CH711296B1 - Durchlaufofen und Die-Bonder mit einem Durchlaufofen. - Google Patents

Durchlaufofen und Die-Bonder mit einem Durchlaufofen. Download PDF

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Publication number
CH711296B1
CH711296B1 CH00980/15A CH9802015A CH711296B1 CH 711296 B1 CH711296 B1 CH 711296B1 CH 00980/15 A CH00980/15 A CH 00980/15A CH 9802015 A CH9802015 A CH 9802015A CH 711296 B1 CH711296 B1 CH 711296B1
Authority
CH
Switzerland
Prior art keywords
furnace
continuous furnace
groove
cover
joining surfaces
Prior art date
Application number
CH00980/15A
Other languages
German (de)
English (en)
Other versions
CH711296A1 (de
Inventor
Suter Guido
Andreas Scherer Daniel
Original Assignee
Besi Switzerland Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Besi Switzerland Ag filed Critical Besi Switzerland Ag
Priority to CH00980/15A priority Critical patent/CH711296B1/de
Priority to SG10201604156RA priority patent/SG10201604156RA/en
Priority to ITUA2016A004590A priority patent/ITUA20164590A1/it
Priority to JP2016126921A priority patent/JP6844960B2/ja
Priority to MYPI2016702368A priority patent/MY192150A/en
Priority to CN201610522176.2A priority patent/CN106340472B/zh
Priority to KR1020160083625A priority patent/KR102505372B1/ko
Priority to DE102016112070.7A priority patent/DE102016112070B4/de
Priority to MX2016008822A priority patent/MX2016008822A/es
Publication of CH711296A1 publication Critical patent/CH711296A1/de
Publication of CH711296B1 publication Critical patent/CH711296B1/de

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
    • F27B9/04—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity adapted for treating the charge in vacuum or special atmosphere
    • F27B9/045—Furnaces with controlled atmosphere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
    • F27B9/30—Details, accessories, or equipment peculiar to furnaces of these types
    • F27B9/32—Casings
    • F27B9/34—Arrangements of linings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/742—Apparatus for manufacturing bump connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
    • F27B9/14—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity characterised by the path of the charge during treatment; characterised by the means by which the charge is moved during treatment
    • F27B9/20—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity characterised by the path of the charge during treatment; characterised by the means by which the charge is moved during treatment the charge moving in a substantially straight path tunnel furnace
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
    • F27B9/30—Details, accessories, or equipment peculiar to furnaces of these types
    • F27B9/3077—Arrangements for treating electronic components, e.g. semiconductors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
    • F27B9/30—Details, accessories, or equipment peculiar to furnaces of these types
    • F27B9/32—Casings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D1/00—Casings; Linings; Walls; Roofs
    • F27D1/04—Casings; Linings; Walls; Roofs characterised by the form, e.g. shape of the bricks or blocks used
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D1/00—Casings; Linings; Walls; Roofs
    • F27D1/18—Door frames; Doors, lids, removable covers
    • F27D1/1808—Removable covers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D3/00—Charging; Discharging; Manipulation of charge
    • F27D3/0084—Charging; Manipulation of SC or SC wafers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D5/00—Supports, screens, or the like for the charge within the furnace
    • F27D5/0037—Supports specially adapted for semi-conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Furnace Details (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Resistance Heating (AREA)
CH00980/15A 2015-07-07 2015-07-07 Durchlaufofen und Die-Bonder mit einem Durchlaufofen. CH711296B1 (de)

Priority Applications (9)

