38 識別マークリーダー
44 照明
46 カメラ
Claims (3)
- デバイスウェーハに形成された識別マークを読み取る識別マーク読み取り機構の機能検証に用いる識別マーク付きウェーハ治具であって、
該デバイスウェーハの該識別マークが形成された領域を切り出したウェーハ片と、
該デバイスウェーハと同じ直径の円形プレートと、を備え、
該ウェーハ片の該識別マークが、該デバイスウェーハにおける該識別マークの位置と同一位置となるように、該円形プレートに該ウェーハ片が固定されていることを特徴とする識別マーク付きウェーハ治具。 - 該ウェーハ片は、該デバイスウェーハの結晶方位を示すノッチを含む請求項1記載の識別マーク付きウェーハ治具。
- 該円形プレートには複数の該ウェーハ片が装着され、各ウェーハ片には異なる識別マークが形成されている請求項1又は2記載の識別マーク付きウェーハ治具。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017123395A JP6858452B2 (ja) | 2017-06-23 | 2017-06-23 | 識別マーク付きウェーハ治具 |
TW107115387A TWI754747B (zh) | 2017-06-23 | 2018-05-07 | 附識別標記的晶圓治具 |
KR1020180065901A KR102490982B1 (ko) | 2017-06-23 | 2018-06-08 | 식별 마크가 형성된 웨이퍼 지그 |
CN201810588332.4A CN109119359B (zh) | 2017-06-23 | 2018-06-08 | 带识别标记的晶片治具 |
US16/010,736 US11177149B2 (en) | 2017-06-23 | 2018-06-18 | Wafer jig with identification mark |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017123395A JP6858452B2 (ja) | 2017-06-23 | 2017-06-23 | 識別マーク付きウェーハ治具 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019009275A JP2019009275A (ja) | 2019-01-17 |
JP6858452B2 true JP6858452B2 (ja) | 2021-04-14 |
Family
ID=64692724
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017123395A Active JP6858452B2 (ja) | 2017-06-23 | 2017-06-23 | 識別マーク付きウェーハ治具 |
Country Status (5)
Country | Link |
---|---|
US (1) | US11177149B2 (ja) |
JP (1) | JP6858452B2 (ja) |
KR (1) | KR102490982B1 (ja) |
CN (1) | CN109119359B (ja) |
TW (1) | TWI754747B (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100773763B1 (ko) * | 2005-11-21 | 2007-11-09 | 남중송 | 조립식 비닐하우스 |
KR100721707B1 (ko) * | 2006-02-03 | 2007-05-25 | 이원근 | 조립식 벽체용 판넬 |
KR100767390B1 (ko) * | 2006-08-07 | 2007-10-17 | 크레신 주식회사 | 이퀄라이저 기능을 가진 이어폰 |
KR100718006B1 (ko) * | 2006-11-10 | 2007-05-14 | 주식회사 부일건화 | 단열재를 이용한 3차원 입체 지붕재 |
KR100754472B1 (ko) * | 2006-12-01 | 2007-09-03 | 제이에스티 인더스트리얼 (홍콩) 컴퍼니 리미티드 | 히터용 보호망과 이를 이용한 전기히터 |
KR100783776B1 (ko) * | 2006-12-19 | 2007-12-07 | 장춘환 | 절첩수단을 갖는 온실용 보온터널 활대 |
KR100705415B1 (ko) * | 2007-01-22 | 2007-04-10 | 이치영 | 단열패널을 이용한 난방구조 및 그의 시공방법 |
JP7358107B2 (ja) * | 2019-07-31 | 2023-10-10 | 株式会社ディスコ | レーザー加工装置 |
CN117524921A (zh) * | 2019-11-27 | 2024-02-06 | 西安航思半导体有限公司 | 集成电路的封装加工设备 |
CN114603265B (zh) * | 2022-05-10 | 2022-07-26 | 常州市金锤隆锻造有限公司 | 一种晶圆精准切割用的硅圆片切割设备及切割方法 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH097977A (ja) * | 1995-06-26 | 1997-01-10 | Disco Abrasive Syst Ltd | ダイシング装置及びダイシングシステム |
US6085967A (en) * | 1998-12-28 | 2000-07-11 | Eastman Kodak Company | Method of registrably aligning fabricated wafers preceding bonding |
US6420792B1 (en) * | 1999-09-24 | 2002-07-16 | Texas Instruments Incorporated | Semiconductor wafer edge marking |
JP3922513B2 (ja) * | 2000-07-31 | 2007-05-30 | 信越半導体株式会社 | 検査用ウェーハ、その作製方法及びその作製装置 |
JP4071476B2 (ja) * | 2001-03-21 | 2008-04-02 | 株式会社東芝 | 半導体ウェーハ及び半導体ウェーハの製造方法 |
CN101330000B (zh) * | 2001-03-21 | 2011-06-08 | 株式会社东芝 | 具有id标记的半导体晶片,及从中生产半导体器件的方法和设备 |
JP2002346772A (ja) * | 2001-05-21 | 2002-12-04 | Sumitomo Mitsubishi Silicon Corp | レーザマーキングウェーハ |
US6830941B1 (en) * | 2002-12-17 | 2004-12-14 | Advanced Micro Devices, Inc. | Method and apparatus for identifying individual die during failure analysis |
JP4342861B2 (ja) | 2003-07-22 | 2009-10-14 | 株式会社ディスコ | 半導体ウエーハの加工装置 |
