JP6843312B1 - 回路基板及び電子機器 - Google Patents

回路基板及び電子機器 Download PDF

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Publication number
JP6843312B1
JP6843312B1 JP2020557354A JP2020557354A JP6843312B1 JP 6843312 B1 JP6843312 B1 JP 6843312B1 JP 2020557354 A JP2020557354 A JP 2020557354A JP 2020557354 A JP2020557354 A JP 2020557354A JP 6843312 B1 JP6843312 B1 JP 6843312B1
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JP
Japan
Prior art keywords
ground pattern
ground
pattern
circuit board
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2020557354A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2021192073A1 (https=
Inventor
辰也 山中
辰也 山中
佑介 山梶
佑介 山梶
雄大 米岡
雄大 米岡
顕次 和田
顕次 和田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Application granted granted Critical
Publication of JP6843312B1 publication Critical patent/JP6843312B1/ja
Publication of JPWO2021192073A1 publication Critical patent/JPWO2021192073A1/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H05K1/0227—Split or nearly split shielding or ground planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0999—Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
JP2020557354A 2020-03-25 2020-03-25 回路基板及び電子機器 Active JP6843312B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/013204 WO2021192073A1 (ja) 2020-03-25 2020-03-25 回路基板及び電子機器

Publications (2)

Publication Number Publication Date
JP6843312B1 true JP6843312B1 (ja) 2021-03-17
JPWO2021192073A1 JPWO2021192073A1 (https=) 2021-09-30

Family

ID=74860856

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020557354A Active JP6843312B1 (ja) 2020-03-25 2020-03-25 回路基板及び電子機器

Country Status (4)

Country Link
JP (1) JP6843312B1 (https=)
CN (1) CN115299184B (https=)
DE (1) DE112020006584B4 (https=)
WO (1) WO2021192073A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2022190306A1 (https=) * 2021-03-11 2022-09-15
JPWO2022215176A1 (https=) * 2021-04-06 2022-10-13

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0384627U (https=) * 1989-12-20 1991-08-28
JP2003008153A (ja) * 2001-06-19 2003-01-10 Taiyo Yuden Co Ltd 電子回路装置及びローパスフィルタ
JP2016219553A (ja) * 2015-05-18 2016-12-22 三菱電機株式会社 回路基板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006261455A (ja) * 2005-03-17 2006-09-28 Fujitsu Ltd 半導体装置およびｍｉｍキャパシタ
JP5063529B2 (ja) * 2008-08-22 2012-10-31 キヤノン株式会社 プリント回路板
US8824570B2 (en) * 2010-04-06 2014-09-02 Broadcom Corporation Communications interface to differential-pair cabling
KR101999509B1 (ko) * 2017-03-24 2019-07-11 미쓰비시덴키 가부시키가이샤 회로 기판
CN110710336A (zh) * 2017-06-09 2020-01-17 三菱电机株式会社 印刷基板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0384627U (https=) * 1989-12-20 1991-08-28
JP2003008153A (ja) * 2001-06-19 2003-01-10 Taiyo Yuden Co Ltd 電子回路装置及びローパスフィルタ
JP2016219553A (ja) * 2015-05-18 2016-12-22 三菱電機株式会社 回路基板

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2022190306A1 (https=) * 2021-03-11 2022-09-15
JP7301250B2 (ja) 2021-03-11 2023-06-30 三菱電機株式会社 サージ保護回路及びサージ保護方法
JPWO2022215176A1 (https=) * 2021-04-06 2022-10-13
CN117063618A (zh) * 2021-04-06 2023-11-14 三菱电机株式会社 印刷电路基板
JP7395057B2 (ja) 2021-04-06 2023-12-08 三菱電機株式会社 プリント回路基板
CN117063618B (zh) * 2021-04-06 2024-05-17 三菱电机株式会社 印刷电路基板
US12057414B2 (en) 2021-04-06 2024-08-06 Mitsubishi Electric Corporation Printed circuit board
DE112021007463B4 (de) 2021-04-06 2025-02-13 Mitsubishi Electric Corporation Leiterplatte

Also Published As

Publication number Publication date
DE112020006584B4 (de) 2024-01-04
JPWO2021192073A1 (https=) 2021-09-30
CN115299184B (zh) 2023-07-14
DE112020006584T5 (de) 2022-11-10
WO2021192073A1 (ja) 2021-09-30
CN115299184A (zh) 2022-11-04

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