DE112020006584B4 - Platine und elektronisches Gerät - Google Patents

Platine und elektronisches Gerät Download PDF

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Publication number
DE112020006584B4
DE112020006584B4 DE112020006584.7T DE112020006584T DE112020006584B4 DE 112020006584 B4 DE112020006584 B4 DE 112020006584B4 DE 112020006584 T DE112020006584 T DE 112020006584T DE 112020006584 B4 DE112020006584 B4 DE 112020006584B4
Authority
DE
Germany
Prior art keywords
ground
electronic device
grounding structure
grounding
electromagnetic noise
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE112020006584.7T
Other languages
German (de)
English (en)
Other versions
DE112020006584T5 (de
Inventor
Tatsuya Yamanaka
Yusuke Yamakaji
Yudai YONEOKA
Kenji Wada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of DE112020006584T5 publication Critical patent/DE112020006584T5/de
Application granted granted Critical
Publication of DE112020006584B4 publication Critical patent/DE112020006584B4/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H05K1/0227—Split or nearly split shielding or ground planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0999—Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
DE112020006584.7T 2020-03-25 2020-03-25 Platine und elektronisches Gerät Active DE112020006584B4 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/013204 WO2021192073A1 (ja) 2020-03-25 2020-03-25 回路基板及び電子機器

Publications (2)

Publication Number Publication Date
DE112020006584T5 DE112020006584T5 (de) 2022-11-10
DE112020006584B4 true DE112020006584B4 (de) 2024-01-04

Family

ID=74860856

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112020006584.7T Active DE112020006584B4 (de) 2020-03-25 2020-03-25 Platine und elektronisches Gerät

Country Status (4)

Country Link
JP (1) JP6843312B1 (https=)
CN (1) CN115299184B (https=)
DE (1) DE112020006584B4 (https=)
WO (1) WO2021192073A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112021006782B4 (de) * 2021-03-11 2024-12-19 Mitsubishi Electric Corporation Überspannungsschutzschaltung und überspannungsschutzverfahren
WO2022215176A1 (ja) * 2021-04-06 2022-10-13 三菱電機株式会社 プリント回路基板

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010050298A (ja) * 2008-08-22 2010-03-04 Canon Inc プリント回路板
US20110243254A1 (en) * 2010-04-06 2011-10-06 Broadcom Corporation Communications interface to differential-pair cabling
DE112018002903T5 (de) * 2017-06-09 2020-02-20 Mitsubishi Electric Corporation Gedruckte schaltung

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0384627U (https=) * 1989-12-20 1991-08-28
JP4028970B2 (ja) * 2001-06-19 2008-01-09 太陽誘電株式会社 電子回路装置及びローパスフィルタ
JP2006261455A (ja) * 2005-03-17 2006-09-28 Fujitsu Ltd 半導体装置およびｍｉｍキャパシタ
JP6422395B2 (ja) * 2015-05-18 2018-11-14 三菱電機株式会社 回路基板
KR101999509B1 (ko) * 2017-03-24 2019-07-11 미쓰비시덴키 가부시키가이샤 회로 기판

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010050298A (ja) * 2008-08-22 2010-03-04 Canon Inc プリント回路板
US20110243254A1 (en) * 2010-04-06 2011-10-06 Broadcom Corporation Communications interface to differential-pair cabling
DE112018002903T5 (de) * 2017-06-09 2020-02-20 Mitsubishi Electric Corporation Gedruckte schaltung

Also Published As

Publication number Publication date
JPWO2021192073A1 (https=) 2021-09-30
JP6843312B1 (ja) 2021-03-17
CN115299184B (zh) 2023-07-14
DE112020006584T5 (de) 2022-11-10
WO2021192073A1 (ja) 2021-09-30
CN115299184A (zh) 2022-11-04

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R020 Patent grant now final