Application Number Priority Date Filing Date Title
CH00980/15A CH711296B1 (de) 2015-07-07 2015-07-07 Durchlaufofen und Die-Bonder mit einem Durchlaufofen.
SG10201604156RA SG10201604156RA (en) 2015-07-07 2016-05-24 Through-type furnace and Die Bonder with a through-type furnace
ITUA2016A004590A ITUA20164590A1 (it) 2015-07-07 2016-06-22 Forno a passaggio continuo e die bonder con un forno a passaggio continuo
JP2016126921A JP6844960B2 (ja) 2015-07-07 2016-06-27 貫通型炉及び貫通型炉を有するダイボンダ
MYPI2016702368A MY192150A (en) 2015-07-07 2016-06-27 Through-type furnace and die bonder with a through-type furnace
CN201610522176.2A CN106340472B (zh) 2015-07-07 2016-06-28 直通型炉及具有直通型炉的管芯粘结机
KR1020160083625A KR102505372B1 (ko) 2015-07-07 2016-07-01 관통형 노 및 관통형 노가 구비된 다이 본더
DE102016112070.7A DE102016112070B4 (de) 2015-07-07 2016-07-01 Durchlaufofen und Die Bonder mit einem Durchlaufofen
MX2016008822A MX2016008822A (es) 2015-07-07 2016-07-04 Horno de tipo continuo y un dispositivo de union de matriz con un horno de tipo continuo.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH00980/15A CH711296B1 (de) 2015-07-07 2015-07-07 Durchlaufofen und Die-Bonder mit einem Durchlaufofen.

Publications (2)

Publication Number Publication Date
CH711296A1 CH711296A1 (de) 2017-01-13
CH711296B1 true CH711296B1 (de) 2019-03-15

Family

ID=57583590

Family Applications (1)

Application Number Title Priority Date Filing Date
CH00980/15A CH711296B1 (de) 2015-07-07 2015-07-07 Durchlaufofen und Die-Bonder mit einem Durchlaufofen.

Country Status (9)

Country Link
JP (1) JP6844960B2 (ko)
KR (1) KR102505372B1 (ko)
CN (1) CN106340472B (ko)
CH (1) CH711296B1 (ko)
DE (1) DE102016112070B4 (ko)
IT (1) ITUA20164590A1 (ko)
MX (1) MX2016008822A (ko)
MY (1) MY192150A (ko)
SG (1) SG10201604156RA (ko)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1194693A (en) * 1983-04-05 1985-10-08 John A. Owen Vacuum seal for continuous heat treating furnaces
DE3632936A1 (de) * 1986-09-27 1988-03-31 Haessler Andreas Druckkompensierte ofendichtung
DE4220802A1 (de) * 1992-06-25 1994-01-05 Bosch Gmbh Robert Vorrichtung zum Auflöten von Bauelementen auf Platinen
US5266027A (en) * 1992-08-12 1993-11-30 Ngk Insulators, Ltd. Roller-hearth continuous furnace
JP3644880B2 (ja) * 2000-06-20 2005-05-11 東京エレクトロン株式会社 縦型熱処理装置
JP4319646B2 (ja) * 2005-06-30 2009-08-26 株式会社タムラ古河マシナリー リフロー炉
WO2009114189A2 (en) * 2008-03-14 2009-09-17 Dow Corning Corporation Method of forming a photovoltaic cell module
DE102009053532B4 (de) * 2009-11-18 2017-01-05 Centrotherm Photovoltaics Ag Verfahren und Vorrichtung zur Herstellung einer Verbindungshalbleiterschicht
JP2013093370A (ja) * 2011-10-24 2013-05-16 Hitachi High-Tech Instruments Co Ltd ダイボンダ装置、及びダイボンド方法
CH708881B1 (de) * 2013-11-20 2017-06-15 Besi Switzerland Ag Durchlaufofen für Substrate, die mit Bauteilen bestückt werden, und Die Bonder.
DE102014008877A1 (de) * 2014-06-16 2015-12-17 Janusz Chowaniec Tunnelofen mit der Grundrahmenkonstruktion eines ISO Containers

Also Published As

Publication number Publication date
CH711296A1 (de) 2017-01-13
ITUA20164590A1 (it) 2017-12-22
JP2017022370A (ja) 2017-01-26
MY192150A (en) 2022-08-02
KR20170006265A (ko) 2017-01-17
DE102016112070A1 (de) 2017-01-12
CN106340472A (zh) 2017-01-18
KR102505372B1 (ko) 2023-03-02
DE102016112070B4 (de) 2020-10-29
MX2016008822A (es) 2017-04-25
CN106340472B (zh) 2021-05-07
JP6844960B2 (ja) 2021-03-17
SG10201604156RA (en) 2017-02-27

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Legal Events

Date Code Title Description
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Representative=s name: IP.DESIGN KANZLEI AND PATENTBUERO DR. MARC-TIM, CH

PL Patent ceased