JP6844960B2 - 貫通型炉及び貫通型炉を有するダイボンダ - Google Patents
貫通型炉及び貫通型炉を有するダイボンダ Download PDFInfo
- Publication number
- JP6844960B2 JP6844960B2 JP2016126921A JP2016126921A JP6844960B2 JP 6844960 B2 JP6844960 B2 JP 6844960B2 JP 2016126921 A JP2016126921 A JP 2016126921A JP 2016126921 A JP2016126921 A JP 2016126921A JP 6844960 B2 JP6844960 B2 JP 6844960B2
- Authority
- JP
- Japan
- Prior art keywords
- furnace
- lid
- groove
- cover
- furnace body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000000149 penetrating effect Effects 0.000 title description 3
- 230000013011 mating Effects 0.000 claims description 27
- 239000000758 substrate Substances 0.000 claims description 21
- 239000007789 gas Substances 0.000 description 22
- 229910000679 solder Inorganic materials 0.000 description 13
- 230000001681 protective effect Effects 0.000 description 11
- 239000004065 semiconductor Substances 0.000 description 8
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 238000012423 maintenance Methods 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 230000035515 penetration Effects 0.000 description 5
- 238000003754 machining Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 230000006837 decompression Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
- F27B9/30—Details, accessories, or equipment peculiar to furnaces of these types
- F27B9/32—Casings
- F27B9/34—Arrangements of linings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/742—Apparatus for manufacturing bump connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
- F27B9/04—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity adapted for treating the charge in vacuum or special atmosphere
- F27B9/045—Furnaces with controlled atmosphere
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
- F27B9/14—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity characterised by the path of the charge during treatment; characterised by the means by which the charge is moved during treatment
- F27B9/20—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity characterised by the path of the charge during treatment; characterised by the means by which the charge is moved during treatment the charge moving in a substantially straight path tunnel furnace
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
- F27B9/30—Details, accessories, or equipment peculiar to furnaces of these types
- F27B9/3077—Arrangements for treating electronic components, e.g. semiconductors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
- F27B9/30—Details, accessories, or equipment peculiar to furnaces of these types
- F27B9/32—Casings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D1/00—Casings; Linings; Walls; Roofs
- F27D1/04—Casings; Linings; Walls; Roofs characterised by the form, e.g. shape of the bricks or blocks used
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D1/00—Casings; Linings; Walls; Roofs
- F27D1/18—Door frames; Doors, lids, removable covers
- F27D1/1808—Removable covers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D3/00—Charging; Discharging; Manipulation of charge
- F27D3/0084—Charging; Manipulation of SC or SC wafers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D5/00—Supports, screens, or the like for the charge within the furnace
- F27D5/0037—Supports specially adapted for semi-conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
- Furnace Details (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Resistance Heating (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH00980/15A CH711296B1 (de) | 2015-07-07 | 2015-07-07 | Durchlaufofen und Die-Bonder mit einem Durchlaufofen. |
CH00980/15 | 2015-07-07 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2017022370A JP2017022370A (ja) | 2017-01-26 |
JP2017022370A5 JP2017022370A5 (ko) | 2019-07-04 |
JP6844960B2 true JP6844960B2 (ja) | 2021-03-17 |
Family
ID=57583590
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016126921A Active JP6844960B2 (ja) | 2015-07-07 | 2016-06-27 | 貫通型炉及び貫通型炉を有するダイボンダ |
Country Status (9)
Country | Link |
---|---|
JP (1) | JP6844960B2 (ko) |
KR (1) | KR102505372B1 (ko) |
CN (1) | CN106340472B (ko) |
CH (1) | CH711296B1 (ko) |
DE (1) | DE102016112070B4 (ko) |
IT (1) | ITUA20164590A1 (ko) |
MX (1) | MX2016008822A (ko) |
MY (1) | MY192150A (ko) |
SG (1) | SG10201604156RA (ko) |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA1194693A (en) * | 1983-04-05 | 1985-10-08 | John A. Owen | Vacuum seal for continuous heat treating furnaces |
DE3632936A1 (de) * | 1986-09-27 | 1988-03-31 | Haessler Andreas | Druckkompensierte ofendichtung |
DE4220802A1 (de) * | 1992-06-25 | 1994-01-05 | Bosch Gmbh Robert | Vorrichtung zum Auflöten von Bauelementen auf Platinen |
US5266027A (en) * | 1992-08-12 | 1993-11-30 | Ngk Insulators, Ltd. | Roller-hearth continuous furnace |
JP3644880B2 (ja) | 2000-06-20 | 2005-05-11 | 東京エレクトロン株式会社 | 縦型熱処理装置 |
JP4319646B2 (ja) * | 2005-06-30 | 2009-08-26 | 株式会社タムラ古河マシナリー | リフロー炉 |
WO2009114189A2 (en) * | 2008-03-14 | 2009-09-17 | Dow Corning Corporation | Method of forming a photovoltaic cell module |
DE102009053532B4 (de) * | 2009-11-18 | 2017-01-05 | Centrotherm Photovoltaics Ag | Verfahren und Vorrichtung zur Herstellung einer Verbindungshalbleiterschicht |
JP2013093370A (ja) * | 2011-10-24 | 2013-05-16 | Hitachi High-Tech Instruments Co Ltd | ダイボンダ装置、及びダイボンド方法 |
CH708881B1 (de) * | 2013-11-20 | 2017-06-15 | Besi Switzerland Ag | Durchlaufofen für Substrate, die mit Bauteilen bestückt werden, und Die Bonder. |
DE102014008877A1 (de) * | 2014-06-16 | 2015-12-17 | Janusz Chowaniec | Tunnelofen mit der Grundrahmenkonstruktion eines ISO Containers |
-
2015
- 2015-07-07 CH CH00980/15A patent/CH711296B1/de not_active IP Right Cessation
-
2016
- 2016-05-24 SG SG10201604156RA patent/SG10201604156RA/en unknown
- 2016-06-22 IT ITUA2016A004590A patent/ITUA20164590A1/it unknown
- 2016-06-27 JP JP2016126921A patent/JP6844960B2/ja active Active
- 2016-06-27 MY MYPI2016702368A patent/MY192150A/en unknown
- 2016-06-28 CN CN201610522176.2A patent/CN106340472B/zh active Active
- 2016-07-01 KR KR1020160083625A patent/KR102505372B1/ko active IP Right Grant
- 2016-07-01 DE DE102016112070.7A patent/DE102016112070B4/de active Active
- 2016-07-04 MX MX2016008822A patent/MX2016008822A/es unknown
Also Published As
Publication number | Publication date |
---|---|
DE102016112070B4 (de) | 2020-10-29 |
DE102016112070A1 (de) | 2017-01-12 |
KR102505372B1 (ko) | 2023-03-02 |
CH711296B1 (de) | 2019-03-15 |
KR20170006265A (ko) | 2017-01-17 |
SG10201604156RA (en) | 2017-02-27 |
ITUA20164590A1 (it) | 2017-12-22 |
CH711296A1 (de) | 2017-01-13 |
CN106340472B (zh) | 2021-05-07 |
JP2017022370A (ja) | 2017-01-26 |
CN106340472A (zh) | 2017-01-18 |
MY192150A (en) | 2022-08-02 |
MX2016008822A (es) | 2017-04-25 |
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