JPWO2021192073A1 - - Google Patents
Info
- Publication number
- JPWO2021192073A1 JPWO2021192073A1 JP2020557354A JP2020557354A JPWO2021192073A1 JP WO2021192073 A1 JPWO2021192073 A1 JP WO2021192073A1 JP 2020557354 A JP2020557354 A JP 2020557354A JP 2020557354 A JP2020557354 A JP 2020557354A JP WO2021192073 A1 JPWO2021192073 A1 JP WO2021192073A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0215—Grounding of printed circuits by connection to external grounding means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
- H05K1/0227—Split or nearly split shielding or ground planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/0999—Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2020/013204 WO2021192073A1 (ja) | 2020-03-25 | 2020-03-25 | 回路基板及び電子機器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP6843312B1 JP6843312B1 (ja) | 2021-03-17 |
| JPWO2021192073A1 true JPWO2021192073A1 (https=) | 2021-09-30 |
Family
ID=74860856
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020557354A Active JP6843312B1 (ja) | 2020-03-25 | 2020-03-25 | 回路基板及び電子機器 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6843312B1 (https=) |
| CN (1) | CN115299184B (https=) |
| DE (1) | DE112020006584B4 (https=) |
| WO (1) | WO2021192073A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116897484A (zh) * | 2021-03-11 | 2023-10-17 | 三菱电机株式会社 | 浪涌保护电路和浪涌保护方法 |
| DE112021007463B4 (de) | 2021-04-06 | 2025-02-13 | Mitsubishi Electric Corporation | Leiterplatte |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0384627U (https=) * | 1989-12-20 | 1991-08-28 | ||
| JP4028970B2 (ja) * | 2001-06-19 | 2008-01-09 | 太陽誘電株式会社 | 電子回路装置及びローパスフィルタ |
| JP2006261455A (ja) * | 2005-03-17 | 2006-09-28 | Fujitsu Ltd | 半導体装置およびmimキャパシタ |
| JP5063529B2 (ja) | 2008-08-22 | 2012-10-31 | キヤノン株式会社 | プリント回路板 |
| US8824570B2 (en) * | 2010-04-06 | 2014-09-02 | Broadcom Corporation | Communications interface to differential-pair cabling |
| JP6422395B2 (ja) * | 2015-05-18 | 2018-11-14 | 三菱電機株式会社 | 回路基板 |
| CN109565927A (zh) * | 2017-03-24 | 2019-04-02 | 三菱电机株式会社 | 电路基板 |
| KR102350154B1 (ko) * | 2017-06-09 | 2022-01-11 | 미쓰비시덴키 가부시키가이샤 | 프린트 기판 |
-
2020
- 2020-03-25 JP JP2020557354A patent/JP6843312B1/ja active Active
- 2020-03-25 CN CN202080098806.2A patent/CN115299184B/zh active Active
- 2020-03-25 WO PCT/JP2020/013204 patent/WO2021192073A1/ja not_active Ceased
- 2020-03-25 DE DE112020006584.7T patent/DE112020006584B4/de active Active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2021192073A1 (ja) | 2021-09-30 |
| CN115299184B (zh) | 2023-07-14 |
| CN115299184A (zh) | 2022-11-04 |
| DE112020006584B4 (de) | 2024-01-04 |
| DE112020006584T5 (de) | 2022-11-10 |
| JP6843312B1 (ja) | 2021-03-17 |
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