JPWO2021192073A1 - - Google Patents

Info

Publication number
JPWO2021192073A1
JPWO2021192073A1 JP2020557354A JP2020557354A JPWO2021192073A1 JP WO2021192073 A1 JPWO2021192073 A1 JP WO2021192073A1 JP 2020557354 A JP2020557354 A JP 2020557354A JP 2020557354 A JP2020557354 A JP 2020557354A JP WO2021192073 A1 JPWO2021192073 A1 JP WO2021192073A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2020557354A
Other languages
Japanese (ja)
Other versions
JP6843312B1 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Application granted granted Critical
Publication of JP6843312B1 publication Critical patent/JP6843312B1/ja
Publication of JPWO2021192073A1 publication Critical patent/JPWO2021192073A1/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0215Grounding of printed circuits by connection to external grounding means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224Patterned shielding planes, ground planes or power planes
    • H05K1/0227Split or nearly split shielding or ground planes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/165Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed inductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0999Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
JP2020557354A 2020-03-25 2020-03-25 回路基板及び電子機器 Active JP6843312B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/013204 WO2021192073A1 (ja) 2020-03-25 2020-03-25 回路基板及び電子機器

Publications (2)

Publication Number Publication Date
JP6843312B1 JP6843312B1 (ja) 2021-03-17
JPWO2021192073A1 true JPWO2021192073A1 (https=) 2021-09-30

Family

ID=74860856

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020557354A Active JP6843312B1 (ja) 2020-03-25 2020-03-25 回路基板及び電子機器

Country Status (4)

Country Link
JP (1) JP6843312B1 (https=)
CN (1) CN115299184B (https=)
DE (1) DE112020006584B4 (https=)
WO (1) WO2021192073A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116897484A (zh) * 2021-03-11 2023-10-17 三菱电机株式会社 浪涌保护电路和浪涌保护方法
DE112021007463B4 (de) 2021-04-06 2025-02-13 Mitsubishi Electric Corporation Leiterplatte

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0384627U (https=) * 1989-12-20 1991-08-28
JP4028970B2 (ja) * 2001-06-19 2008-01-09 太陽誘電株式会社 電子回路装置及びローパスフィルタ
JP2006261455A (ja) * 2005-03-17 2006-09-28 Fujitsu Ltd 半導体装置およびmimキャパシタ
JP5063529B2 (ja) 2008-08-22 2012-10-31 キヤノン株式会社 プリント回路板
US8824570B2 (en) * 2010-04-06 2014-09-02 Broadcom Corporation Communications interface to differential-pair cabling
JP6422395B2 (ja) * 2015-05-18 2018-11-14 三菱電機株式会社 回路基板
CN109565927A (zh) * 2017-03-24 2019-04-02 三菱电机株式会社 电路基板
KR102350154B1 (ko) * 2017-06-09 2022-01-11 미쓰비시덴키 가부시키가이샤 프린트 기판

Also Published As

Publication number Publication date
WO2021192073A1 (ja) 2021-09-30
CN115299184B (zh) 2023-07-14
CN115299184A (zh) 2022-11-04
DE112020006584B4 (de) 2024-01-04
DE112020006584T5 (de) 2022-11-10
JP6843312B1 (ja) 2021-03-17

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