CN106340472B - 直通型炉及具有直通型炉的管芯粘结机 - Google Patents

直通型炉及具有直通型炉的管芯粘结机 Download PDF

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Publication number
CN106340472B
CN106340472B CN201610522176.2A CN201610522176A CN106340472B CN 106340472 B CN106340472 B CN 106340472B CN 201610522176 A CN201610522176 A CN 201610522176A CN 106340472 B CN106340472 B CN 106340472B
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China
Prior art keywords
furnace
cover
grooves
flow
mating surfaces
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CN201610522176.2A
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English (en)
Chinese (zh)
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CN106340472A (zh
Inventor
丹尼尔·安德烈亚斯·谢勒
吉多·祖特尔
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Besi Switzerland AG
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Besi Switzerland AG
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
    • F27B9/30—Details, accessories, or equipment peculiar to furnaces of these types
    • F27B9/32—Casings
    • F27B9/34—Arrangements of linings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/742—Apparatus for manufacturing bump connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
    • F27B9/04—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity adapted for treating the charge in vacuum or special atmosphere
    • F27B9/045—Furnaces with controlled atmosphere
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
    • F27B9/14—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity characterised by the path of the charge during treatment; characterised by the means by which the charge is moved during treatment
    • F27B9/20—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity characterised by the path of the charge during treatment; characterised by the means by which the charge is moved during treatment the charge moving in a substantially straight path tunnel furnace
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
    • F27B9/30—Details, accessories, or equipment peculiar to furnaces of these types
    • F27B9/3077—Arrangements for treating electronic components, e.g. semiconductors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
    • F27B9/30—Details, accessories, or equipment peculiar to furnaces of these types
    • F27B9/32—Casings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D1/00—Casings; Linings; Walls; Roofs
    • F27D1/04—Casings; Linings; Walls; Roofs characterised by the form, e.g. shape of the bricks or blocks used
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D1/00—Casings; Linings; Walls; Roofs
    • F27D1/18—Door frames; Doors, lids, removable covers
    • F27D1/1808—Removable covers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D3/00—Charging; Discharging; Manipulation of charge
    • F27D3/0084—Charging; Manipulation of SC or SC wafers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D5/00—Supports, screens, or the like for the charge within the furnace
    • F27D5/0037—Supports specially adapted for semi-conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Furnace Details (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Resistance Heating (AREA)
CN201610522176.2A 2015-07-07 2016-06-28 直通型炉及具有直通型炉的管芯粘结机 Active CN106340472B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH00980/15A CH711296B1 (de) 2015-07-07 2015-07-07 Durchlaufofen und Die-Bonder mit einem Durchlaufofen.
CH00980/15 2015-07-07

Publications (2)

Publication Number Publication Date
CN106340472A CN106340472A (zh) 2017-01-18
CN106340472B true CN106340472B (zh) 2021-05-07

Family

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CN201610522176.2A Active CN106340472B (zh) 2015-07-07 2016-06-28 直通型炉及具有直通型炉的管芯粘结机

Country Status (9)

Country Link
JP (1) JP6844960B2 (ko)
KR (1) KR102505372B1 (ko)
CN (1) CN106340472B (ko)
CH (1) CH711296B1 (ko)
DE (1) DE102016112070B4 (ko)
IT (1) ITUA20164590A1 (ko)
MX (1) MX2016008822A (ko)
MY (1) MY192150A (ko)
SG (1) SG10201604156RA (ko)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5266027A (en) * 1992-08-12 1993-11-30 Ngk Insulators, Ltd. Roller-hearth continuous furnace
CN1893773A (zh) * 2005-06-30 2007-01-10 古河电气工业株式会社 回流炉
CN103065987A (zh) * 2011-10-24 2013-04-24 株式会社日立高新技术仪器 芯片接合装置及芯片接合方法
CN104658928A (zh) * 2013-11-20 2015-05-27 贝思瑞士股份公司 用于基板的贯通式炉和裸片结合器

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1194693A (en) * 1983-04-05 1985-10-08 John A. Owen Vacuum seal for continuous heat treating furnaces
DE3632936A1 (de) * 1986-09-27 1988-03-31 Haessler Andreas Druckkompensierte ofendichtung
DE4220802A1 (de) * 1992-06-25 1994-01-05 Bosch Gmbh Robert Vorrichtung zum Auflöten von Bauelementen auf Platinen
JP3644880B2 (ja) 2000-06-20 2005-05-11 東京エレクトロン株式会社 縦型熱処理装置
WO2009114189A2 (en) * 2008-03-14 2009-09-17 Dow Corning Corporation Method of forming a photovoltaic cell module
DE102009053532B4 (de) * 2009-11-18 2017-01-05 Centrotherm Photovoltaics Ag Verfahren und Vorrichtung zur Herstellung einer Verbindungshalbleiterschicht
DE102014008877A1 (de) * 2014-06-16 2015-12-17 Janusz Chowaniec Tunnelofen mit der Grundrahmenkonstruktion eines ISO Containers

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5266027A (en) * 1992-08-12 1993-11-30 Ngk Insulators, Ltd. Roller-hearth continuous furnace
CN1893773A (zh) * 2005-06-30 2007-01-10 古河电气工业株式会社 回流炉
CN103065987A (zh) * 2011-10-24 2013-04-24 株式会社日立高新技术仪器 芯片接合装置及芯片接合方法
CN104658928A (zh) * 2013-11-20 2015-05-27 贝思瑞士股份公司 用于基板的贯通式炉和裸片结合器

Also Published As

Publication number Publication date
DE102016112070B4 (de) 2020-10-29
DE102016112070A1 (de) 2017-01-12
KR102505372B1 (ko) 2023-03-02
CH711296B1 (de) 2019-03-15
KR20170006265A (ko) 2017-01-17
SG10201604156RA (en) 2017-02-27
JP6844960B2 (ja) 2021-03-17
ITUA20164590A1 (it) 2017-12-22
CH711296A1 (de) 2017-01-13
JP2017022370A (ja) 2017-01-26
CN106340472A (zh) 2017-01-18
MY192150A (en) 2022-08-02
MX2016008822A (es) 2017-04-25

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