DE102004027489B4 (de) * | 2004-06-04 | 2017-03-02 | Infineon Technologies Ag | Verfahren zum Anordnen von Chips eines ersten Substrats auf einem zweiten Substrat |
JP4507985B2 (ja) * | 2005-05-27 | 2010-07-21 | パナソニック株式会社 | チップのピックアップ装置およびピックアップ方法 |
JP4693542B2 (ja) * | 2005-08-09 | 2011-06-01 | 信越ポリマー株式会社 | 半導体ウェーハのダイシング用フレーム |
JP2007234945A (ja) * | 2006-03-02 | 2007-09-13 | Toshiba Ceramics Co Ltd | レーザーマーキングウェーハおよびその製造方法 |
JP4693696B2 (ja) * | 2006-06-05 | 2011-06-01 | 株式会社東京精密 | ワーク処理装置 |
US8187897B2 (en) * | 2008-08-19 | 2012-05-29 | International Business Machines Corporation | Fabricating product chips and die with a feature pattern that contains information relating to the product chip |
US9367882B2 (en) * | 2012-08-07 | 2016-06-14 | GlobalFoundries, Inc. | Waferstart processes and systems for integrated circuit fabrication |
US9508653B2 (en) * | 2013-09-18 | 2016-11-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Die-tracing in integrated circuit manufacturing and packaging |
JP6148160B2 (ja) * | 2013-11-21 | 2017-06-14 | 株式会社ディスコ | ウエーハの加工方法 |
US9613912B2 (en) * | 2014-12-16 | 2017-04-04 | Deca Technologies Inc. | Method of marking a semiconductor package |
-
2017
- 2017-06-23 JP JP2017123395A patent/JP6858452B2/ja active Active
-
2018
- 2018-05-07 TW TW107115387A patent/TWI754747B/zh active
- 2018-06-08 CN CN201810588332.4A patent/CN109119359B/zh active Active
- 2018-06-08 KR KR1020180065901A patent/KR102490982B1/ko active IP Right Grant
- 2018-06-18 US US16/010,736 patent/US11177149B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN109119359B (zh) | 2024-02-02 |
CN109119359A (zh) | 2019-01-01 |
JP2019009275A (ja) | 2019-01-17 |
TWI754747B (zh) | 2022-02-11 |
US11177149B2 (en) | 2021-11-16 |
US20180374729A1 (en) | 2018-12-27 |
TW201906046A (zh) | 2019-02-01 |
KR102490982B1 (ko) | 2023-01-19 |
KR20190000790A (ko) | 2019-01-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6858452B2 (ja) | 識別マーク付きウェーハ治具 | |
US11105752B2 (en) | Inspecting apparatus and processing apparatus including the same | |
TW201639054A (zh) | 加工裝置 | |
US7329079B2 (en) | Semiconductor wafer processing machine | |
KR102546465B1 (ko) | 절삭 장치 및 웨이퍼의 가공 방법 | |
KR20180037116A (ko) | 절삭 장치 | |
JPWO2017130361A1 (ja) | ダイピックアップ装置 | |
TW201946216A (zh) | 加工裝置 | |
JP2007329266A (ja) | チップの実装装置及び実装方法 | |
US10935957B2 (en) | Processing apparatus | |
US20190378732A1 (en) | Treatment apparatus for treating workpiece | |
US9569852B2 (en) | Alignment method | |
JP2009141231A (ja) | フレームクランプ装置 | |
JP4342861B2 (ja) | 半導体ウエーハの加工装置 | |
JP2011218477A (ja) | 加工装置 | |
JP2015226043A (ja) | ウェーハid読み取り装置 | |
JP6608297B2 (ja) | 搬送調節ジグ | |
JP2010040727A (ja) | 板状物の分割方法 | |
JP5439141B2 (ja) | 半導体チップの実装装置及び実装方法 | |
JP6689542B2 (ja) | 切削装置 | |
JP7436165B2 (ja) | ダイシングユニットの診断方法、及び、ダイシングシステム | |
TWI779194B (zh) | 工件加工方法 | |
JP2023019353A (ja) | 向き検出装置 | |
CN113594090A (zh) | 多个晶片的处理方法和切削装置 | |
JP2008047812A (ja) | 半導体チップの供給装置及び実装装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20200406 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20210323 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20210323 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20210324 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6858452 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |