JP6856295B1 - 半導体受光素子 - Google Patents
半導体受光素子 Download PDFInfo
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- JP6856295B1 JP6856295B1 JP2021502631A JP2021502631A JP6856295B1 JP 6856295 B1 JP6856295 B1 JP 6856295B1 JP 2021502631 A JP2021502631 A JP 2021502631A JP 2021502631 A JP2021502631 A JP 2021502631A JP 6856295 B1 JP6856295 B1 JP 6856295B1
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 88
- 239000000758 substrate Substances 0.000 claims abstract description 25
- 238000010030 laminating Methods 0.000 claims abstract description 3
- 230000031700 light absorption Effects 0.000 claims description 39
- 238000013459 approach Methods 0.000 claims description 7
- 230000035945 sensitivity Effects 0.000 abstract description 23
- 230000007423 decrease Effects 0.000 abstract description 20
- 238000010586 diagram Methods 0.000 abstract description 2
- 239000002184 metal Substances 0.000 description 9
- 230000003287 optical effect Effects 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000013307 optical fiber Substances 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- NCGICGYLBXGBGN-UHFFFAOYSA-N 3-morpholin-4-yl-1-oxa-3-azonia-2-azanidacyclopent-3-en-5-imine;hydrochloride Chemical compound Cl.[N-]1OC(=N)C=[N+]1N1CCOCC1 NCGICGYLBXGBGN-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 229910052681 coesite Inorganic materials 0.000 description 2
- 229910052906 cristobalite Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 229910052682 stishovite Inorganic materials 0.000 description 2
- 229910052905 tridymite Inorganic materials 0.000 description 2
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
- H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by potential barriers, e.g. phototransistors
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Light Receiving Elements (AREA)
Abstract
Description
上記構成によれば、集光されて光吸収層を透過した光は、高速化のために受光部と共に小型化された第1反射部によって、窓部の外側の第2反射部に向かって広がるように反射される。それ故、窓部から入射した光は第1反射部で反射され、第1反射部で反射された光の一部が第2反射部で反射されるので、窓部から入射した光が光吸収層を複数回透過して量子効率が向上し、受光感度の低下を軽減することができる。
上記構成によれば、第1反射部で反射された光が第2反射部で反射されたときに、この第2反射部で反射された光を元の第1反射部の反射点に一致又は接近させて第1反射部に入射させることができる。従って、光吸収層を透過した光を第2反射部で反射させて光吸収層に再入射させることができ、半導体受光素子の高速化のために光吸収層を薄くした場合の受光感度の低下を軽減することができる。
(1)x0=r2×sin(α)
(2)y0=r2×cos(α)
(3)γ=θ+α
(4)θ=sin-1(x0/(x02+(r2+h−y0)2)1/2)
(5)β=sin-1(sin(γ)/n)
(6)δ=φ+α−β
(7)φ=−tan-1(x1/(y1+t))
(8)σ=π/2+α−β+2φ
(9)m1=−1/tan(σ)
(10)m2a=−x2/y2
(11)x12+(y1+t)2=r12
(12)y1−y0=(x1−x0)×tan(π/2−α+β)
(13)x22+y22=r22
(14)y2−y1=(x2−x1)×tan(σ)
半導体受光素子1の窓部14から受光部3に入射して光吸収層6を透過した光は、第1反射部8によって反射されて光吸収層6を再度透過する。この光吸収層6を再度透過した光の一部は、第2反射部17によって反射されて受光部3に再入射する。
2 :半導体基板
2a :第1面
2b :第2面
3 :受光部
4 :集光レンズ
5 :第1半導体層
6 :光吸収層
7 :第2半導体層
7a :表面
8 :第1反射部
8a :誘電体膜
8b :金属膜
11 :電極
12 :反射防止膜
14 :窓部
15 :外側部分
16 :金属膜
17 :第2反射部
CL :中心線
Claims (3)
- 半導体基板の第1面に第1半導体層と光吸収層と第2半導体層をこの順に積層させて形成された受光部を有し、前記半導体基板の前記第1面に対向する第2面側に前記受光部の中心線と同心に形成された集光レンズを有する半導体受光素子において、
前記第2半導体層の表面に、前記光吸収層側が凹面状に形成された第1反射部を備え、
前記集光レンズは、前記中心線の近傍の窓部と、前記窓部の外側に環状に且つ前記光吸収層側が凹面状に形成された第2反射部を備え、
前記窓部から前記受光部に入射して前記光吸収層を透過した光が、前記第1反射部によって反射されて前記光吸収層を再度透過し、前記光吸収層を再度透過した光の一部が前記第2反射部によって反射されて前記受光部に再入射するように構成したことを特徴とする半導体受光素子。 - 前記第1反射部の曲率半径は、前記第1反射部で反射された光が前記光吸収層と前記集光レンズの間に集光した後広がって前記第2反射部に入射するように設定されたことを特徴とする請求項1に記載の半導体受光素子。
- 前記第1反射部で反射された光が前記第2反射部に入射する入射点において、入射する光線と前記第2反射部の法線が重なる又は接近するように前記第2反射部の曲率半径が設定されたことを特徴とする請求項1又は2に記載の半導体受光素子。
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PCT/JP2020/039130 WO2022079912A1 (ja) | 2020-10-16 | 2020-10-16 | 半導体受光素子 |
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JP6856295B1 true JP6856295B1 (ja) | 2021-04-07 |
JPWO2022079912A1 JPWO2022079912A1 (ja) | 2022-04-21 |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001320081A (ja) * | 2000-05-12 | 2001-11-16 | Fujitsu Ltd | 半導体受光素子 |
JP2011091128A (ja) * | 2009-10-21 | 2011-05-06 | Canon Inc | 固体撮像素子 |
JP2011119484A (ja) * | 2009-12-03 | 2011-06-16 | Sharp Corp | 固体撮像素子および電子情報機器 |
JP2017092179A (ja) * | 2015-11-06 | 2017-05-25 | 凸版印刷株式会社 | 固体撮像素子およびその製造方法 |
CN109461778A (zh) * | 2018-10-31 | 2019-03-12 | 中国电子科技集团公司第四十四研究所 | 一种提高背照式光电二极管响应度的结构及制作方法 |
-
2020
- 2020-10-16 JP JP2021502631A patent/JP6856295B1/ja active Active
- 2020-10-16 WO PCT/JP2020/039130 patent/WO2022079912A1/ja active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001320081A (ja) * | 2000-05-12 | 2001-11-16 | Fujitsu Ltd | 半導体受光素子 |
JP2011091128A (ja) * | 2009-10-21 | 2011-05-06 | Canon Inc | 固体撮像素子 |
JP2011119484A (ja) * | 2009-12-03 | 2011-06-16 | Sharp Corp | 固体撮像素子および電子情報機器 |
JP2017092179A (ja) * | 2015-11-06 | 2017-05-25 | 凸版印刷株式会社 | 固体撮像素子およびその製造方法 |
CN109461778A (zh) * | 2018-10-31 | 2019-03-12 | 中国电子科技集团公司第四十四研究所 | 一种提高背照式光电二极管响应度的结构及制作方法 |
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WO2022079912A1 (ja) | 2022-04-21 |
JPWO2022079912A1 (ja) | 2022-04-21 |
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