MY192150A - Through-type furnace and die bonder with a through-type furnace - Google Patents

Through-type furnace and die bonder with a through-type furnace

Info

Publication number
MY192150A
MY192150A MYPI2016702368A MYPI2016702368A MY192150A MY 192150 A MY192150 A MY 192150A MY PI2016702368 A MYPI2016702368 A MY PI2016702368A MY PI2016702368 A MYPI2016702368 A MY PI2016702368A MY 192150 A MY192150 A MY 192150A
Authority
MY
Malaysia
Prior art keywords
type furnace
die bonder
furnace
supplied
groove
Prior art date
Application number
MYPI2016702368A
Inventor
Guido Suter
Daniel Andreas Scherer
Original Assignee
Besi Switzerland Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Besi Switzerland Ag filed Critical Besi Switzerland Ag
Publication of MY192150A publication Critical patent/MY192150A/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
    • F27B9/04—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity adapted for treating the charge in vacuum or special atmosphere
    • F27B9/045—Furnaces with controlled atmosphere
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
    • F27B9/30—Details, accessories, or equipment peculiar to furnaces of these types
    • F27B9/32—Casings
    • F27B9/34—Arrangements of linings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/742—Apparatus for manufacturing bump connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
    • F27B9/14—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity characterised by the path of the charge during treatment; characterised by the means by which the charge is moved during treatment
    • F27B9/20—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity characterised by the path of the charge during treatment; characterised by the means by which the charge is moved during treatment the charge moving in a substantially straight path tunnel furnace
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
    • F27B9/30—Details, accessories, or equipment peculiar to furnaces of these types
    • F27B9/3077—Arrangements for treating electronic components, e.g. semiconductors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
    • F27B9/30—Details, accessories, or equipment peculiar to furnaces of these types
    • F27B9/32—Casings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D1/00—Casings; Linings; Walls; Roofs
    • F27D1/04—Casings; Linings; Walls; Roofs characterised by the form, e.g. shape of the bricks or blocks used
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D1/00—Casings; Linings; Walls; Roofs
    • F27D1/18—Door frames; Doors, lids, removable covers
    • F27D1/1808—Removable covers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D3/00—Charging; Discharging; Manipulation of charge
    • F27D3/0084—Charging; Manipulation of SC or SC wafers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D5/00—Supports, screens, or the like for the charge within the furnace
    • F27D5/0037—Supports specially adapted for semi-conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Furnace Details (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Resistance Heating (AREA)

Abstract

The invention relates to a through-type furnace, which comprises a furniture body (2) and a cover (6), which surround a channel through which substrates can be conveyed and to which a working gas can be supplied. The cover (6) comprises at least one process opening. Interfaces between the individual parts of the through-type furnace, which are detachably connected to each other, are formed with mutually opposite mating surfaces (11, 12). At least some of the interfaces comprise a groove (15) which can be supplied with vacuum in operation. Air that enters the unavoidable gap between the mating surfaces (11, 12) is extracted by suction via the groove (15) and does not reach the interior space of the furnace. The invention further relates to a die bonder with such a through-type furnace.
MYPI2016702368A 2015-07-07 2016-06-27 Through-type furnace and die bonder with a through-type furnace MY192150A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH00980/15A CH711296B1 (en) 2015-07-07 2015-07-07 Continuous furnace and die bonder with a continuous furnace.

Publications (1)

Publication Number Publication Date
MY192150A true MY192150A (en) 2022-08-02

Family

ID=57583590

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2016702368A MY192150A (en) 2015-07-07 2016-06-27 Through-type furnace and die bonder with a through-type furnace

Country Status (9)

Country Link
JP (1) JP6844960B2 (en)
KR (1) KR102505372B1 (en)
CN (1) CN106340472B (en)
CH (1) CH711296B1 (en)
DE (1) DE102016112070B4 (en)
IT (1) ITUA20164590A1 (en)
MX (1) MX2016008822A (en)
MY (1) MY192150A (en)
SG (1) SG10201604156RA (en)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1194693A (en) * 1983-04-05 1985-10-08 John A. Owen Vacuum seal for continuous heat treating furnaces
DE3632936A1 (en) * 1986-09-27 1988-03-31 Haessler Andreas Pressure-compensated furnace seal
DE4220802A1 (en) * 1992-06-25 1994-01-05 Bosch Gmbh Robert Device for soldering components on circuit boards
US5266027A (en) * 1992-08-12 1993-11-30 Ngk Insulators, Ltd. Roller-hearth continuous furnace
JP3644880B2 (en) 2000-06-20 2005-05-11 東京エレクトロン株式会社 Vertical heat treatment equipment
JP4319646B2 (en) * 2005-06-30 2009-08-26 株式会社タムラ古河マシナリー Reflow furnace
WO2009114189A2 (en) * 2008-03-14 2009-09-17 Dow Corning Corporation Method of forming a photovoltaic cell module
DE102009053532B4 (en) * 2009-11-18 2017-01-05 Centrotherm Photovoltaics Ag Method and apparatus for producing a compound semiconductor layer
JP2013093370A (en) * 2011-10-24 2013-05-16 Hitachi High-Tech Instruments Co Ltd Die bonder device and die bonding method
CH708881B1 (en) * 2013-11-20 2017-06-15 Besi Switzerland Ag Continuous furnace for substrates, which are equipped with components, and Die Bonder.
DE102014008877A1 (en) * 2014-06-16 2015-12-17 Janusz Chowaniec Tunnel kiln with the basic frame construction of an ISO container

Also Published As

Publication number Publication date
DE102016112070B4 (en) 2020-10-29
DE102016112070A1 (en) 2017-01-12
KR102505372B1 (en) 2023-03-02
CH711296B1 (en) 2019-03-15
KR20170006265A (en) 2017-01-17
SG10201604156RA (en) 2017-02-27
JP6844960B2 (en) 2021-03-17
ITUA20164590A1 (en) 2017-12-22
CH711296A1 (en) 2017-01-13
CN106340472B (en) 2021-05-07
JP2017022370A (en) 2017-01-26
CN106340472A (en) 2017-01-18
MX2016008822A (en) 2017-04-25

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